Porous media heat sink apparatus

• US 20020108743A1
• Filed: 12/11/2000
• Published: 08/15/2002
• Est. Priority Date: 12/11/2000
• Status: Abandoned Application

• Current Assignee: Richard A. Wirtz
• Original Assignee: Richard A. Wirtz
• Inventors: Wirtz, Richard A.
• Application Number:
  US09/734,526
• Publication Number:
  US 20020108743A1
• Time in Patent Office: Days
• US Class Current: 165/185
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: F28F 13/003 by using permeable mass, perforated or porous materials F28F13/18 takes precedence
• CPC Class Codes: H01L 23/3733 having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures H01L23/3732, H01L23/3737 take precedence
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A porous media heat sink usable as a small heat exchange device to air-cool a high power dissipation rate object in a low-noise environment. The heat sink comprises a thermally conductive base, a plurality of thermally conducting fins coupled to the base and oriented substantially normal or perpendicular to the base, and a plurality of thermally conductive porous media elements interleaved between the fins in a serpentine or sinusoidal configuration and arranged with respect to the heat sink base such that the longitudinal axis of the sinusoidal configuration is substantially normal to the base and substantially parallel to the fins. The base of the heat sink is thermally coupled to the component generating heat, typically a microprocessor package, to facilitate heat dissipation.

Claims

1. A heat sink apparatus, comprising:

(a) a thermally conducting base;

(b) a plurality of thermally conducting fins joined to said base and extending outward from said base; and

(c) a plurality of thermally conducting porous media elements positioned between corresponding ones of said plurality of fins.

2. The heat sink apparatus of claim 1, wherein each said porous media element has a serpentine configuration which defines a longitudinal axis, said longitudinal axis extending outward from said base.

3. The heat sink apparatus of claim 2, wherein said plurality of fins are substantially parallel to each other, and said longitudinal axis of each said porous media element is substantially parallel to said plurality of fins.

4. The heat sink apparatus of claim 2, wherein said serpentine configuration defines a plurality of folds and a plurality of interstices in each said porous media element.

5. The heat sink apparatus of claim 1, wherein said thermally conducting fins are tapered in thickness from said thermally conducting base extending upward.

6. The heat sink apparatus of claim 1, wherein said porous media elements are made from a material selected from thermally conducting particles, thermally conducting wire mesh, thermally conducting laminated screen, or thermally conducting foam.

7. The heat sink apparatus of claim 4, wherein adjacent ones of said plurality of folds are oriented with respect to each other by a taper angle 2θ

which is in the range of between approximately eight degrees and twelve degrees of angle.

8. The heat sink apparatus of claim 1, wherein said base is configured to be thermally interfaced with a microelectronic heat source.

9. The heat sink of claim 1, wherein said plurality of fins are oriented substantially perpendicular to said base.

10. A heat sink apparatus, comprising:

(a) a thermally conducting base;

(b) a plurality of thermally conducting fins coupled to said base and extending outward therefrom; and

(c) a plurality of thermally conducting porous media elements interleaved between said plurality of fins, each said porous media element comprising an elongated strip arranged in a sigmoidal configuration.

11. The heat sink apparatus of claim 10, wherein said sigmoidal configuration of said porous media elements defines a plurality of folded segments and a plurality of interstices in said elongated strip of each said porous media element.

12. The heat sink apparatus of claim 11, wherein said plurality of fins are substantially parallel to each other.

13. The heat sink apparatus of claim 10, wherein said sigmoidal configuration of each said porous media element defines a longitudinal axis, said longitudinal axis substantially perpendicular to said base.

14. The heat sink apparatus of claim 10, wherein said thermally conducting fins are tapered in thickness from said thermally conducting base extending upward.

15. The heat sink apparatus of claim 10, wherein said base is configured to be thermally interfaced with a microprocessor.

16. The heat sink apparatus of claim 10, wherein said porous media elements are made from a material selected from thermally conducting particles, thermally conducting wire mesh, thermally conducting laminated screen, or thermally conducting foam.

17. The heat sink apparatus of claim 11, wherein said plurality of folded segments are configured such that adjacent said folded segments are oriented with respect to each other by a taper angle 2θ

which is in the range of between approximately eight degrees and twelve degrees of angle.

19. The heat sink apparatus of claim 18, wherein said plurality of fins are oriented substantially perpendicular to said base.

20. The heat sink apparatus of claim 19, wherein said sinusoidal configuration of each said porous media element defines a longitudinal axis, said longitudinal axis substantially perpendicular to said base.

21. The heat sink apparatus of claim 20, wherein said sinusoidal configuration of each said porous media element defines a lateral axis, said lateral axis perpendicular to said longitudinal axis, said interstices oriented in a direction which is substantially parallel to said lateral axis.

22. The heat sink apparatus of claim 18, wherein said thermally conducting fins are tapered in thickness from said thermally conducting base extending upward.

23. The heat sink apparatus of claim 18, wherein said porous media elements are made from a material selected from thermally conducting particles, thermally conducting wire mesh, thermally conducting laminated screen, or thermally conducting foam.

24. The heat sink apparatus of claim 18, wherein said plurality of folds are configured such that adjacent said folds are oriented with respect to each other by a taper angle 2θ

which is in the range of between approximately eight degrees and twelve degrees of angle.

18. A heat sink apparatus, comprising:

(a) a thermally conducting base;

(b) a plurality of thermally conducting fins coupled to said base, said plurality of fins oriented substantially parallel to each, said plurality of fins defining a corresponding plurality of slots between adjacent said fins, said slots being substantially parallel to each other; and

(c) a plurality of thermally conducting porous media elements, each said porous medial element positioned in a corresponding one of said slots each said porous media element comprising an elongated strip of porous material arranged in a sinusoidal configuration such that said elongated strip includes a plurality of folds separated from each other by a plurality of interstices.