Heat sink for cooling electronic chip

• US 20020109970A1
• Filed: 03/20/2001
• Published: 08/15/2002
• Est. Priority Date: 12/18/2000
• Status: Abandoned Application

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Yang, Si Young, Jun, Hyung Hwan, Kwon, Jae Woong, Oh, Se Min
• Application Number:
  US09/812,798
• Publication Number:
  US 20020109970A1
• Time in Patent Office: Days
• US Class Current: 361/695
• CPC Class Codes: H01L 23/3672 Foil-like cooling fins or heat sinks being part of lead-frames H01L23/49568
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Disclosed is a heat sink for discharging an electronic chip, including a body contacting the surface of the electronic chip at one major surface thereof and received heat emitted from the surface of the electronic chip, the one major surface of the body being flat; a plurality of heat discharge fins formed integrally with the body and adapted to discharge the heat, transferred to the body, to the atmosphere, the heat discharge fins being protruded from the other major surface of the body while being uniformed spaced from one another; and a plurality of corrugated louver fin members each interposed between adjacent ones of the heat discharge fins and formed by repeatedly bending a thin plate member to have a wave shape, each of the corrugated louver fin members having a plurality of louvers adapted to create a turbulent flow of air while varying the direction of the air flow. In accordance with the heat sink, it is possible to obtain a maximum heat conduction cross-sectional area and a maximum convective heat transfer area, thereby achieving a great improvement in heat discharge characteristics.

Claims

1. A heat sink for discharging an electronic chip, comprising:

a body contacting the surface of the electronic chip at one major surface thereof and received heat emitted from the surface of the electronic chip, the one major surface of the body being flat;

a plurality of heat discharge fins formed integrally with the body and adapted to discharge the heat, transferred to the body, to the atmosphere, the heat discharge fins being protruded from the other major surface of the body while being uniformed spaced from one another; and

a plurality of corrugated louver fin members each interposed between adjacent ones of the heat discharge fins and formed by repeatedly bending a thin plate member to have a wave shape, each of the corrugated louver fin members having a plurality of louvers adapted to create a turbulent flow of air while varying the direction of the air flow.

2. The heat sink according to claim 1, wherein each of the heat discharge fins has a thickness of 1.0 to 5.0 mm, and the body has a thickness of 2.0 to 10.0 mm.

3. The heat sink according to claim 1, wherein each of the corrugated louver fin members is arranged in parallel to the direction of the air flow and welded to associated ones of the heat discharge fins in accordance with a brazing method, to generate a minimum resistance of the air flow.

4. The heat sink according to claim 1, further comprising:

a flow guide space defined between the other major surface of the body and an end of an associated one of the corrugated louver fin members facing the other major surface of the body, the flow guide space having a shape selected from the group consisting of a semi-circular shape, a rectangular shape, and a triangular shape, and a hydraulic diameter of 2.0 to 15.0 mm; and

a plurality of fins having various protruded from a portion of the other major surface of the body defined within the flow guide space.

5. The heat sink according to claim 1, wherein each of the corrugated louver fin members is made of an aluminum material coated with a clad material.

6. The heat sink according to claim 1, further comprising:

a pair of hooks protruded from those of the heat discharge fins respectively arranged at opposite lateral edges of the body, each of the hooks having a desired height; and

a fan motor engaged with the hooks so that it is mounted to the body, the fan motor serving to forcibly blow air toward the heat discharge fins and the corrugated louver fin members.

7. The heat sink according to claim 1, wherein each of the corrugated louver fin members has a thickness of 0.1 to 0.5 mm, a shape bent in the form of corrugated fins having a pitch of 1.0 to 5.0 mm to obtain a maximum heat transfer area, and is provided with louvers formed by cutting each of the corrugated fins to form a plurality of uniformly spaced slits, and then bending portions of the corrugated louver fin defined by the slits, respectively, each of the louvers having an angle of 10 to 50°

.

8. The heat sink according to claim 1, wherein the body, the heat discharge fins, and the corrugated louver fin members are made of aluminum or copper.