Defined sacrifical region via ion implantation for micro-opto-electro-mechanical system (MOEMS) applications

• US 20020110948A1
• Filed: 11/12/2001
• Published: 08/15/2002
• Est. Priority Date: 02/14/2001
• Status: Active Grant

• Current Assignee: Intpax Incorporated
• Original Assignee: Intpax Incorporated
• Inventors: Wang, Gaofeng, Huang, Liji, Yao, Yahong, Han, Naiqian
• Granted Patent: US 6,620,712 B2
• Time in Patent Office: Days
• US Class Current: 438/57
• CPC Class Codes: B81B 2201/047 Optical MEMS not provided for in B81B2201/042 - B81B2201/045
• CPC Class Codes: B81B 2203/0127 Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
• CPC Class Codes: B81B 2203/0315 Cavities
• CPC Class Codes: B81C 1/00047 Cavities
• CPC Class Codes: B81C 1/00571 Avoid or control under-cutting
• CPC Class Codes: B81C 2201/0109 Sacrificial layers not provided for in B81C2201/0107 - B81C2201/0108
• CPC Class Codes: B81C 2201/0136 by doping limited material regions

Abstract

The present invention discloses an electro-optical device support on a substrate. The electro-optical device includes a sacrificial layer disposed on the substrate having a chamber-wall region surrounding and defining an optical chamber. The electro-optical device further includes a membrane layer disposed on top of the sacrificial layer having a chamber-removal opening surrounding and defining an electric tunable membrane for transmitting an optical signal therethrough. The electrically tunable membrane disposed on top of the optical chamber surrounded by the chamber wall regions. The chamber-wall region is doped with iondopants for maintaining the chamber-wall region for removal-resistance under a chamber-forming process performed through the chamber-removal opening. In a preferred embodiment, the chamber-wall region is a doped silicon dioxide region with carbon or nitrogen. In another preferred embodiment, the chamber-wall region is a nitrogen ion-doped SiNxOy region. In another preferred embodiment, the optical chamber is an etched chamber formed by etching through the chamber removal opening for etching off an etch-enhanced region surrounded by an etch-resistant region constituting the chamber wall.

Claims

1. An electro-optical device support on a substrate comprising:

a sacrificial layer disposed on said substrate having a chamber-wall region surrounding a chamber region wherein said chamber-wall region and said chamber region are doped with different ion-dopants provided for removing said chamber region and maintaining said chamber-wall region in a chamber forming process; and

a membrane layer disposed on top of said sacrificial layer having a chamber-removal opening surrounding and defining an electric tunable membrane for transmitting an optical signal therethrough wherein said electrically tunable membrane disposed on top of said chamber region surrounded by said chamber wall regions.

2. The electro-optical device of claim 1 further comprising:

an optical chamber disposed underneath said electrically tunable membrane formed by removing said chamber region surrounded by said chamber-wall region.

3. The electro-optical device of claim 1 wherein:

said chamber-wall region in said sacrificial layer is doped with ion-dopants of a first conductivity and said chamber region in said sacrificial layer is doped with ion-dopants of a second conductivity opposite said first conductivity.

4. The electro-optical device of claim 1 wherein:

said chamber-wall region in said sacrificial layer is doped with ion-dopants to produce an etching resist region and said chamber region in said sacrificial layer is doped with ion-dopants to produce an etching enhanced region.

5. The electro-optical device of claim 1 wherein:

said chamber-wall region in said sacrificial layer is doped with a N-type ion-dopants and said chamber region in said sacrificial layer is doped with P-type ion-dopants.

6. The electro-optical device of claim 4 wherein:

said chamber-wall region in said sacrificial layer is doped with a nitrogen ion-dopants.

7. The electro-optical device of claim 4 wherein:

said chamber-wall region in said sacrificial layer is doped with a carbon ion-dopants.

8. The electro-optical device of claim 4 wherein:

said chamber region in said sacrificial layer is doped with phosphorus ion-dopants.

9. The electro-optical device of claim 4 wherein:

said chamber region in said sacrificial layer is doped with phosphorus/boron ion-dopants.

10. The electro-optical device of claim 1 wherein:

said chamber-wall region in said sacrificial layer is doped with a P-type ion-dopants and said chamber region in said sacrificial layer is doped with N-type ion-dopants.

11. The electro-optical device of claim 4 wherein:

said chamber-wall region in said sacrificial layer is doped with phosphorous ion-dopants.

12. The electro-optical device of claim 4 wherein:

said chamber-wall region in said sacrificial layer is doped with phosphorous/boron ion-dopants.

13. The electro-optical device of claim 4 wherein:

said chamber-wall region in said sacrificial layer is doped with nitrogen ion-dopants.

14. The electro-optical device of claim 1 wherein:

said chamber-wall region in said sacrificial layer is doped with carbon ion-dopants.

16. The electro-optical device of claim 15 wherein:

said chamber-wall region is a N-type doped silicon dioxide region.

17. The electro-optical device of claim 15 wherein:

said chamber-wall region is a nitrogen doped silicon dioxide region.

18. The electro-optical device of claim 15 wherein:

said chamber-wall region is a carbon doped silicon dioxide region.

19. The electro-optical device of claim 15 wherein:

said chamber-wall region is a nitrogen ion-doped SiNxOy region.

20. The electro-optical device of claim 15 wherein:

said optical chamber is an etched chamber formed by etching through said chamber removal opening.

15. An electro-optical device support on a substrate comprising:

a sacrificial layer disposed on said substrate having a chamber-wall region surrounding and defining an optical chamber; and

a membrane layer disposed on top of said sacrificial layer having a chamber-removal opening surrounding and defining an electric tunable membrane for transmitting an optical signal therethrough wherein said electrically tunable membrane disposed on top of said optical chamber surrounded by said chamber wall regions wherein said chamber-wall region is doped with ion-dopants for maintaining said chamber-wall region for removal-resistance under a chamber-forming process performed through said chamber-removal opening.

21. A method for manufacturing an electro-optical device support on a substrate comprising:

a) forming a sacrificial layer on said substrate having a chamber-wall region surrounding a chamber region by doping said chamber-wall region and said chamber region with different ion-dopants for removing said chamber region and maintaining said chamber-wall region in a chamber forming process; and

b) forming a membrane layer on top of said sacrificial layer with a chamber-removal opening surrounding for defining an electric tunable membrane on top of said chamber region surrounded by said chamber wall regions for transmitting an optical signal therethrough.

22. The method of claim 21 further comprising:

removing said chamber region surrounded by said chamber-wall region for forming an optical chamber underneath said electrically tunable membrane.

23. The method of claim 21 wherein:

said step of forming said chamber-wall region in said sacrificial layer is a step of doping said chamber-wall region with ion-dopants of a first conductivity and doping said chamber region in said sacrificial layer with ion-dopants of a second conductivity opposite said first conductivity.

24. The method of claim 21 wherein:

said step of forming said chamber-wall region in said sacrificial layer is a step of doping said chamber-wall region with ion-dopants to produce an etching resist region and doping said chamber region in said sacrificial layer with ion-dopants to produce an etching enhanced region.

25. The method of claim 21 wherein:

said step of forming said chamber-wall region in said sacrificial layer is a step of doping said chamber-wall region with a N-type ion-dopants and doping said chamber region in said sacrificial layer with P-type ion-dopants.

26. The method of claim 21 wherein:

said step of forming said chamber-wall region in said sacrificial layer is a step of doping said chamber-wall region with a P-type ion-dopants and doping said chamber region in said sacrificial layer with N-type ion-dopants.