INTEGRATED CIRCUIT WITH UNIFIED INPUT DEVICE, MICROPROCESSOR AND DISPLAY SYSTEMS
First Claim
1. An integrated circuit with a micromechanical element comprising a support substrate supporting a sensor element, a logic circuit and a semiconductor visual display element, the sensor element electrically connected to a logic circuit, and the logic circuit being electrically connected to the semiconductor visual display element.
2 Assignments
0 Petitions
Accused Products
Abstract
An integrated circuit having at least one micromechanical element thereon is described comprising a support substrate, a sensor element electrically connected to a logic circuit, and the logic circuit electrically connected to a semiconductor visual display element.
The integrated circuit may be manufactured by a process which comprises:
a) providing a support substrate,
b) forming at least two elements selected from the group consisting of a micromechanical sensor element, a logic circuit and a semiconductor visual display element on said support, and
c) manufacturing a third element on said support substrate, said third element selected from the group consisting of a micromechanical sensor element, a logic circuit and a semiconductor visual display element which was not provided in step b).
In one embodiment of the process of manufacture, all three of the at least three elements are constructed on the support itself, preferably by microlithographic processes.
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Citations
11 Claims
- 1. An integrated circuit with a micromechanical element comprising a support substrate supporting a sensor element, a logic circuit and a semiconductor visual display element, the sensor element electrically connected to a logic circuit, and the logic circuit being electrically connected to the semiconductor visual display element.
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8. A process for the manufacture of an integrated circuit with a micromechanical element, said integrated circuit comprising a support substrate, and at least three elements on said support comprising a sensor element electrically connected to a logic circuit, and the logic circuit electrically connected to a semiconductor visual display element, said process comprising:
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a) providing a support substrate, b) forming at least two elements selected from the group consisting of a micromechanical sensor element, a logic circuit and a semiconductor visual display element on said support, and c) manufacturing a third element on said support substrate, said third element selected from the group consisting of a micromechanical sensor element, a logic circuit and a semiconductor visual display element which was not provided in step b). - View Dependent Claims (9, 10, 11)
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Specification