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Bonded wafer optical MEMS process

  • US 20020117728A1
  • Filed: 08/03/2001
  • Published: 08/29/2002
  • Est. Priority Date: 08/03/2000
  • Status: Active Grant
First Claim
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1. A method of fabricating a microelectromechanical system, said method comprising:

  • providing a substrate comprising a handle layer of silicon, a device layer of silicon and a sacrificial layer of silicon disposed between said handle layer and said device layer;

    forming a micromechanical structure in said device layer; and

    removing at least a portion of said sacrificial layer of silicon underlying said micromechanical structure to release said micromechanical structure for movement

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