×

Surface mountable chip type semiconductor device and manufacturing method

  • US 20020117762A1
  • Filed: 02/25/2002
  • Published: 08/29/2002
  • Est. Priority Date: 02/27/2001
  • Status: Active Grant
First Claim
Patent Images

1. A chip type semiconductor device comprising:

  • an insulating substrate;

    first and second conductive land areas which are formed on said insulating substrate and which are electrically coupled with each other;

    a conductive post formed on said first conductive land area;

    a semiconductor pellet which has electrodes on both sides thereof and which is mounted on said second conductive land area, said electrode on one side of said semiconductor pellet being coupled onto said second conductive land area and said electrode on the other side of said semiconductor pellet having an external electrode electrically coupled thereto; and

    encapsulation resin portion which encapsulates a main area of said insulating substrate including said conductive post and said semiconductor pellet, wherein top portions of said conductive post and said external electrode electrically coupled to said semiconductor pellet being exposed from said encapsulation resin portion.

View all claims
  • 3 Assignments
Timeline View
Assignment View
    ×
    ×