Wafer probe station
First Claim
1. A chuck apparatus for a wafer probe station, comprising:
- a laterally extending electrical insulator having an upper surface;
a first conductive member disposed on the upper surface of said insulator for supporting a wafer device under test, said insulator supported on a second conductive member, the outer edge of the first conductive member being spaced from the outer edge of the insulator;
a third conductive member isolated from and spaced below said second conductive member; and
an electrically isolated fourth conductive member disposed on the upper surface of said insulator in spaced relation to the outer edge of said first conductive member.
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Accused Products
Abstract
The invention relates to a chuck apparatus for a wafer probe station in which the central conductive surface supports a device-under-test (DUT) over a conductive lower chuck portion. An insulator positions the center conductor surface of the chuck above the lower chuck portion and also positions an electrically isolated conductor along its periphery. A laterally extending shielding element is provided for shielding electromagnetic interference (ENI) from the center conductor surface and the lower chuck portion. The electrically isolated conductor and the conductive lower chuck portion max cooperate to form a line-of-sight electrical barrier between the center conductor surface and the laterally extending shielding element. The invention further relates to methods of manufacturing the chuck apparatus and using the apparatus to accomplish low current and voltage tests in a probe station.
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Citations
37 Claims
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1. A chuck apparatus for a wafer probe station, comprising:
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a laterally extending electrical insulator having an upper surface;
a first conductive member disposed on the upper surface of said insulator for supporting a wafer device under test, said insulator supported on a second conductive member, the outer edge of the first conductive member being spaced from the outer edge of the insulator;
a third conductive member isolated from and spaced below said second conductive member; and
an electrically isolated fourth conductive member disposed on the upper surface of said insulator in spaced relation to the outer edge of said first conductive member. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 26, 27, 28, 29)
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25. A method for inspecting a device under test in a probe station, the method comprising:
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providing a chuck apparatus for supporting the device under test, the chuck apparatus comprising;
a laterally extending insulator having an upper surface, a first conductive element disposed on said upper surface of said insulator adapted for electrical contact with said device under test, a laterally extending second conductive element disposed belong said insulator, a laterally extending third conductive element disposed below and electrically isolated from said second conductive element and having a portion at its periphery extending vertically opposite the sides of said second conductive element and a fourth conductive element disposed on said insulator, said fourth conductive element laterally surrounding and electrically isolated from said first conductive element;
applying an electric potential to said first conductive element and to at least one of said second, third and fourth conductive elements.
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30. A method of manufacturing a chuck apparatus for a wafer probe station, the method comprising:
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depositing a first amount of conductive material on an insulator plate comprising an electrical insulator material to form a conductive test area;
depositing a second amount of conductive material on the insulator plate spaced from and laterally surrounding the conductive test area to form an electrically isolated conductive element, supporting said insulator plate on a conductive support, attaching and electrically isolating a further conductor spaced below, said conductive support, and adapting the conductive test area, isolated conductive element, conductive support, and further conductor for being coupled to electrical potentials. - View Dependent Claims (31, 32, 33, 34, 35)
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36. A probe station for inspecting a device under test comprising:
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a frame having, opposite vertically disposed supports, a horizontally extending platen supported on said frame a chuck apparatus for supporting the device under test positioned as within said frame, and a holder supported on said platen for holding a probe for contacting said device under test, said chuck apparatus further comprising;
a laterally extending electrical insulator having an upper surface;
a first conductive member disposed on the upper surface of said insulator for supporting a wafer device under test, said insulator supported on a second conductive member, the outer edge of the first conductive member being spaced from the outer edge of the insulator;
a third conductive member isolated from and spaced below said second conductive member; and
an electrically isolated fourth conductive member disposed on the upper surface of said insulator in spaced relation to the outer edge of said first conductive member.
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37. A chuck apparatus for a wafer probe station, comprising:
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a laterally extending electrical insulator having an upper surface;
a first conductive member disposed on the upper surface of said insulator for supporting a wafer device under test;
said insulator supported on a second conductive member; and
a third conductive member isolated from said second conductive member and having a laterally extending portion spaced below said second conductive element and a vertically extending sidewall terminating opposite said second conductive member.
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Specification