High-temperature detector and method of producing the same

• US 20020118093A1
• Filed: 01/30/2002
• Published: 08/29/2002
• Est. Priority Date: 08/05/1999
• Status: Active Grant

• Current Assignee: Borgwarner BERU Systems GmbH (BorgWarner Incorporated)
• Original Assignee: Georg Bernitz, Heinrich Zitzmann
• Inventors: Zitzmann, Heinrich, Bernitz, Georg
• Granted Patent: US 6,686,828 B2
• Time in Patent Office: Days
• US Class Current: 338/25
• CPC Class Codes: G01K 7/183 characterised by the use of the resistive element
• CPC Class Codes: H01C 3/04 Iron-filament ballast resistors; Other resistors having variable temperature coefficient
• CPC Class Codes: H01C 3/12 lying in one plane
• CPC Class Codes: Y10T 29/49085 Thermally variable

Abstract

A high-temperature detector comprises a temperature sensor comprising a high-temperature measuring element, a first connection and a second connection which are made of a high-temperature-stable material and which are connected to the measuring element. The high-temperature sensor is arranged in an elongate housing adjacent a first end thereof, and the housing comprises a first and a second conductor track produced from a high-temperature-stable material, the conductor tracks being connected to the first and second connections and extending in the direction of a second end of the housing. Furthermore, a connection point is provided, which is used for tapping a signal produced by the high-temperature sensor and which is arranged adjacent the second end of the housing. In order to produce such a device, the sensor is first provided and subsequently arranged in an opening of a first substrate adjacent a first end of the substrate. Following this, a second and a third ceramic substrate are fused with the first ceramic substrate so that the conductor tracks arranged in the second and third ceramic substrates are connected to the connections of the sensor, the conductor tracks extending to a respective second end of the second and third ceramic substrates.

Claims

1. A hybrid high-temperature detector comprising:

a high-temperature sensor comprising a high-temperature measuring film, a first connection made of a high-temperature-stable material and a second connection made of a high-temperature-stable material, the connections being connected to the high-temperature measuring film;

an elongate housing comprising a first elongate ceramic substrate, a second elongate ceramic substrate and a third elongate ceramic substrate, the elongate ceramic substrates being interconnected, the first elongate ceramic substrate being arranged between the second elongate ceramic substrate and the third elongate ceramic substrate and including a through-hole which is located adjacent a first end of the housing and in which the high-temperature sensor is arranged, the second and third ceramic substrates being arranged such that the hole in the first ceramic substrate is fully covered;

a first conductor track consisting of a high-temperature-stable material on the second elongate ceramic substrate, the first conductor track being connected to the first connection of the high-temperature sensor and extending in the direction of a second end of the housing;

a second conductor track consisting of a high-temperature-stable material on the third elongate ceramic substrate, the second conductor track being connected to the second connection of the high-temperature sensor and extending in the direction of a second end of the housing; and

a connection point located adjacent the second end of the housing and adapted to have connected thereto electric leads via a non-high-temperature-stable material, a signal produced by the high-temperature sensor being adapted to be tapped via the connection point.

2. A hybrid high-temperature detector according to claim 1, wherein the high-temperature measuring film is a patterned film made of a high-temperature-stable material, the first connection, the second connection and the patterned film being produced from the same high-temperature-stable material and being formed on a ceramic substrate.

3. A hybrid high-temperature detector according to claim 2, wherein the first and second conductor tracks are produced from the same high-temperature-stable material that has been used for producing the first connection, the second connection and the patterned film.

4. A hybrid high-temperature detector according to claim 1, wherein the first conductor track is arranged on a first surface of the second elongate ceramic substrate, which faces the first ceramic substrate, the first conductor track being connected via a through-contacting means, which is located adjacent the second end, to a first connecting area of the connection point on a second surface of the second elongate ceramic substrate;

and

the second conductor track is arranged on a first surface of the third elongate ceramic substrate, which faces the first ceramic substrate, the second conductor track being connected via a through-contacting means, which is located adjacent the second end, to a second connecting area of the connection point on a second surface of the third elongate ceramic substrate.

5. A hybrid high-temperature detector according to claim 1, comprising:

a thermal shield on the housing, the thermal shield being arranged at a position between a first and a second end of the housing.

6. A hybrid high-temperature detector according to claim 5, wherein the thermal shield is made of a metal or of a ceramic material.

7. A hybrid high-temperature detector according to claim 1, wherein the high-temperature-stable material is platinum.

8. A method of producing a hybrid high-temperature detector comprising the following steps:

a) providing a high-temperature sensor comprising a high-temperature measuring film, a first connection made of a high-temperature-stable material and a second connection made of a high-temperature-stable material, the first and second connections being connected to the high-temperature measuring film;

b) arranging the high-temperature sensor in a through-hole of a first ceramic substrate, the through-hole being arranged adjacent a first end of the first ceramic substrate;

c) fusing the first ceramic substrate with a second ceramic substrate so that a conductor track arranged on the second ceramic substrate is connected to the first connection of the high-temperature sensor at a first end of the second ceramic substrate, the conductor track extending to a second end of the second ceramic substrate;

d) fusing the first ceramic substrate to a third ceramic substrate so that a conductor track arranged on the third ceramic substrate is connected to the second connection of the high-temperature sensor at a first end of the third ceramic substrate, the conductor track extending to a second end of the third ceramic substrate; and

e) applying a first connecting area to the second elongate ceramic substrate and a second connecting area to the third elongate ceramic substrate for connecting electric leads via a non-high-temperature-stable material so as to tap a signal produced by the high-temperature sensor.

9. A method according to claim 8 comprising the following step:

contacting the first and second conductor tracks with first and second connecting areas arranged adjacent the respective second end of the second and third ceramic substrates.

10. A method according to claim 8 comprising the following step:

arranging a thermal partition on the housing obtained by fusing the first, second and third ceramic substrates, the thermal partition being arranged at a position between a first and a second end of the housing.