Heat dissipation device

• US 20020118511A1
• Filed: 02/28/2001
• Published: 08/29/2002
• Est. Priority Date: 02/28/2001
• Status: Active Application

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Searls, Damion T., Dishongh, Terrance J., Lian, Bin, Dujari, Prateek J.
• Application Number:
  US09/796,809
• Publication Number:
  US 20020118511A1
• Time in Patent Office: Days
• US Class Current: 361/703
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28F 2215/06 Hollow fins; fins with internal circuits
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A heat dissipation device comprising a base portion, having a chamber defined therein, and a plurality of projections extending from the base portion. At least one projection of the plurality of projections also has a chamber defined therein that is in fluid communication with the base portion chamber to form a vapor chamber of a heat pipe.

Claims

1. A heat dissipation device, comprising:

a base portion having at least one chamber defined therein;

a plurality of projections extending from said base portion, at least one of said plurality of projections having at least one chamber defined therein; and

said base portion chamber and said at least one projection chamber adapted to be in fluid communication with one another to form a vapor chamber.

2. The heat dissipation device of claim 1, further including a working fluid disposed within said vapor chamber.

3. The heat dissipation device of claim 1, wherein said plurality of projections comprise a plurality of pillars.

4. The heat dissipation device of claim 1, wherein said plurality of projections comprise a plurality of fins.

5. The heat dissipation device of claim 1, wherein said plurality of projections comprise a plurality of folded-fin projections.

6. The heat dissipation device of claim 1, wherein said base portion and said plurality of projections comprise a metal.

7. A microelectronic assembly, comprising:

a microelectronic die having a back surface; and

a heat dissipation device attached to said microelectronic die back surface, comprising;

a base portion having at least one chamber defined therein;

a plurality of projections extending from said base portion, at least one of said plurality of projections having a chamber defined therein; and

said base portion chamber and said at least one projection chamber adapted to be in fluid communication with one another to form a vapor chamber.

8. The microelectronic assembly of claim 7, further including a working fluid disposed within said vapor chamber.

9. The microelectronic assembly of claim 7, wherein said plurality of projections comprise a plurality of pillars.

10. The microelectronic assembly of claim 7, wherein said plurality of projections comprise a plurality of fins.

11. The microelectronic assembly of claim 7, wherein said plurality of projections comprise a plurality of folded-fin projections.

12. The microelectronic assembly of claim 7, wherein said base portion and said plurality of projections comprise a metal.

14. The method of claim 13, further including disposing a working fluid within said base portion chamber.

15. The method of claim 13, wherein forming said plurality of projections comprises forming a plurality of pillars.

16. The method of claim 13, wherein forming said plurality of projections comprises forming a plurality of fins.

18. The method of claim 17, further including disposing a working fluid within said vapor chamber.

19. The method of claim 17, wherein said forming a plurality of folded-fin projections comprises folding a flat stock metal sheet to form a plurality of folded-fin projections.

20. The method of claim 17, wherein said forming a plurality of folded-fin projections comprises folding a flat stock conductive, thermal plastic sheet to form a plurality of folded-fin projections.

13. A method of forming a heat dissipation device, comprising:

forming a heat dissipation device base portion having at least one chamber defined therein;

forming a plurality of projections extending from said base portion;

drilling a hole in at least one of said plurality of projections, wherein said hole extends from a first surface to said at least one base portion chamber; and

capping said hole proximate said projection first surface.

17. A method of forming a heat dissipation device, comprising:

forming a heat dissipation device base portion having at least one recess defined therein;

forming a plurality of folded-fin projections;

attaching said folded-fin projections to said base portion; and

sealing said folded-fin projections to form a vapor chamber from said base portion recess and said sealed folded-fin projections.