Substrate layout method and structure for reducing cross talk of adjacent signals
First Claim
1. A substrate layout method for reducing cross talk of adjacent signals, the substrate having a plurality of signal pads formed on a die, a ring around said die, and a plurality of signal fingers around said ring, the substrate layout method comprising:
- forming a guard pad between two adjacent signal pads;
forming a guard finger between two adjacent signal fingers;
forming a first bonding wire to connect said guard pad to said ring;
forming a second bonding wire to connect said ring to said guard finger; and
forming a guard trace to connect said guard finger to a via at the edge of the substrate, and connecting said guard trace to a short-circuiting place through said via.
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Accused Products
Abstract
The invention provides a substrate layout method and structure of a ball grid array to reduce cross talk of adjacent signals. The substrate comprises a plurality of signal pads formed on a die, a ring around the die, and a plurality of signal fingers around the ring. The substrate layout method for reducing cross talk of adjacent signals is as follows: First, forming a guard pad between two adjacent signal pads. Second, forming a guard finger between two adjacent signal fingers. Next, forming a bonding wire to connect the guard pad to the ring. Then, forming another bonding wire to connect the ring to the guard finger. Subsequently, forming a guard trace to connect the guard finger to a via at the edge of the substrate, and connecting the guard trace to a short-circuiting place through the via.
87 Citations
20 Claims
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1. A substrate layout method for reducing cross talk of adjacent signals, the substrate having a plurality of signal pads formed on a die, a ring around said die, and a plurality of signal fingers around said ring, the substrate layout method comprising:
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forming a guard pad between two adjacent signal pads;
forming a guard finger between two adjacent signal fingers;
forming a first bonding wire to connect said guard pad to said ring;
forming a second bonding wire to connect said ring to said guard finger; and
forming a guard trace to connect said guard finger to a via at the edge of the substrate, and connecting said guard trace to a short-circuiting place through said via. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A substrate layout structure for reducing cross talk of adjacent signals, the substrate having a plurality of signal pads formed on a die, a ring around said die, and a plurality of signal fingers around said ring, the substrate layout structure comprising:
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a guard pad formed between two adjacent signal pads;
a guard finger formed between two adjacent signal fingers;
a first bonding wire for connecting said guard pad to said ring;
a second bonding wire for connecting said ring to said guard finger; and
a guard trace for connecting said guard finger to a via at the edge of the substrate, and connecting said guard trace to a short-circuiting place through said via. - View Dependent Claims (8, 9, 10, 11, 12, 14, 15, 16, 18, 19, 20)
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13. A substrate layout method for reducing cross talk of adjacent signals, the substrate having a plurality of signal pads formed on a die, a ring around said die, and a plurality of signal fingers around said ring, the substrate layout method comprising:
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forming a guard finger between two adjacent signal fingers;
forming a bonding wire to connect said ring to said guard finger; and
forming a guard trace to connect said guard finger to a via at the edge of the substrate, and connecting said guard trace to a short-circuiting place through said via.
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17. A substrate layout structure for reducing cross talk of adjacent signals, the substrate having a plurality of signal pads formed on a die, a ring around said die, and a plurality of signal fingers around said ring, the substrate layout structure comprising:
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a guard finger formed between two adjacent signal fingers;
a bonding wire for connecting said ring to said guard finger; and
a guard trace for connecting said guard finger to a via at the edge of the substrate, and connecting said guard trace to a short-circuiting place through said via.
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Specification