Chemical microreactor and microreactor made by process

• US 20020119079A1
• Filed: 04/22/2002
• Published: 08/29/2002
• Est. Priority Date: 12/10/1999
• Status: Abandoned Application

• Current Assignee: Heinrich Meyer, Norbert Breuer
• Original Assignee: Heinrich Meyer, Norbert Breuer
• Inventors: Breuer, Norbert, Meyer, Heinrich
• Application Number:
  US10/127,709
• Publication Number:
  US 20020119079A1
• Time in Patent Office: Days
• US Class Current: 422/128
• CPC Class Codes: B01J 19/0093 Microreactors, e.g. miniaturised or microfabricated reactors laboratory containers with capillary fluid transport in microfabricated channels or chambers B01L3/5027
• CPC Class Codes: B01J 2219/00783 Laminate assemblies, i.e. the reactor comprising a stack of plates
• CPC Class Codes: B01J 2219/00822 Metal
• CPC Class Codes: B01J 2219/00828 Silicon wafers or plates
• CPC Class Codes: B01J 2219/00831 Glass
• CPC Class Codes: B01J 2219/00835 Comprising catalytically active material
• CPC Class Codes: B01J 2219/00873 Heat exchange
• CPC Class Codes: B01J 2219/0097 Optical sensors
• CPC Class Codes: B29D 30/08 Building tyres
• CPC Class Codes: F28F 2260/02 having microchannels

Abstract

Chemical microreators for chemical systhesis and their methods of manufacture are known, but have disadvantages such as extremely high manufacturing costs or poor flexibility for adaptation to various cases of application. These disadvantages are avoided by means of the microreators and manufacturing methods according to the invention. The microreators are characterized in that the reactors contain fluid ducts in at least one plane as well as feed and return lines for fluids, wherein the fluid ducts are defined by side walls of metal opposing each other and further side walls of metal or plastic extending between said side walls, and in which the planes are connected together and/or with a closure segment closing open fluid ducts by means of appropriate solder or adhesive layers. The manufacturing method is characterized by process sequences in which the individual reactor planes produced by means of electrolytic methods, are connected together by soldering or gluing.

Claims

1. Manufacturing process for chemical microreactors, including at least one substrate with fluid ducts as well as feeding and drain conducts for fluids without using plastic moulding techniques comprising the following steps of:

a.) forming fluid duct structures on metal surfaces located on the substrate by means of a photoresist layer or of a screen-printed varnish layer, so that the metal surfaces are partly covered by the layer;

b.) at least partial electroless and/or electrochemical etching-off the metal from the exposed surfaces of the substrate;

c.) total removal of the photoresist layer or screen-printed varnish layer;

d.) forming adhesive and/or solder layers;

e.) superimposing the substrates and a closure segment closing the fluid ducts, and interconnecting the substrates and the closure segment by gluing and/or soldering.

4. Method according to any one of claims 1 to 3 characterized in that in step a.) the substrate is coated with a photoresist layer, ehereinthe photoresist layer is exposed with a positive or negative image of the fluid duct structure, and is subsequently developed.

5. Method according to any one of the preceding claims characterized in that a substrate with surfaces consisting of at least a metal selected from the group consisting of steel, stainless steel, copper, nickel and aluminium, is used.

9. Method according to any one of the preceding claims, characterized in that passages are formed inside the substrates.

10. Method according to any one of the preceding claims, characterized in that after superimposing and interconnecting the substrates the surfaces of the fluid ducts are modified by at least a method, selected from the group consisting of metal deposition, metal etching and absorbing of chemical compounds or of other chemical species.

11. Method according to claim 10, characterized in that the surfaces of the fluid ducts are modified by further deposition of a palladium, platinium, rhodium, irdium, ruthenium layers and/or a layer of allö

ys of such metals and/or a nickel/phosphorus alloy layer as a corrosion layer or to form catalytic layers.

12. Method according to any one of the preceding claims, characterized in that valves and/or other actors are formed in the reactors by application of ferromagnetic metal layers.

13. Method according to any one of the preceding claims, characterized in that sensors for measuring properties of flowing fluids and/or electrical lines are formed in the reactors.

14. Method according to any one of the preceding claims, characterized in that electrical resistive heating systems and/or cooling elements are formed in the reactors.

15. Method according to any one of the preceding claims, characterized in that in in individual layers of the microreactor consisting of a plurality of substrates, the metal is totally removed in defined areas by etching-off in order to form translucent windows.

17. Microreactor according to claim 16, characterized in that the side walls are formed from at least a metal, selected from the group consisting of steel, stainless steel, copper, nickel and aluminium.

2. Manufacturing process for chemical microreactors, including at least one substrate with fluid ducts as well as feeding and drain conducts for fluids without using plastic moulding techniques comprising the following steps of:

a.) forming fluid duct structures on metal surfaces located on the substrate by means of a photoresist layer or of a screen-printed varnish layer, so that the metal surfaces are partly covered by the layer;

b.) electroless and/or electrochemical deposition of a metal layer on the exposed surfaces of the substrate;

c.) total removal of the photoresist layer or screen-printed varnish layer;

d.) at least partial electroless and/or electrochemical etching-off the metal of the substrate by forming fluid ducts;

e.) forming of adhesive and/or solder layers;

f.) superimposing the substrates and a closure segment closing the fluid ducts, and interconnecting the substrates and the closure segment by gluing and/or soldering.

6. Method according to claim 2 characterized in that in step b.) at least a metal selected from the group consisting of tin, lead, nickel, cobalt, bismuth, silver, gold and an alloy of these metals, is applied in an electroless and/or electrochemical manner.

7. Method according to claim 6, characterized in that the substrates are interconnected by soldering connection the tin, lead, bismuth or the alloy layer, to the metal under the action of heat.

8. Method according to any one of claims 6 or 7, characterized in that in step b.) A tin layer is applied to one side of the substrates and a bismuth layer is applied to the other side of the substrates, and in that the substrates are placed upon one another such that the tin and bismuth layers lie one above the other and are subsequently be soldered together.

3. Manufacturing method for chemical microreactors, including at least one substrate with fluid ducts as well as feeding and drain conducts for fluids without using plastic moulding techniques comprising the following process steps of:

a.) forming fluid duct structures on the substrate by means of a photoresist layer or a screen-printed varnish layer, so that the substrate surfaces are partly covered by the layer;

b.) depositing a metal layer on the exposed surfaces of the substrate;

c.) total removal of the photoresist layer or screen-printed varnish layer;

d.) forming adhesive and/or solder layers;

e.) superimposing the substrates and a closure segment closing the fluid ducts and interconnecting the substrates and the closure segment by gluing and/or soldering.

16. Chemical microreactor with fluid ducts in at least one plane as well as feeding and drain conducts for fluids, in which the fluid ducts are defined by side walls of metal opposing each other and by further side walls of metal or plastic extending between said side walls, characterized in that the planes are connected together and/or with a closure segment closing open fluid ducts by means of appropriate solder and/or adhesive layers.

18. Microreactor according to any one of claims 16 and 17, characterized in that metal alloys containing metals, selected from the group consisting of tin, lead, bismuth, antimony and silver, are contained as solder layers.

19. Microreactor according to any one of claims 16 to 18, characterized in that the side walls are coated with functional layers forcatalysis and/or for corrosion protection.

20. Use of the microreactor according to any one of claims 16 to 19 for producing toxic, unstable or explosive chemical products, particularly of cyanogen chloride, phosgene, ethylene oxide, selenium compounds, mercaptanes, methylchloride, methyliodide, dimethylsulphate, vinylchloride and phosphines.