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Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods

  • US 20020123213A1
  • Filed: 03/28/2002
  • Published: 09/05/2002
  • Est. Priority Date: 02/24/2000
  • Status: Active Grant
First Claim
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1. A method for bonding a conductive element to a contact of a semiconductor device component, comprising:

  • providing a semiconductor device component with at least one contact;

    defining a first layer of at least one conductive element from a layer comprising substantially unconsolidated conductive material;

    defining at least one other layer of said at least one conductive element from at least one layer comprising substantially unconsolidated conductive material; and

    permitting said conductive material to at least partially consolidate.

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