Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods

• US 20020123213A1
• Filed: 03/28/2002
• Published: 09/05/2002
• Est. Priority Date: 02/24/2000
• Status: Active Grant

• Current Assignee: Vernon M. Williams
• Original Assignee: Vernon M. Williams
• Inventors: Williams, Vernon M.
• Granted Patent: US 6,632,732 B2
• Time in Patent Office: Days
• US Class Current: 438/597
• CPC Class Codes: B33Y 10/00 Processes of additive manufacturing
• CPC Class Codes: B33Y 30/00 Apparatus for additive manufacturing; Details thereof or accessories therefor
• CPC Class Codes: B33Y 70/00 Materials specially adapted for additive manufacturing
• CPC Class Codes: B33Y 80/00 Products made by additive manufacturing
• CPC Class Codes: H01L 21/4857 Multilayer substrates multilayer metallisation on monolayer substrate H01L21/4846
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/24051 Conformal with the semiconductor or solid-state device
• CPC Class Codes: H01L 2224/24101 Connecting bonding areas at the same height
• CPC Class Codes: H01L 2224/24137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/24226 the HDI interconnect connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the item being planar
• CPC Class Codes: H01L 2224/24227 the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/76155 Jetting means, e.g. ink jet
• CPC Class Codes: H01L 2224/82102 using jetting, e.g. ink jet
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/4952 the additional leads being a bump or a wire
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 24/11 Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/12 : Structure, shape, material or disposition of the bump connectors prior to the connecting process
• CPC Class Codes: H01L 24/24 : of an individual high density interconnect connector
• CPC Class Codes: H01L 24/25 : of a plurality of high density interconnect connectors
• CPC Class Codes: H01L 24/76 : Apparatus for connecting with build-up interconnects
• CPC Class Codes: H01L 24/82 : by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 25/0655 : the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01024 : Chromium [Cr]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/15173 : in a single layer of the multilayer substrate
• CPC Class Codes: H01L 2924/351 : Thermal stress
• CPC Class Codes: H05K 2203/0514 : Photodevelopable thick film, e.g. conductive or insulating paste
• CPC Class Codes: H05K 2203/107 : Using laser light
• CPC Class Codes: H05K 2203/1469 : Circuit made after mounting or encapsulation of the components
• CPC Class Codes: H05K 3/0023 : by exposure and development of a photosensitive insulating layer
• CPC Class Codes: H05K 3/02 : in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
• CPC Class Codes: H05K 3/32 : electrically connecting electric components or wires to printed circuits
• CPC Class Codes: H05K 3/321 : by conductive adhesives
• CPC Class Codes: H05K 3/4664 : Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders H05K3/4647 takes precedence
• CPC Class Codes: Y02P 80/30 : Reducing waste in manufacturing processes; Calculations of released waste quantities
• CPC Class Codes: Y10T 29/49117 : Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/49128 : Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base

Abstract

Stereolithographically fabricated conductive elements and semiconductor device components and assemblies including these conductive elements. The conductive elements may include multiple superimposed, contiguous, mutually adhered layers of a conductive material, such as a thermoplastic conductive elastomer or a metal. In semiconductor device assemblies, the stereolithographically fabricated conductive elements may electrically connect semiconductor device components to one another. The conductive elements may alternatively comprise conductive traces or vias of circuit boards or interposers. A stereolithographic method for fabricating the conductive elements may include use of a machine vision system with at least one camera operably associated with a computer controlling a stereolithographic application of material so that the system may recognize the position, orientation, and features of a semiconductor device assembly, semiconductor die, or other substrate on which the conductive element is to be fabricated.

Claims

1. A method for bonding a conductive element to a contact of a semiconductor device component, comprising:

providing a semiconductor device component with at least one contact;

defining a first layer of at least one conductive element from a layer comprising substantially unconsolidated conductive material;

defining at least one other layer of said at least one conductive element from at least one layer comprising substantially unconsolidated conductive material; and

permitting said conductive material to at least partially consolidate.

2. The method of claim 1, wherein said providing said semiconductor device component comprises providing a carrier substrate.

3. The method of claim 1, wherein said providing said semiconductor device component comprises providing a semiconductor die.

4. The method of claim 1, wherein said providing said semiconductor device component comprises providing a packaged semiconductor device.

5. The method of claim 1, wherein said defining said first layer and said defining said at least one other layer comprise defining said first layer and said at least one other layer from an at least partially liquified thermoplastic conductive elastomer.

6. The method of claim 1, wherein said defining said first layer and said defining said at least one other layer comprise defining said first layer and said at least one other layer from an at least partially uncured conductive photopolymer.

7. The method of claim 1, wherein said defining said first layer and said defining said at least one other layer comprise defining said first layer and said at least one other layer from metal.

8. The method of claim 1, wherein said permitting said conductive material to at least partially consolidate comprises permitting said conductive material to at least partially harden.

9. The method of claim 1, wherein said permitting said conductive material to at least partially consolidate comprises selectively consolidating said conductive material in selected regions of each of said first layer and said at least one other layer.

10. The method of claim 9, wherein said permitting said conductive material to at least partially consolidate comprises directing a laser beam onto said selected regions.

11. A method for bonding a conductive element to a contact of a semiconductor device component, comprising:

providing a semiconductor device component with at least one contact;

stereolithographically defining at least one layer of at least one conductive element from at least one corresponding layer of substantially unconsolidated conductive material.

12. The method of claim 11, wherein said providing said semiconductor device component comprises providing a carrier substrate.

13. The method of claim 11, wherein said providing said semiconductor device component comprises providing a semiconductor die.

14. The method of claim 11, wherein said providing said semiconductor device component comprises providing a packaged semiconductor device.

15. The method of claim 11, wherein said stereolithographically defining said at least one layer comprises defining said at least one layer from an at least partially liquified thermoplastic conductive elastomer.

16. The method of claim 11, wherein said stereolithographically defining said at least one layer comprises defining said at least one layer from an at least partially uncured conductive photopolymer.

17. The method of claim 11, wherein said stereolithographically defining said at least one layer comprises defining said at least one layer from metal.

18. The method of claim 11, wherein said stereolithographically defining comprises at least partially consolidating said conductive material.

19. The method of claim 11, wherein said stereolithographically defining comprises selectively consolidating said conductive material in selected regions of said at least one corresponding layer of substantially unconsolidated conductive material.

20. The method of claim 19, wherein said selectively consolidating comprises directing a laser beam onto said selected regions.