Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods
First Claim
1. A method for bonding a conductive element to a contact of a semiconductor device component, comprising:
- providing a semiconductor device component with at least one contact;
defining a first layer of at least one conductive element from a layer comprising substantially unconsolidated conductive material;
defining at least one other layer of said at least one conductive element from at least one layer comprising substantially unconsolidated conductive material; and
permitting said conductive material to at least partially consolidate.
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Accused Products
Abstract
Stereolithographically fabricated conductive elements and semiconductor device components and assemblies including these conductive elements. The conductive elements may include multiple superimposed, contiguous, mutually adhered layers of a conductive material, such as a thermoplastic conductive elastomer or a metal. In semiconductor device assemblies, the stereolithographically fabricated conductive elements may electrically connect semiconductor device components to one another. The conductive elements may alternatively comprise conductive traces or vias of circuit boards or interposers. A stereolithographic method for fabricating the conductive elements may include use of a machine vision system with at least one camera operably associated with a computer controlling a stereolithographic application of material so that the system may recognize the position, orientation, and features of a semiconductor device assembly, semiconductor die, or other substrate on which the conductive element is to be fabricated.
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Citations
20 Claims
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1. A method for bonding a conductive element to a contact of a semiconductor device component, comprising:
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providing a semiconductor device component with at least one contact;
defining a first layer of at least one conductive element from a layer comprising substantially unconsolidated conductive material;
defining at least one other layer of said at least one conductive element from at least one layer comprising substantially unconsolidated conductive material; and
permitting said conductive material to at least partially consolidate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method for bonding a conductive element to a contact of a semiconductor device component, comprising:
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providing a semiconductor device component with at least one contact;
stereolithographically defining at least one layer of at least one conductive element from at least one corresponding layer of substantially unconsolidated conductive material. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification