Semiconductor light emitting device and method of producing the same

• US 20020125494A1
• Filed: 01/31/2002
• Published: 09/12/2002
• Est. Priority Date: 02/02/2001
• Status: Abandoned Application

• Current Assignee: ROHM Co., Ltd.
• Original Assignee: ROHM Co., Ltd.
• Inventors: Isokawa, Shinji
• Application Number:
  US10/059,243
• Publication Number:
  US 20020125494A1
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/54 having a particular shape

Abstract

A semiconductor light emitting device including a lead terminal having an element mount section, a semiconductor light emitting chip mounted on the element mount section, and a first resin formed by molding so as to cover the semiconductor light emitting chip and the element mount section. A second resin may be additionally provided so as to cover the outside of the first resin. The first resin includes a resin material with a fluorescent substance dispersed therein.

Claims

1. A semiconductor light emitting device comprising:

a lead terminal having an element mount section;

a semiconductor light emitting chip mounted on the element mount section; and

a first resin formed by molding a resin material with a fluorescent substance dispersed therein so as to cover the semiconductor light emitting chip and the element mount section.

2. A semiconductor light emitting device as claimed in claim 1, further comprising a second resin covering an outside of the first resin.

3. A semiconductor light emitting device as claimed in claim 1, in which the semiconductor light emitting device is disposed substantially in a center of the first resin.

4. A semiconductor light emitting device as claimed in claim 1, further comprising another lead terminal connected to the semiconductor light emitting chip by a bonding wire, in which

the first resin is formed so as to cover a part of said another lead terminal.

5. A semiconductor light emitting device as claimed in claim 1, in which the first resin is formed in a cylindrical shape.

6. A semiconductor light emitting device as claimed in claim 1, in which an emission color of the semiconductor light emitting chip is blue and the fluorescent substance emits yellow fluorescent light.

7. A method of producing a semiconductor light emitting device comprising steps of:

mounting a semiconductor light emitting chip on an element mount section of a lead terminal; and

forming a first resin by molding a resin material with a fluorescent substance dispersed therein so as to cover the semiconductor light emitting chip and the element mount section.

8. A method of producing a semiconductor light emitting device as claimed in claim 7, further comprising a step of forming a second resin by molding so as to cover an outside of the first resin.

9. A method of producing a semiconductor light emitting device as claimed in claim 7, in which the first resin is molded by a transfer molding method.

10. A method of producing a semiconductor light emitting device as claimed in claim 7, in which the first resin is molded in such a manner that the semiconductor light emitting chip is positioned substantially in a center of the first resin.

11. A method of producing a semiconductor light emitting device as claimed in claim 7, further comprising a step of electrically connecting the semiconductor light emitting chip to another lead terminal by a bonding wire, in which

the first resin is molded so as to cover the bonding wire and a part of said another lead terminal.