Semiconductor device, production method therefor, and electrophotographic apparatus

• US 20020125546A1
• Filed: 01/23/2002
• Published: 09/12/2002
• Est. Priority Date: 01/31/2001
• Status: Abandoned Application

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: Muta, Tadayoshi
• Application Number:
  US10/052,450
• Publication Number:
  US 20020125546A1
• Time in Patent Office: Days
• US Class Current: 257/531
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: H01L 21/4846 Leads on or in insulating or insulated substrates, e.g. metallisation H01L21/4821 takes precedence; metallisation of ceramics in general C04B41/51; printed circuits H05K3/00
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/00015 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01057 : Lanthanum [La]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/181 : Encapsulation

Abstract

A semiconductor device for transmitting information by using an induction field as a transmission medium comprises: an IC chip for storing and processing information to be transmitted; a coil for generating the induction field; andconnecting terminals provided at an end of the coil and electrically connected to the IC chip, wherein the coil and the connecting terminals are formed of the same metal plate which is patterned.

Claims

1. A semiconductor device for transmitting information by using an induction field as a transmission medium, comprising:

an IC chip for storing and processing information to be transmitted;

a coil for generating the induction field; and

connecting terminals provided at an end of the coil and electrically connected to the IC chip,

wherein the coil and the connecting terminals are formed of the same metal plate that is patterned.

2. The semiconductor device according to claim 1, wherein the IC chip, the coil, and the connecting terminals are encapsulated with a resin to be integrated with one another.

3. The semiconductor device according to claim 2, wherein at least one side of the coil is exposed from a surface of the resin.

4. The semiconductor device according to claim 2, wherein the IC chip and the connecting terminals are connected by wires, and wherein the wires are encapsulated with the resin.

5. The semiconductor device according to claim 2, wherein the IC chip and the connecting terminals are connected in flip chip connection.

6. The semiconductor device according to claim 2, wherein a part of one side of the coil is bonded and fixed with a tape.

7. A semiconductor device for transmitting information by using an induction field as a transmission medium, comprising:

an IC chip for storing and processing information to be transmitted;

an IC chip supporting section for mounting the IC chip thereon;

a coil for generating the induction field; and

connecting terminals provided at an end of the coil and electrically connected to the IC chip,

wherein the IC chip supporting section, the coil, and the connecting terminals are formed of the same metal plate that is patterned.

8. The semiconductor device according to claim 7, wherein the IC chip, the IC chip supporting section, the coil, and the connecting terminals are encapsulated with a resin to be integrated with one another.

9. A method of producing a semiconductor device that transmits information by using as a transmission medium an induction field generated from a coil electrically connected to an IC chip, comprising the steps of:

preparing one sheet of metal plate;

forming a metal frame having at least a coil pattern and a connecting terminal pattern formed at an end of the coil pattern, by patterning the metal plate;

mounting the IC chip on the metal frame;

electrically connecting the connecting terminal pattern to the IC chip; and

encapsulating the IC chip and the metal frame with a resin to integrate them.

10. The method of producing a semiconductor device according to claim 9, wherein the patterning of the metal plate is performed by stamping or etching.

11. The method of producing a semiconductor device according to claim 9, wherein electric connection of the connecting terminal pattern and the IC chip is performed by wire bonding, and wherein wires formed by the wire bonding are encapsulated with the resin.

12. The method of producing a semiconductor device according to claim 9, wherein electric connection of the connecting terminal pattern and the IC chip is performed in flip chip connection.

13. The method of producing a semiconductor device according to claim 9, further comprising a step of sticking a tape for coil pattern fixation on a part of one side of the coil pattern after the connecting terminal pattern and the IC chip are electrically connected.

16. The method of producing a semiconductor device according to claim 15, wherein a plurality of semiconductor devices is produced from the one sheet of the metal plate.

14. A method of producing a semiconductor device that transmits information by using as a transmission medium an induction field generated from a coil electrically connected to an IC chip, comprising the steps of:

preparing one sheet of metal plate;

forming a metal frame having at least a coil pattern, a connecting terminal pattern formed at an end of the coil pattern, and a tying section tying respective portions of the coil pattern, by patterning the metal plate;

mounting the IC chip on the metal frame;

electrically connecting the connecting terminal pattern to the IC chip;

sticking a tape for coil pattern fixation on a part of one side of the coil pattern after the connecting terminal pattern and the IC chip are electrically connected;

cutting the tying section; and

encapsulating the IC chip and the metal frame with a resin to integrate them.

15. A method of producing a semiconductor device that transmits information by using as a transmission medium an induction field generated from a coil electrically connected to an IC chip, comprising the steps of:

preparing one sheet of metal plate;

forming a metal frame having at least a coil pattern, a connecting terminal pattern formed at an end of the coil pattern, an outer frame section, and tying sections tying respective portions of the coil pattern and tying the coil pattern and the outer frame section, by patterning the metal plate;

mounting the IC chip on the metal frame;

electrically connecting the connecting terminal pattern to the IC chip;

sticking a tape for coil pattern fixation on a part of one side of the coil pattern after the connecting terminal pattern and the IC chip are electrically connected;

cutting the tying section tying respective portions of the coil pattern;

encapsulating the IC chip and the metal frame with a resin to integrate them; and

cutting the tying section tying the coil pattern and the outer frame section.

17. A method of producing a semiconductor device that transmits information by using as a transmission medium an induction field generated from a coil electrically connected to an IC chip, comprising the steps of:

preparing a metal plate;

forming a metal frame having at least the IC chip supporting section pattern on which an IC chip is mounted, a coil pattern, and a connecting terminal pattern formed at an end of the coil pattern, by patterning the metal plate;

mounting the IC chip on the IC chip supporting section;

electrically connecting the connecting terminal pattern to the IC chip; and

encapsulating the IC chip and the metal frame with a resin.

18. An electrophotographic apparatus on which a detachable process cartridge is mounted, comprising:

a semiconductor device including an IC chip for storing and processing information to be transmitted, a coil for generating an induction field, and connecting terminals provided at an end of the coil and electrically connected to the IC chip, the coil and the connecting terminal being formed of the same metal plate that is patterned;

the process cartridge on which the semiconductor device is stuck; and

a transmission-reception unit for receiving information from and transmitting information to the semiconductor device.