×

Housing for electronic apparatus having outer wall formed by injection molding

  • US 20020126445A1
  • Filed: 02/25/2002
  • Published: 09/12/2002
  • Est. Priority Date: 03/07/2001
  • Status: Active Grant
First Claim
Patent Images

1. A housing used for an electronic apparatus, comprising:

  • an outer wall formed by injecting a metal material from a plurality of gates into a molding space in a metal die, wherein said outer wall includes a first end portion situated on an upstream end along a flowing direction of the metal material, a second end portion situated on a downstream end of the flowing direction of the metal material, and an injection portion formed on the first end portion where said plurality of gates of the metal die are situated, forming a space between the first end portion and the injection portion.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×