Method for determining defect depth using thermal imaging

• US 20020128797A1
• Filed: 01/19/2001
• Published: 09/12/2002
• Est. Priority Date: 01/19/2001
• Status: Active Grant

• Current Assignee: U Chicago Argonne, LLC
• Original Assignee: University of Chicago The (University of Chicago)
• Inventors: Sun, Jiangang
• Granted Patent: US 6,542,849 B2
• Time in Patent Office: Days
• US Class Current: 702/172
• CPC Class Codes: G01B 11/06 for measuring thickness ; e.g. of sheet material thickness measurement by thermal means G01B21/085
• CPC Class Codes: G01B 11/22 for measuring depth

Abstract

A method and apparatus are provided for determining the thickness of a sample and defect depth using thermal imaging in a variety of plastic, ceramic, metal and other products. A pair of flash lamps is positioned at a first side of the sample. An infrared camera is positioned near the first side of the sample. A data acquisition and processing computer is coupled to the flash lamps for triggering the flash lamps. The data acquisition and processing computer is coupled to the infrared camera for acquiring and processing thermal image data. The thermal image data are processed using a theoretical solution to analyze the thermal image data to determine the thickness of a sample and defect depth.

Claims

1. Apparatus for determining the thickness of a sample and defect depth using thermal imaging in a variety of plastic, ceramic, metal and other products comprising:

a pair of flash lamps positioned at a first side of the sample;

an infrared camera positioned near said first side of the sample;

a data acquisition and processing computer;

said data acquisition and processing computer coupled to said flash lamps for triggering said flash lamps, said data acquisition and processing computer coupled to said infrared camera for acquiring and processing thermal image data;

said data acquisition and processing computer processing said thermal image data using a theoretical solution to analyze said thermal image data.

2. Apparatus for determining the thickness of a sample and defect depth using thermal imaging as recited in claim 1 wherein said data acquisition and processing computer processing said thermal image data uses an analytical equation represented by:

3. Apparatus for determining the thickness of a sample and defect depth using thermal imaging as recited in claim 1 wherein said data acquisition and processing computer processing said thermal image data uses an analytical equation represented by:

4. Apparatus for determining the thickness of a sample and defect depth using thermal imaging as recited in claim 1 includes a power supply coupled between said flash lamp and said data acquisition and processing computer.

5. Apparatus for determining the thickness of a sample and defect depth using thermal imaging as recited in claim 1 includes a function generator coupled between said infrared camera and said data acquisition and processing computer for controlling said infrared camera.

6. Apparatus for determining the thickness of a sample and defect depth using thermal imaging as recited in claim 1 wherein said infrared camera includes an array of infrared sensors.

7. Apparatus for determining the thickness of a sample and defect depth using thermal imaging as recited in claim 6 wherein said infrared camera array of infrared sensors includes 256×

256 focal plane array of infrared sensors.

8. Apparatus for determining the thickness of a sample and defect depth using thermal imaging as recited in claim 7 wherein said data acquisition and processing computer processing said thermal image data and said thermal image data are represented by a series of 2-dimensional arrays of 256×

256 pixels, taken at time t1, t2, though tN, where tN is greater than or equal to 4t_1/2 where t_1/2 represents the time when the temperature at the second, opposed surface of the sample reaches half of the maximum temperature.

9. Apparatus for determining the thickness of a sample and defect depth using thermal imaging as recited in claim 1 wherein said data acquisition and processing computer sequentially processes said thermal image data represented by a series of 2-dimensional arrays of 256×

256 pixels, one pixel at a time by fitting a time/temperature curve for each pixel with a theoretical expression.

10. Apparatus for determining the thickness of a sample and defect depth using thermal imaging as recited in claim 9 wherein said data acquisition and processing computer further provides a predicted thickness for each said pixel.

11. Apparatus for determining the thickness of a sample and defect depth using thermal imaging as recited in claim 10 wherein said data acquisition and processing computer further compiles said predicted thickness for each said pixel into a 2-dimensional array of 256×

256 pixels.

13. A method for determining the thickness of a sample and defect depth using thermal imaging as recited in claim 12 wherein the step of acquiring and processing image data from said infrared camera includes the step of acquiring image data from an array of 256×

256 infrared sensors from said infrared camera.

14. A method for determining the thickness of a sample and defect depth using thermal imaging as recited in claim 13 includes the steps of acquiring a series of said 2-dimensional arrays of 256×

256 pixels taken at time t1, t2, though tN, where tN is greater than or equal to 4t_1/2 where t_1/2 represents the time when the temperature at the second, opposed surface of the sample reaches half of the maximum temperature.

15. A method for determining the thickness of a sample and defect depth using thermal imaging as recited in claim 12 wherein the step of processing said thermal image data using a theoretical solution includes the steps of using an analytical equation represented by:

16. A method for determining the thickness of a sample and defect depth using thermal imaging as recited in claim 12 wherein the step of processing said thermal image data using a theoretical solution includes the steps of using an analytical equation represented by:

17. A method for determining the thickness of a sample and defect depth using thermal imaging as recited in claim 12 wherein the step of processing said thermal image data includes the step of compiling predicted thicknesses into a 2-dimensional array of 256×

256 pixels.

12. A method for determining the thickness of a sample and defect depth using thermal imaging in a variety of plastic, ceramic, metal and other products comprising the steps of:

providing a pair of flash lamps positioned at a first side of the sample;

providing an infrared camera positioned near said first side of the sample;

utilizing a data acquisition and processing computer for performing the steps of;

triggering said flash lamp,

acquiring and processing thermal image data from said infrared camera;

processing said thermal image data using a theoretical solution to analyze said thermal image data to determine the sample thickness and defect depth.