Control methodology and apparatus for reducing delamination in a book binding system
First Claim
1. A device for determining conditions under which delamination of a book cover from a book in a book binding system is more likely to occur, the book binding system including a binder subassembly line having a multiplicity of glue assembly station elements, the device comprising:
- a database that stores data related to a plurality of attributes corresponding to the multiplicity of glue assembly station elements for each of a number of book binding runs of the book binding system, wherein a book cover delamination occurred in some of the number of book binding runs and did not occur in others of the number of book binding runs; and
a processor that is adapted to be used to determine if there is a correlation between the stored data and the occurrence of book cover delamination in the book binding system.
1 Assignment
0 Petitions
Accused Products
Abstract
A device that determines conditions under which a book cover and page delamination is more likely to occur in a binder subassembly line of a book binding system collects and stores data pertaining to numerous bindery process variables such as, temperatures of a glue pot assembly, temperatures of a gas burner assembly, ambient temperatures and humidity of the air surrounding the binder subassembly line, viscosity values for an emulsion glue, and moisture content measurements of the emulsion glue after application of the emulsion glue to a backbone of a book. The device then implements a correlation analysis using the stored data to determine if there is a correlation between data and the occurrence of a delamination, and produces an optimal value or range for operation of the book binding system.
58 Citations
86 Claims
-
1. A device for determining conditions under which delamination of a book cover from a book in a book binding system is more likely to occur, the book binding system including a binder subassembly line having a multiplicity of glue assembly station elements, the device comprising:
-
a database that stores data related to a plurality of attributes corresponding to the multiplicity of glue assembly station elements for each of a number of book binding runs of the book binding system, wherein a book cover delamination occurred in some of the number of book binding runs and did not occur in others of the number of book binding runs; and
a processor that is adapted to be used to determine if there is a correlation between the stored data and the occurrence of book cover delamination in the book binding system. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
-
-
20. A book binding control system for use in a book binding assembly line having a plurality of glue assembly station elements, the book binding control system comprising:
-
(a) a sensor coupled to one of the plurality of glue assembly station elements, the sensor configured to measure a process value associated with the one of the plurality of glue assembly station elements to produce a sensor measurement;
(b) a controlled device configured to alter a parameter of the book binding assembly line; and
(c) a controller communicatively connected to the sensor to receive the sensor measurement, the controller configured to produce an output signal related to the controlled device based on the sensor measurement. - View Dependent Claims (21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 50, 51, 52)
-
-
49. A binder subassembly line comprising:
-
(a) an emulsion glue pot assembly configured to apply an emulsion glue layer to a book block backbone;
(b) a gas burner assembly configured to partially dry the emulsion glue on the book block backbone;
(c) an ambient air blast generator assembly configured to further dry the emulsion glue on the book block backbone;
(d) a glue pot assembly configured to apply a hot melt glue to the book block backbone;
(e) a viscometer coupled to the emulsion glue pot assembly, wherein the viscometer is configured to measure a viscosity of the emulsion glue; and
(f) a comparison device configured to compare the measured viscosity to a viscosity value stored within the comparison device.
-
-
53. A binder subassembly line comprising:
-
(a) an emulsion glue pot assembly configured to apply an emulsion glue layer to a book block backbone;
(b) a gas burner assembly configured to partially dry the emulsion glue on the book block backbone;
(c) an ambient air blast generator assembly configured to further dry the emulsion glue on the book block backbone;
(d) a glue pot assembly configured to apply a hot melt glue to the book block backbone;
(e) a glue wheel scraper indicating device coupled to a glue wheel scraper in communication with a corresponding glue wheel rotatable in the emulsion glue pot assembly, wherein the glue wheel scraper indicating device is configured to measure a distance between the glue wheel scraper and the glue wheel; and
(f) a comparison device configured to compare the measured distance to a distance value stored within the comparison device. - View Dependent Claims (54, 55, 56, 58, 59, 60)
-
-
57. A binder subassembly line comprising:
-
(a) an emulsion glue pot assembly configured to apply an emulsion glue layer to a book block backbone;
(b) a gas burner assembly configured to partially dry the emulsion glue on the book block backbone;
(c) an ambient air blast generator assembly configured to further dry the emulsion glue on the book block backbone;
(d) a glue pot assembly configured to apply a hot melt glue to the book block backbone;
(e) a stripper wheel scraper indicating device coupled to a stripper wheel scraper in communication with a stripper wheel rotatable in the emulsion glue pot assembly, wherein the stripper wheel scraper indicating device is configured to measure a distance between the stripper wheel scraper and the stripper wheel; and
(f) a comparison device configured to compare the measured distance to a distance value stored within the comparison device.
-
-
61. A binder subassembly line comprising:
-
(a) an emulsion glue pot assembly configured to apply an emulsion glue layer to a book block backbone;
(b) a gas burner assembly configured to partially dry the emulsion glue on the book block backbone;
(c) an ambient air blast generator assembly configured to further dry the emulsion glue on the book block backbone;
(d) a glue pot assembly configured to apply a hot melt glue to the book block backbone; and
(e) a thermocouple assembly coupled to the gas burner assembly, wherein the thermocouple assembly is configured to measure a temperature at the gas burner assembly. - View Dependent Claims (62, 63, 64, 65)
-
-
66. A binder subassembly line comprising:
-
(a) an emulsion glue pot assembly configured to apply an emulsion glue layer to a book block backbone;
(b) a gas burner assembly configured to partially dry the emulsion glue on the book block backbone;
(c) an ambient air blast generator assembly configured to further dry the emulsion glue on the book block backbone;
(d) a glue pot assembly configured to apply a hot melt glue to the book block backbone;
(e) a thermocouple assembly coupled to the glue pot assembly, wherein the thermocouple assembly is configured to measure a temperature of the glue pot assembly; and
(f) a comparison device configured to compare the measured temperature to a temperature value stored within the comparison device. - View Dependent Claims (67, 68, 69)
-
-
70. A binder subassembly line comprising:
-
(a) an emulsion glue pot assembly configured to apply an emulsion glue layer to a book block backbone;
(b) a gas burner assembly configured to partially dry the emulsion glue on the book block backbone;
(c) an ambient air blast generator assembly configured to further dry the emulsion glue on the book block backbone;
(d) a glue pot assembly configured to apply a hot melt glue to the book block backbone;
(e) an ambient humidity sensor, wherein the ambient humidity sensor is configured to measure an ambient humidity surrounding the binder subassembly line; and
(f) a comparison device configured to compare the measured ambient humidity to an ambient humidity value stored within the comparison device. - View Dependent Claims (71, 72, 73)
-
-
74. A binder subassembly line comprising:
-
(a) an emulsion glue pot assembly configured to apply an emulsion glue layer to a book block backbone;
(b) a gas burner assembly configured to partially dry the emulsion glue on the book block backbone;
(c) an ambient air blast generator assembly configured to further dry the emulsion glue on the book block backbone;
(d) a glue pot assembly configured to apply a hot melt glue to the book block backbone;
(e) an ambient temperature sensor, wherein the ambient temperature sensor is configured to measure an ambient temperature surrounding the binder subassembly line; and
(f) a comparison device configured to compare the measured ambient temperature to an ambient temperature value stored within the comparison device. - View Dependent Claims (75, 76, 77, 79, 80, 81, 82, 84)
-
-
78. A binder subassembly line comprising:
-
(a) an emulsion glue pot assembly configured to apply an emulsion glue layer to a book block backbone;
(b) a gas burner assembly configured to partially dry the emulsion glue on the book block backbone;
(c) an ambient air blast generator assembly configured to further dry the emulsion glue on the book block backbone;
(d) a glue pot assembly configured to apply a hot melt glue to the book block backbone; and
(e) a moisture sensor coupled to the binder subassembly line, wherein the moisture sensor is configured to measure a moisture content value of the emulsion glue after application of the emulsion glue to the book block backbone.
-
-
83. A binder subassembly line comprising:
-
(a) a glue pot assembly configured to apply a hot melt glue to the backbone of the grinded book block;
(b) a thermocouple assembly coupled to the glue pot assembly, wherein the thermocouple assembly is configured to measure a temperature of the glue pot assembly; and
(c) a comparison device configured to compare the measured temperature to a temperature value stored within the comparison device. - View Dependent Claims (85, 86)
-
Specification