Layout method of latch-up prevention circuit of a semiconductor device
First Claim
1. A layout method of a latch-up prevention circuit of a semiconductor memory device, comprising the steps of:
- arranging a plurality of pads at an edge of the device; and
arranging a guard ring beneath the plurality of pads.
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Accused Products
Abstract
A layout method is provided for a latch-up prevention circuit of a semiconductor memory device which includes the steps of: arranging a cell array at substantially the middle of the device; placing peripheral circuits next to both sides of the cell array; placing a plurality of pads on both sides of the cell array between the peripheral circuits and both edges of the device; and arranging guard rings beneath the plurality of pads. The layout method further includes a plurality of ESD protection transistors disposed axially along the direction as the plurality of pads between the plurality of pads and an edge of the device. And each of guard ring is a NWELL guard ring, and connected to a supply voltage and ground.
19 Citations
15 Claims
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1. A layout method of a latch-up prevention circuit of a semiconductor memory device, comprising the steps of:
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arranging a plurality of pads at an edge of the device; and
arranging a guard ring beneath the plurality of pads. - View Dependent Claims (2, 3, 4, 5)
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6. A layout method of a latch-up prevention circuit of a semiconductor memory device comprising the steps of:
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arranging a cell array at substantially the middle of the device;
placing peripheral circuits next to both sides of the cell array;
placing a plurality of pads on both sides of the cell array between the peripheral circuits and both edges of the device; and
arranging guard rings beneath the plurality of pads. - View Dependent Claims (7, 8, 9, 10)
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11. A semiconductor memory device having a latch-up prevention circuit, comprising:
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a cell array disposed substantially at the middle of the device;
a plurality of peripheral circuits disposed next to both sides of the cell array;
a plurality of pads disposed at all sides of the cell array between the peripheral circuits and edges of the device; and
guard rings disposed beneath the plurality of pads. - View Dependent Claims (12, 13, 14, 15)
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Specification