Electronic device and method of manufacture the same
First Claim
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1. An electronic device comprising:
- a flat plate IC chip having a memory for storing predetermined information and first and second external electrodes formed on front and back surfaces thereof;
first and second antennae connected to the first and second external electrodes, respectively, to supply power to the IC chip; and
a glass encapsulator provided to cover the IC chip and a part of each of the first and second antennae on sides of the first and second external electrodes.
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Abstract
An electronic device, in which a flat plate semiconductor and dumets connected to surface electrodes on the front and back surfaces of the semiconductor and to lead wires are encapsulated in a glass tube.
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Citations
45 Claims
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1. An electronic device comprising:
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a flat plate IC chip having a memory for storing predetermined information and first and second external electrodes formed on front and back surfaces thereof;
first and second antennae connected to the first and second external electrodes, respectively, to supply power to the IC chip; and
a glass encapsulator provided to cover the IC chip and a part of each of the first and second antennae on sides of the first and second external electrodes. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 17, 18, 19)
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16. An electronic device comprising:
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an IC chip having a memory and external electrodes electrically connected to the memory;
conductive wires connected to the external electrodes to transmit and receive a radio wave;
a glass encapsulator provided to cover the IC chip; and
an identifier, which is used to enable indicating that the IC chip is encapsulated.
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20. An electronic device comprising:
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an IC chip having a memory and first and second external electrodes provided on a first side and a second side opposite to the first side;
first and second conductive wires connected to the first and second external electrodes, respectively, to transmit and receive a radio wave; and
a tubular plastic encapsulator provided to cover the IC chip. - View Dependent Claims (21, 22, 23, 24, 25, 27, 28, 29, 31, 32, 33, 38, 39, 40, 41, 42, 44, 45)
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26. A method of manufacturing an electronic device comprising the steps of:
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preparing an IC chip having a memory for storing predetermined information and first and second external electrodes provided on front and back sides thereof, respectively;
preparing first and second antennae, respectively, having a dumet at one end thereof;
preparing a glass tube;
inserting a portion of the dumet of the first antenna into the glass tube;
placing the IC chip on the dumet of the first antenna arranged in the glass tube such that the first external electrode is disposed on a side of the first antenna dumet toward the dumet;
inserting a portion of the dumet of the second antenna into the IC chip placed in the glass tube such that the dumet of the second antenna is disposed on a side of the second external electrode; and
melting the glass tube to fix the IC chip and the dumets of the first and second antennae. - View Dependent Claims (30)
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34. A method of manufacturing an electronic device comprising the steps of:
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interposing an IC chip, which has a memory for storing predetermined information and first and second external electrodes provided on front and back sides thereof, between first and second antennae in a glass tube; and
melting the glass tube to encapsulate the IC chip and connections of the IC chip and the first and second antennae.
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35. An electronic device, in which information stored a memory provided in an IC chip is read through antennae, the electronic device comprising:
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an integrated circuit provided on a main surface of the IC chip and including the memory; and
electrodes provided on the main and back surfaces of the IC chip, respectively, and connected to the antennae; and
wherein the IC chip and connections of the electrodes and the antennae are encapsulated with glass.
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36. An electronic device, in which self-identification information stored a memory in an IC chip is read, the electronic device comprising:
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an integrated circuit provided on a main surface of the IC chip and including the memory; and
lead wires connected to electrodes provided on the main and back surfaces of the IC chip, respectively; and
wherein the IC chip and connections of the respective electrodes and the lead wires are encapsulated with glass.
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37. An electronic device, in which information stored a memory in a flat plate semiconductor chip is read wirelessly, the flat plate semiconductor chip comprising:
electrodes provided on main and back sides thereof, respectively, and lead wires connected to the electrodes, respectively, in a manner to be perpendicular to the main surface, and wherein the flat plate semiconductor chip and connections of the chip and the lead wires are encapsulated with glass.
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43. A method of operating an electronic device, the method comprising the steps of:
when a radio wave is to be transmitted from a reader to a transponder, beginning in a state, in which no radio wave is transmitted, transmitting a radio wave, then temporarily stopping transmission of radio wave, and since a state at that time, sending data in the transponder to the reader from the transponder.
Specification