Method for making electronic devices including silicon and LTCC and devices produced thereby
First Claim
1. A method for making an electronic device comprising:
- positioning first and second members so that opposing surfaces thereof are in contact with one another, the first member comprising silicon and the second member comprising a low temperature co-fired ceramic (LTCC) material; and
anodically bonding together the opposing surfaces of the first and second members to form a hermetic seal therebetween.
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Accused Products
Abstract
A method for making an electronic device includes positioning first and second members so that opposing surfaces thereof are in contact with one another, the first member comprising silicon and the second member comprising a low temperature co-fired ceramic (LTCC) material. The method further includes anodically bonding together the opposing surfaces of the first and second members to form a hermetic seal therebetween. The anodic bonding provides a secure and strong bond between the members without using adhesive. The method may further include forming at least one cooling structure in at least one of the first and second members. The least one cooling structure may comprise at least one first micro-fluidic cooling structure in the first member, and at least one second micro-fluidic cooling structure in the second member aligned with the at least one first micro-fluidic cooling structure.
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Citations
34 Claims
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1. A method for making an electronic device comprising:
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positioning first and second members so that opposing surfaces thereof are in contact with one another, the first member comprising silicon and the second member comprising a low temperature co-fired ceramic (LTCC) material; and
anodically bonding together the opposing surfaces of the first and second members to form a hermetic seal therebetween. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 15, 16, 17, 18, 19, 20)
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14. A method for making an electronic device comprising:
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positioning first and second members so that opposing generally planar major surfaces thereof are in contact with one another, the first member comprising silicon and the second member comprising a low temperature co-fired ceramic (LTCC) material, the first member also having at least one first micro-fluidic structure and the second member also having at least one second micro-fluidic cooling structure aligned with the at least one first micro-fluidic cooling structure; and
anodically bonding together the opposing generally planar major surfaces of the first and second members to form a hermetic seal therebetween.
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21. An electronic device comprising:
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a first member comprising silicon; and
a second member comprising a low temperature co-fired ceramic (LTCC) material;
said first and second members having opposing surfaces thereof anodically bonded together to form a hermetic seal therebetween. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29)
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30. An electronic device comprising:
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a first member comprising silicon and having at least one first micro-fluidic cooling structure therein;
a second member comprising a low temperature co-fired ceramic (LTCC) material and having at least one second micro-fluidic cooling structure aligned with the at least one first micro-fluidic cooling structure of said first member;
said first and second members having opposing surfaces thereof anodically bonded together to form a hermetic seal therebetween; and
at least one integrated circuit adjacent said at least one second micro-fluidic cooling structure. - View Dependent Claims (31, 32, 33, 34)
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Specification