Self-aligned MRAM contact and method of fabrication
First Claim
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1. A method of forming at least one contact in a magnetic random access memory cell structure, said method comprising:
- forming a plurality of first conductive layers in an insulating layer of a substrate;
forming a plurality of first magnetic layers over said respective first conductive layers;
forming a plurality of second magnetic layers spaced along said first magnetic layers;
forming an insulating material in between and over said first and second magnetic layers; and
removing portion of said insulating material to expose at least one upper surface of a conductive layer, said conductive layer being part of said second magnetic layer.
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Abstract
A method of forming self-aligned MRAM contacts is disclosed. MRAM stacks including an upper layer of a conductive material are formed over portions of integrated circuitry. An insulating material is formed over the substrate, including the MRAM stacks with the upper layer of conductive material. The insulating material is subsequently chemically mechanically polished or etched, stopping on the upper layer of conductive material, to expose portions of the conductive material which are used as self-aligned MRAM contacts.
10 Citations
61 Claims
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1. A method of forming at least one contact in a magnetic random access memory cell structure, said method comprising:
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forming a plurality of first conductive layers in an insulating layer of a substrate;
forming a plurality of first magnetic layers over said respective first conductive layers;
forming a plurality of second magnetic layers spaced along said first magnetic layers;
forming an insulating material in between and over said first and second magnetic layers; and
removing portion of said insulating material to expose at least one upper surface of a conductive layer, said conductive layer being part of said second magnetic layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A method of forming a plurality of self-aligned contacts of respective magnetic random access memory cells formed over a semiconductor substrate, said method comprising:
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forming a plurality of first conductive layers in an insulating layer formed over said semiconductor substrate;
forming a plurality of first magnetic layers over respective first conductive layers;
forming a plurality of second magnetic layers spaced along said first magnetic layers, said plurality of second magnetic layers including respective top conductive layers;
forming an insulating material over said substrate and said plurality of first and second magnetic layers including said top conductive layers, and in between adjacent first and second magnetic layers;
removing portions of said insulating material from said top conductive layers to expose a plurality of upper surfaces of said top conductive layers associated with said second magnetic layers; and
forming a plurality of second conductive layers over respective self-aligned contacts, said second conductive layers running substantially orthogonal to said first magnetic layers;
one of said first and second conductive layers being bit lines and the other of said first and second conductive layers being word lines. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42)
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43. A magnetic random access memory structure comprising:
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a plurality of longitudinally extending conductive first lines formed over an insulating layer of a semiconductor substrate;
respective first magnetic layers over said conductive first lines;
respective spaced apart second magnetic layers over said first magnetic layers; and
at least one self-aligned contact formed of a conductive layer of said at least one spaced apart second magnetic layer. - View Dependent Claims (44, 45, 46, 47, 48, 49, 50, 51)
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52. A memory device comprising:
at least one magnetic random access memory cell, said magnetic random access memory cell comprising a first ferromagnetic layer formed over a first conductor, a second ferromagnetic layer formed over said first ferromagnetic layer, a non-magnetic layer between said first and second ferromagnetic layers, and a second conductor in contact with a self-aligned contact, said self-aligned contact being a conductive layer included in said second ferromagnetic layer. - View Dependent Claims (53, 54, 55, 56, 58, 59, 60, 61)
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57. A processor-based system, comprising:
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a processor; and
an integrated circuit coupled to said processor, said integrated circuit including a plurality of magnetic random access memory cells, each of said magnetic random access memory cells including a first ferromagnetic layer formed over a first conductor, a second ferromagnetic layer formed over said first ferromagnetic layer, a nonmagnetic layer between said first and second ferromagnetic layers, and a second conductor in contact with a self-aligned contact, said self-aligned contact being a conductive layer included in said second ferromagnetic layers.
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Specification