Electrical interconnect having a multi-layer circuit board structure and including a conductive spacer for impedance matching

• US 20020139579A1
• Filed: 03/18/2002
• Published: 10/03/2002
• Est. Priority Date: 03/16/2001
• Status: Active Grant

• Current Assignee: Cenix, Inc. (Broadcom, Inc.)
• Original Assignee: Cenix, Inc. (Broadcom, Inc.)
• Inventors: Kwark, Bongsin
• Granted Patent: US 6,602,078 B2
• Time in Patent Office: Days
• US Class Current: 174/262
• CPC Class Codes: H01P 1/047 Strip line joints
• CPC Class Codes: H01P 3/06 Coaxial lines
• CPC Class Codes: H05K 1/0219 Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
• CPC Class Codes: H05K 1/0237 High frequency adaptations H05K1/0216 takes precedence
• CPC Class Codes: H05K 1/024 Dielectric details, e.g. changing the dielectric material around a transmission line
• CPC Class Codes: H05K 2201/09618 Via fence, i.e. one-dimensional array of vias
• CPC Class Codes: H05K 2201/09718 Clearance holes
• CPC Class Codes: H05K 2201/09809 Coaxial layout reduction of cross-talk, noise or interference by printed shielding conductors for shielding around a single via or around a group of vias H05K1/0222
• CPC Class Codes: H05K 3/429 Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
• CPC Class Codes: H05K 3/4641 having integrally laminated metal sheets or special power cores

Abstract

An electrical interconnect having a multi-layer circuit board structure is designed to facilitate source and load impedance matching. The circuit board structure has a first transmission line extending along a surface of one of the layers, and a second transmission line extending along a surface of another of the layers. A signal line connects the first transmission line to the second transmission line in the vertical direction of the circuit board structure. A conductive ground spacer is interposed between respective layers of the circuit board structure and has a through-hole in which the signal line resides. A dielectric medium, such as air, occupies the through-hole and substantially circumferentially surrounds the signal line. Accordingly, the ground conductor, the signal line and the dielectric medium form a coaxial structure in the vertical direction, by which it is easy to provide a desired characteristic impedance.

Claims

1. An electrical interconnect comprising:

circuit board structure having multiple layers each including a substrate and a wiring pattern extending along at least one surface of the substrate, and the circuit board structure having a first transmission line constituted by the wiring pattern extending along a surface of one of said layers, and a second transmission line constituted by the wiring pattern extending along a surface of another of said layers;

a signal line extending from said first transmission line to said second transmission line in a vertical direction through said circuit board structure so as to form an electrical interconnection of said transmission lines;

an electrical ground conductor that is substantially thicker than said wiring patterns and is interposed between respective ones of the layers of the circuit board structure intermediate said layers having the surfaces along which the first and second transmission lines extend, said electrical ground conductor having a through-hole in which said signal line resides as spaced from the ground conductor; and

a dielectric medium occupying said through-hole and substantially circumferentially surrounding said signal line, wherein said ground conductor and said dielectric medium form a coaxial structure in the vertical direction.

2. The electrical interconnect according to claim 1, wherein said circuit board structure consists of a single multi-layer printed circuit board in which said ground conductor is integrated.

3. The electrical interconnect according to claim 1, wherein said circuit board structure comprises first and second discrete printed circuit boards between which said ground conductor is sandwiched.

4. The electrical interconnect according to claim 1, wherein said dielectric medium is a volume of air.

5. The electrical interconnect according to claim 2, wherein said dielectric medium is a volume of air.

6. The electrical interconnect according to claim 3, wherein said dielectric medium is a volume of air.

7. The electrical interconnect according to claim 1, wherein said ground conductor is in contact with the wiring pattern of at least one of said respective layers.

8. The electrical interconnect according to claim 1, wherein said electrical ground conductor has a thickness, in the vertical direction, that is substantially the same as that of the layers of the circuit board structure.

9. The electrical interconnect according to claim 1, wherein said electrical ground conductor has a thickness in the vertical direction of approximately 80 mm.

10. The electrical interconnect according to claim 8, wherein said thickness is approximately 80 mm.