Light emitting diode and manufacturing method thereof

• US 20020139990A1
• Filed: 03/22/2002
• Published: 10/03/2002
• Est. Priority Date: 03/28/2001
• Status: Active Grant

• Current Assignee: Toyoda Gosei Company Limited (Toyota Motor Corporation)
• Original Assignee: Toyoda Gosei Company Limited (Toyota Motor Corporation)
• Inventors: Kato, Hideaki, Suehiro, Yoshinobu, Hadame, Kunihiro
• Granted Patent: US 6,833,566 B2
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: F21S 43/14 Light emitting diodes [LED]
• CPC Class Codes: F21V 11/12 of slot type
• CPC Class Codes: F21V 13/10 the elements being reflectors and screens
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 29/83 the elements having apertures, ducts or channels, e.g. heat radiation holes
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/13 of an individual bump connector
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

A light emitting diode has a substrate having a heat radiation conductive member therein, and a light emitting element mounted on the substrate. At least a part of the light emitting element is directly brought into contact and electrically connected with the heat radiation conductive member.

Claims

1. A light emitting diode comprising:

a substrate having a heat radiation conductive member therein; and

a light emitting element mounted on said substrate, at least a part of said light emitting element being directly brought into contact and electrically connected with said heat radiation conductive member.

2. A light emitting diode according to claim 1, wherein said heat radiation conductive member comprises a metal filled in a through hole formed in said substrate, first and second electrodes being formed on a rear surface of said light emitting element, said first electrode being connected to said metal, and said second electrode being connected to a conductive pattern formed on said substrate and insulated from said heat radiation conductive member.

3. A light emitting diode according to claim 2, wherein a part of said substrate and said light emitting element are sealed with a light transmissive material, and a surface of said light transmissive material, which is provided at a side of a light emitting surface of said light emitting element, is formed as a light radiating surface.

4. A light emitting diode according to claim 3, wherein said light radiating surface portion is a convex lens.

5. A light emitting diode according to claim 1, further comprising:

a reflecting mirror opposed to a light radiating side of said light emitting element; and

a light shielding plate having an optical opening portion and disposed opposed to said reflecting mirror.

6. A light emitting diode according to claim 5, further comprising a light transmissible material for sealing said light emitting element.

7. A light emitting diode according to claim 6, wherein a convex lens is formed from said light transmissive material.

8. A light emitting diode according to claim 1, wherein said heat radiation conductive member leads to a back surface of said substrate being opposed to a surface on which said light emitting element is mounted.

25. A method of manufacturing a light emitting diode according to claim 8, wherein said light radiating surface is a convex lens.

9. A light emitting diode comprising:

a light emitting element;

a pair of leads for supplying electric power to said light emitting element;

an insulating film fixed on a top surface of one of said pair of leads; and

two conductive foils formed on said insulating film to be away from each other;

wherein rear surface electrodes of said light emitting element are respectively connected to said two conductive foils, one of said two conductive foils is electrically connected to said one of leads, and the other of said two conductive foils is electrically connected to the other of said pair of leads.

10. A light emitting diode according to claim 9, wherein a part of said substrate or a part of said pair of leads, and said light emitting element are sealed with a light transmissive material, and a surface of said light transmissive material, which is provided at a side of a light emitting surface of said light emitting element, is formed as a light radiating surface.

11. A light emitting diode according to claim 10, wherein said light radiating surface portion is a convex lens.

13. Alight emitting diode according to claim 12, wherein a part of said substrate or a part of said pair of leads, and said light emitting element are sealed with a light transmissive material, and a surface of said light transmissive material, which is provided at a side of a light emitting surface of said light emitting element, is formed as a light radiating surface.

14. A light emitting diode according to claim 13, wherein said light radiating surface portion is a convex lens.

15. A light emitting diode according to claim 12, wherein a concave reflecting mirror is formed from said one of leads, and said light emitting element is placed on a bottom surface of said reflecting mirror.

17. Alight emitting diode according to claim 16, further comprising a spacer for changing a height of said substrate portion, wherein said spacer is black.

21. A light source according to claim 19, wherein said substrate is shaped so that four corners of said substrate are cut off.

22. Alight source according to claim 21, wherein (a width of said substrate−

a diameter of said convex lens) <

1 mm.

24. A method of manufacturing a light emitting diode according to claim 23, further comprising a step of sealing a part of said pair of leads, said reflecting mirror, and said light emitting element with a light transmissive material, and forming a surface, which is provide data side of a light emitting surface of said light emitting element, of said light transmissive material as a light radiating surface.

12. A light emitting diode comprising:

a light emitting element;

a pair of leads for supplying electric power to said light emitting element;

an insulating film fixed on a top surface of one of said pair of leads; and

a conductive foil formed on said insulating film;

wherein one of rear surface electrodes of said light emitting element is connected to said conductive foil, the other of said rear surface electrodes, and said conductive foil is electrically connected to the other of said pair of leads.

16. Alight shielding/reflecting type device comprising:

a substrate;

a light emitting element mounted on said substrate;

a reflecting mirror opposed to a light radiating side of said light emitting element; and

a light shielding plate having an optical opening portion and disposed opposed to said reflecting mirror;

wherein a side of said substrate, on which said light emitting element is mounted, is black.

18. Alight shielding/reflecting type device comprising:

a substrate;

a light emitting element mounted on said substrate;

a reflecting mirror opposed to a light radiating side of said light emitting element; and

a light shielding plate having an optical opening portion and disposed opposed to said reflecting mirror;

wherein said light shielding plate is formed like film.

19. A light source comprising:

a substrate;

a light emitting element mounted on said substrate; and

a light transmissive material for sealing said light emitting element;

wherein a part of said substrate, on which said light emitting element is mounted, is formed as a heat radiation conductive member, and said heat radiation conductive member leads to a back surface of said substrate.

20. Alight source according to claiml9, wherein a convex lens is formed from said light transmissive material.

23. A method of manufacturing a light emitting diode, comprising steps of:

sticking an insulating film, on which a conductive foil is put, to apart of one of a pair of leads for supplying electric power to a light emitting element;

stamping said one of leads to thereby form a concave reflecting mirror, at the central portion of which one of ends of said conductive foil of said insulating film is placed, and processing a concave surface of said reflecting mirror in such a way as to be round-cornered;

connecting one of rear surface electrodes of said light emitting element to an end of said conductive foil at the central portion of said concave reflecting mirror; and

electrically connecting the other end of the conductive foil to said one of said pairs of said leads.