Highly integrated multi-layer circuit module having ceramic substrates with embedded passive devices

• US 20020140081A1
• Filed: 03/30/2001
• Published: 10/03/2002
• Est. Priority Date: 12/07/2000
• Status: Abandoned Application

• Current Assignee: Industrial Technology Research Institute
• Original Assignee: Industrial Technology Research Institute
• Inventors: Chen, Jian-Hong, Chou, Young-Huang, Wang, Chin-Li, Tang, Ching-Wen, Tseng, Wen-Jen, Sheen, Jyh-Wen
• Application Number:
  US09/823,844
• Publication Number:
  US 20020140081A1
• Time in Patent Office: Days
• US Class Current: 257/700
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/19106 in a mirrored arrangement on two different side of a common die mounting substrate
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H05K 1/16 incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 3/4629 laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Abstract

A plurality of ceramic substrates are used to manufacture and integrate a highly integrated multi-layer circuit module. Integrated circuit devices are mounted on one or both surfaces of the circuit module whose multi-layer structure is divided into three types of integration regions including inter-connection integration regions, basic passive device integration regions and high frequency passive device integration regions. Connection layers are formed in the inter-connection integration regions for connecting integrated circuits. Basic passive device integration regions include capacitor, resistor and inductor layers. Filters, couplers and baluns are fabricated in the high frequency passive device integration regions. Shielding ground planes are provided for the isolation of devices to prevent electromagnetic interference. Standard input and output contacts are formed on the bottom surface so that the circuit module can be used as a modularized device.

Claims

1. A multi-layer circuit module, comprising:

a plurality of substrate layers and metal layers being divided into a plurality of integration regions including at least an inter-connection integration region, at least a basic passive device integration region and at least a high frequency passive device integration region;

a plurality of circuit devices mounted on at least one of top and bottom surfaces of said circuit module;

wherein said inter-connection integration region comprises at least one connection layer for circuit connection between said plurality of circuit devices, said basic passive device integration region comprises at least one basic passive device layer, and said high frequency passive device integration region comprises high frequency passive devices.

2. The multi-layer circuit module as claimed in claim 1, wherein said basic passive device integration region comprises at least one capacitor layer.

3. The multi-layer circuit module as claimed in claim 2, wherein said basic passive device integration region comprises a stacked capacitor fabricated on said at least one capacitor layer.

4. The multi-layer circuit module as claimed in claim 2, wherein said basic passive device integration region comprises a printed capacitor fabricated on said at least one capacitor layer.

5. The multi-layer circuit module as claimed in claim 2, wherein said basic passive device integration region comprises at least a resistor or inductor fabricated on said at least one capacitor layer.

6. The multi-layer circuit module as claimed in claim 1, wherein said basic passive device integration region comprises at least one resister layer.

7. The multi-layer circuit module as claimed in claim 6, wherein said basic passive device integration region comprises at least a capacitor or inductor fabricated on said at least one resistor layer.

8. The multi-layer circuit module as claimed in claim 1, wherein said basic passive device integration region comprises at least one inductor layer.

9. The multi-layer circuit module as claimed in claim 8, wherein said basic passive device integration region comprises a spiral line on said at least one inductor layer for forming an inductor.

10. The multi-layer circuit module as claimed in claim 8, wherein said basic passive device integration region comprises a transmission line on said at least one inductor layer for forming a high frequency short or isolation circuit on said at least one inductor layer.

11. The multi-layer circuit module as claimed in claim 8, wherein said basic passive device integration region comprises at least a resistor or capacitor fabricated on said at least one inductor layer.

12. The multi-layer circuit module as claimed in claim 1, wherein said high frequency passive device integration region comprises a high frequency filter.

13. The multi-layer circuit module as claimed in claim 1, wherein said high frequency passive device integration region comprises a high frequency coupler.

14. The multi-layer circuit module as claimed in claim 1, wherein said high frequency passive device integration region comprises high frequency baluns.

15. The multi-layer circuit module as claimed in claim 1, wherein said high frequency passive device integration region comprises an antenna.

16. The multi-layer circuit module as claimed in claim 1, wherein each of said plurality of integration regions has at least one shielding ground plane for shielding and isolating devices formed therein.

17. The multi-layer circuit module as claimed in claim 1, wherein said connection layer has at least one shielding ground plane for shielding and isolating circuit connection paths formed therein.

18. The multi-layer circuit module as claimed in claim 1, wherein said basic passive device layer has at least one shielding ground plane for shielding and isolating basic passive devices formed therein.

19. The multi-layer circuit module as claimed in claim 1, wherein devices in different integration regions or different layers are connected by filled vias.

20. The multi-layer circuit module as claimed in claim 1, wherein said plurality of substrate layers comprise ceramic substrates.

21. The multi-layer circuit module as claimed in claim 1, wherein said inter-connection integration region is located adjacent to said top or bottom surface on which circuit devices are mounted.

22. The multi-layer circuit module as claimed in claim 21, wherein said basic passive device integration region is located adjacent to said inter-connection integration region, said basic passive device integration region having capacitor layers adjacent to said inter-connection integration region and resistor layers next to said capacitor layers.

23. The multi-layer circuit module as claimed in claim 22, wherein said basic passive device integration region further comprises inductor layers following said resistor layers.

24. The multi-layer circuit module as claimed in claim 22, wherein only said top surface of said circuit module has circuit devices mounted thereon, said high frequency passive device integration region is formed next to said resistor layers, and inductor layers are formed following said high frequency passive device integration region.

25. The multi-layer circuit module as claimed in claim 1, wherein said inter-connection integration region is located next to a shielding ground plane adjacent to said top or bottom surface on which circuit devices are mounted.

26. The multi-layer circuit module as claimed in claim 1, wherein both top and bottom surfaces of said circuit module have circuit devices mounted thereon, and said high frequency passive device integration region comprises middle layers of said plurality of substrate layers and metal layers.

27. The multi-layer circuit module as claimed in claim 26, wherein basic passive device integration regions are formed on both sides of said high frequency passive device integration region.

28. The multi-layer circuit module as claimed in claim 27, wherein each of said top and bottom surfaces has an adjacent inter-connection integration region next to a basic passive device integration region adjacent to said high frequency passive device integration region.

30. The method of manufacturing a multi-layer circuit module as claimed in claim 29, wherein at least one capacitor layer is formed in said basic passive device integration region.

31. The method of manufacturing a multi-layer circuit module as claimed in claim 30, wherein a stacked capacitor is fabricated on said at least one capacitor layer.

32. The method of manufacturing a multi-layer circuit module as claimed in claim 30, wherein a printed capacitor is fabricated on said at least one capacitor layer.

33. The method of manufacturing a multi-layer circuit module as claimed in claim 30, wherein at least a resistor or inductor is fabricated on said at least one capacitor layer.

34. The method of manufacturing a multi-layer circuit module as claimed in claim 29, wherein at least one resistor layer is formed in said basic passive device integration region.

35. The method of manufacturing a multi-layer circuit module as claimed in claim 34, wherein at least a capacitor or inductor is fabricated on said at least one resistor layer.

36. The method of manufacturing a multi-layer circuit module as claimed in claim 29, wherein at least one inductor layer is formed in said basic passive device integration region.

37. The method of manufacturing a multi-layer circuit module as claimed in claim 36, wherein a spiral line is fabricated on said at least one inductor layer for forming an inductor.

38. The method of manufacturing a multi-layer circuit module as claimed in claim 36, wherein a transmission line is fabricated on said at least one inductor layer for forming a high frequency short or isolation circuit.

39. The method of manufacturing a multi-layer circuit module as claimed in claim 36, wherein at least a resistor or capacitor is fabricated on said at least one inductor layer.

40. The method of manufacturing a multi-layer circuit module as claimed in claim 29, wherein a high frequency filter is formed in said high frequency passive device integration region.

41. The method of manufacturing a multi-layer circuit module as claimed in claim 29, wherein a high frequency coupler is formed in said high frequency passive device integration region.

42. The method of manufacturing a multi-layer circuit module as claimed in claim 29, wherein baluns are formed in said high frequency passive device integration region.

43. The method of manufacturing a multi-layer circuit module as claimed in claim 29, wherein an antenna is formed in said high frequency passive device integration region.

44. The method of manufacturing a multi-layer circuit module as claimed in claim 29, wherein each of said plurality of integration regions has at least one shielding ground plane for shielding and isolating devices formed therein.

45. The method of manufacturing a multi-layer circuit module as claimed in claim 29, wherein said connection layer has at least one shielding ground plane for shielding and isolating circuit connection paths.

46. The method of manufacturing a multi-layer circuit module as claimed in claim 29, wherein said basic passive device layer has at least one shielding ground plane for shielding and isolating basic passive devices formed therein.

47. The method of manufacturing a multi-layer circuit module as claimed in claim 29, wherein devices in different integration regions or different layers are connected by filled vias.

48. The method of manufacturing a multi-layer circuit module as claimed in claim 29, wherein said circuit module comprises a plurality of ceramic substrate layers and metal layers divided into said plurality of integration regions.

49. The method of manufacturing a multi-layer circuit module as claimed in claim 29, wherein said inter-connection integration region is formed adjacent to said top or bottom surface on which circuit devices are mounted.

50. The method of manufacturing a multi-layer circuit module as claimed in claim 49, wherein said basic passive device integration region is formed adjacent to said interconnection integration region, said basic passive device integration region having capacitor layers adjacent to said inter-connection integration region and resistor layers next to said capacitor layers.

51. The method of manufacturing a multi-layer circuit module as claimed in claim 50, wherein said basic passive device integration region further comprises inductor layers following said resistor layers.

52. The method of manufacturing a multi-layer circuit module as claimed in claim 50, wherein only said top surface of said circuit module has circuit devices mounted thereon, said high frequency passive device integration region is formed next to said resistor layers, and inductor layers are formed following said high frequency passive device integration region.

53. The method of manufacturing a multi-layer circuit module as claimed in claim 29, wherein said inter-connection integration region is formed next to a shielding ground plane adjacent to said top or bottom surface on which circuit devices are mounted.

54. The method of manufacturing a multi-layer circuit module as claimed in claim 29, wherein a plurality of circuit devices are mounted on both top and bottom surfaces of said circuit module, and said high frequency passive device integration region is formed by middle layers of a plurality of substrate layers and metal layers of said circuit module.

55. The method of manufacturing a multi-layer circuit module as claimed in claim 54, wherein basic passive device integration regions are formed on both sides of said high frequency passive device integration region.

56. The method of manufacturing a multi-layer circuit module as claimed in claim 55, wherein each of said top and bottom surfaces has an adjacent inter-connection integration region next to a basic passive device integration region adjacent to said high frequency passive device integration region.

29. A method of manufacturing a multi-layer circuit module, comprising the steps of:

a. dividing said circuit module into a plurality of integration regions including at least an inter-connection integration region, at least a basic passive device integration region and at least a high frequency passive device integration region;

b. forming at least one connection layer in said inter-connection integration region for circuit connection between a plurality of circuit devices;

c. forming at least a basic passive device layer in said basic passive integration region;

d. forming a plurality of high frequency passive devices in said high frequency passive device integration region; and

e. mounting a plurality of circuit devices on at least one of top and bottom surfaces of said circuit module.