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MULTI-LAYER FLAT PLATE ANTENNA WITH LOW-COST MATERIAL AND HIGH-CONDUCTIVITY ADDITIVE PROCESSING

  • US 20020140608A1
  • Filed: 04/02/2001
  • Published: 10/03/2002
  • Est. Priority Date: 04/02/2001
  • Status: Active Grant
First Claim
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1. A method for producing a multi-layer flat plate antenna comprising the steps of:

  • (a) forming a ground plane;

    (b) layering a first foam layer on an upper surface of said ground plane;

    (c) screen-printing a power distribution circuit on a first layer of a dielectric material, said first layer of said dielectric material placed on an upper surface of said first foam layer;

    (d) performing post-processing on said power distribution circuit to increase circuit conductivity;

    (e) layering a second foam layer on said power distribution circuit;

    (f) forming radiating elements on a second layer of said dielectric material, said second layer of said dielectric material placed on an upper surface of said second foam layer;

    (g) arranging said antenna such that said power distribution circuit drives said radiating elements.

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