Method of inspecting semiconductor integrated circuit which can quickly measure a cubic body
First Claim
1. A semiconductor integrated circuit inspecting apparatus inspecting a terminal provided on a mount surface of a semiconductor integrated circuit, comprising:
- a light emitter emitting a linear light obliquely to said mount surface;
a photographing unit photographing said mount surface to which said light is emitted to output a photograph signal;
an inspector inspecting said terminal in accordance with said photograph signal, and wherein said photographing unit has N (N is a positive integer) photographing elements, and wherein said photograph signal is outputted respectively only from M (M is a positive integer smaller than said N) photographing elements of said N photographing elements.
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Accused Products
Abstract
A semiconductor integrated circuit inspecting apparatus inspecting a terminal provided on a mount surface of a semiconductor integrated circuit includes a light emitter, a photographing unit and an inspector. The light emitter emits a linear light obliquely to the mount surface. The photographing unit photographs the mount surface to which the light is emitted to output a photograph signal. The inspector inspects the terminal in accordance with the photograph signal. The photographing unit has N (N is a positive integer) photographing elements. The photograph signal is outputted respectively only from M (M is a positive integer smaller than the N) photographing elements of the N photographing elements.
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Citations
21 Claims
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1. A semiconductor integrated circuit inspecting apparatus inspecting a terminal provided on a mount surface of a semiconductor integrated circuit, comprising:
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a light emitter emitting a linear light obliquely to said mount surface;
a photographing unit photographing said mount surface to which said light is emitted to output a photograph signal;
an inspector inspecting said terminal in accordance with said photograph signal, and wherein said photographing unit has N (N is a positive integer) photographing elements, and wherein said photograph signal is outputted respectively only from M (M is a positive integer smaller than said N) photographing elements of said N photographing elements. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 19, 20)
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17. A method of inspecting a semiconductor integrated circuit, which inspects a terminal provided on a mount surface of a semiconductor integrated circuit, comprising:
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(a) providing a photographing unit having N (N is a positive integer) photographing elements;
(b) detecting a position of said terminal on said mount surface;
(c) obliquely emitting a linear light to said mount surface;
(d) relatively shifting an emission target of said light and said mount surface at a set speed such that said light is emitted to each of a plurality of positions of said mount surface;
(e) photographing by said photographing unit a region on said mount surface to which said light is emitted to output a photograph signal from said photographing unit; and
(f) inspecting said terminal in accordance with said photograph signal, and wherein a plurality of said photograph signals is outputted from only M (M is a positive integer smaller than said N) photographing elements of said N photographing elements, and wherein said set speed when said light is emitted to said terminal is set to be higher as compared with a case when said light is not emitted to said terminal, based on a result of said (b).
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18. A method of inspecting a semiconductor integrated circuit, which inspects a terminal provided on a mount surface of a semiconductor integrated circuit, comprising:
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(g) providing N (N is a positive integer) CMOS photographing elements or CCD photographing elements arranged in a shape of a matrix composed of p lines and q rows (each of p and q is a positive integer);
(h) detecting a position of said terminal on said mount surface;
(i) obliquely emitting a linear light to said mount surface;
(j) photographing by said photographing unit a region on said mount surface to which said light is emitted to output said photograph signal from said photographing unit; and
(k) inspecting said terminal in accordance with said photograph signal, and wherein a plurality of said photograph signals are outputted from only M (M is a positive integer smaller than said N) CMOS photographing elements or CCD photographing elements in a range of (p-α
) lines and (q-β
) rows (said α
is a positive integer smaller than said p, and said β
is a positive integer smaller than said q) of said N CMOS photographing elements or CCD photographing elements, andwherein said range of said (p-α
) lines and (q-β
) rows is set to include a single one of said terminal in accordance with said result of said (h).
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21. A method of inspecting a semiconductor integrated circuit, comprising:
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fixing a two-dimension measuring camera and a three-dimension measuring camera on a XY stage, and measuring a sample by using said two-dimension measuring camera and said three-dimension measuring camera.
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Specification