High precision accelerometer

• US 20020144548A1
• Filed: 04/08/2002
• Published: 10/10/2002
• Est. Priority Date: 04/06/2001
• Status: Abandoned Application

• Current Assignee: Michael B. Cohn, Ryan Roehnelt
• Original Assignee: Michael B. Cohn, Ryan Roehnelt
• Inventors: Roehnelt, Ryan, Cohn, Michael B.
• Application Number:
  US10/118,542
• Publication Number:
  US 20020144548A1
• Time in Patent Office: Days
• US Class Current: 73/514.16
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01P 2015/0814 for translational movement of the mass, e.g. shuttle type

Abstract

The present invention provides an accelerometer which is more manufacturable, higher performance, and more survivable. This invention is particularly applicable for ultra-low-g sensors and ultra-high-g sensors.

Claims

1. An accelerometer with more than one sensing element wherein said more than one sensing elements are electrically interconnected together.

2. A device as in claim 1 wherein said more than one sensing elements are electrically interconnected together in an arrangement selected from the following list:

a. all sensing elements are interconnected in series,

b. all sensing elements are interconnected in parallel,

c. all sensing elements are interconnected in any combination of series and parallel interconnections.

3. A device as in claim 1 wherein said more than one sensing elements are electrically interconnected together in parallel.

4. A device as in claim 1 wherein each sensing element of said more than one sensing elements is selected from the list:

a. comb fingers attached to at least one mass and attached to at least one spring

b. membrane

c. cantilever, or

d. any combination.

5. A device as in claim 1 wherein each sensing element of said more than one sensing elements comprises comb fingers attached to at least one mass and attached to at least two springs.

6. A device as in claim 1 wherein said electrical interconnections are provided by an arrangement selected from the following list:

a. all sensing elements are interconnected by wirebonding,

b. all sensing elements are interconnected with at least one device layer between the device substrate and the device elements,

c. all sensing elements are electrically interconnected by one or more layers of said sensing elements,

d. all sensing elements are interconnected with at least one device layer deposited above said device elements,

e. all sensing elements are interconnected with at least one device layer on at least one separate substrate, wherein said at least one separate substrate is bonded to at least one sensing element substrate,

f. any combination of the above arrangements.

7. A device as in claim 6 wherein said at least one separate substrate is bonded to said at least one sensing element substrate with a bonding technique selected from the following list:

a. gold bump bonding,

b. solder bump bonding,

c. indium bump bonding,

d. polymer bump bonding,

e. bump bonding with gold on at least one bonding surface,

f. bump bonding with solder on at least one bonding surface,

g. bump bonding with indium on at least one bonding surface,

h. bump bonding with conductive polymer on at least one bonding surface,

i. bump bonding wherein an adhesive provides the majority of the bonding strength between said substrates,

j . bump bonding wherein a solder bond provides the majority of the bonding strength between said substrates,

k. bump bonding wherein a gold thermal compression bond provides the majority of the bonding strength between said substrates,

l. bump bonding wherein a gold compression bond provides the majority of the bonding strength between said substrates,

m. bump bonding wherein the majority of the bonding strength between said substrates is provided from a bonding process involving the formation of at least one amalgam,

n. bump bonding wherein the majority of the bonding strength between said substrates is provided from a cold welding process,

o. any combination of the above bump bonding processes.

8. A device as in claim 7 wherein the bonding process also seals the sensing elements.

9. A device as in claim 8 wherein the sensing elements are hermetically sealed.

10. A device as in claim 8 wherein the sensing element are vacuum-tight sealed.

11. A device as in claim 7 wherein said bonding process seals the sensing elements by surrounding said sensing elements by at least one seal ring.

12. A device as in claim 11 wherein said at least one seal ring is fabricated using the same device layers as the structures for interconnecting the substrates.

14. A method as in claim 13 wherein said more than one sensing elements are electrically interconnected together in an arrangement selected from the following list:

a. all sensing elements are interconnected in series,

b. all sensing elements are interconnected in parallel,

c. all sensing elements are interconnected in any combination of series and parallel interconnections.

15. A method as in claim 13 wherein said more than one sensing elements are electrically interconnected in parallel.

16. A method as in claim 13 wherein each sensing element of said more than one sensing elements are selected from the list:

a. comb fingers attached to at least one mass and attached to at least one spring,

b. membrane,

c. cantilever, or

d. any combination.

17. A method as in claim 13 wherein each sensing element of said more than one sensing elements comprises comb fingers attached to at least one mass and attached to at least two springs.

13. A method of fabricating an accelerometer wherein more than one sensing elements are electrically interconnected together.