Semiconductor physical quantity sensor

• US 20020144554A1
• Filed: 01/18/2002
• Published: 10/10/2002
• Est. Priority Date: 01/18/2001
• Status: Active Grant

• Current Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Original Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Inventors: Saito, Kazunori, Ueyanagi, Katsumichi, Ashino, Kimihiro, Uematsu, Katsuyuki, Nishikawa, Mutsuo
• Granted Patent: US 6,962,081 B2
• Time in Patent Office: Days
• US Class Current: 73/700
• CPC Class Codes: G01L 19/0084 to the outside of the housing other details about the housing see G01L19/14
• CPC Class Codes: G01L 19/069 Protection against electromagnetic or electrostatic interferences
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/123 by piezo-resistive elements, e.g. semiconductor strain gauges
• CPC Class Codes: H01L 2224/05553 being rectangular
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding

Abstract

An inexpensive, accurate, and reliable semiconductor physical quantity sensor having improved resistance to noise is provided, wherein pads that have been pulled down to ground inside a semiconductor chip are arranged closer to a ground pad, while pads and that have been pulled up to a power supply inside the chip are arranged closer to a power supply pad. Of the digital input/output pads that have undergone digital trimming to obtain a predetermined output, the pulled-down pads and the ground pad are electrically connected to a ground terminal outside the chip via internal exposed portions, wires, and a ground-connecting external wire. The pulled-up pads and the power supply pad are electrically connected to a power supply terminal outside the chip via the internal exposed portions, the wires, and a power-supply-connecting external wire. Terminals may be electrically connected together on a package or a mounting substrate.

Claims

1. A semiconductor physical quantity sensor that converts digital data into analog data for digital trimming in response to a signal from a sensor circuit indicating that an analog quantity has been detected, the semiconductor physical quantity sensor comprising:

digital input/output pads that have undergone digital trimming in order to obtain a predetermined output;

wherein pads that are pulled down to a ground inside a semiconductor chip and a ground pad are electrically connected to a ground terminal outside said semiconductor chip, and

wherein pads that have been pulled up to a power supply inside a semiconductor chip and a power supply pad are electrically connected to a power supply terminal outside said semiconductor chip.

2. The semiconductor physical quantity sensor according to claim 1, wherein the connections between the pads that have been pulled down inside the semiconductor chip and the ground terminal as well as the connections between the pads that have been pulled up inside the semiconductor chip and the power supply terminal are each established by electrically connecting the terminals together on a package.

3. The semiconductor physical quantity sensor according to claim 1, wherein the connections between the pads that have been pulled down inside the semiconductor chip and the ground terminal as well as the connections between the pads that have been pulled up inside the semiconductor chip and the power supply terminal are each established by an electric connection on a mounting substrate.

4. The semiconductor physical quantity sensor according to any of claims 1 to 3, wherein as a layout on said semiconductor chip, of the digital input/output pads, the pads that have been pulled down inside said semiconductor chip are arranged closer to the ground pad, and the pads that have been pulled up inside said semiconductor chip are arranged closer to the power supply pad.

5. The semiconductor physical quantity sensor according to any of claims 1 to 3, wherein the semiconductor physical quantity sensor is a pressure or an acceleration sensor of the semiconductor strain gauge type.

13. The semiconductor physical quantity sensor according to claim 4, wherein the semiconductor physical quantity sensor is a pressure or an acceleration sensor of the semiconductor strain gauge type.

6. A semiconductor physical quantity sensor comprising:

a semiconductor chip placed on at least on of a resin case and a substrate via a pedestal, and

wherein both first pads in said semiconductor chip which are to be pulled down and a ground pad are electrically connected to a ground outside said semiconductor chip.

7. The semiconductor physical quantity sensor according to claim 6, wherein characterized in that both second pads in said semiconductor chip which are to be pulled up and a power supply pad are electrically connected to a power supply outside said semiconductor chip

8. A semiconductor physical quantity sensor comprising:

a semiconductor chip placed on at least one of a resin case and a substrate via a pedestal, and

wherein both second pads in said semiconductor chip which are to be pulled up and a power supply pad are electrically connected to a power supply outside said semiconductor chip.

9. A semiconductor physical quantity sensor comprising:

a semiconductor chip placed on a resin case via a pedestal, said resin case including lead frames that are insert-molded, and within said resin case are formed both a ground-connecting external wire through which a ground pad of said semiconductor chip and first pads to be pulled down are electrically connected, and an power-supply-connecting external wires through which a power supply pad of said semiconductor chip and second pads to be pulled up are electrically connected;

wherein said ground-connecting external wire is connected to a ground lead frame, whereas said power-supply-connecting external wire is connected to a power supply lead frame.

10. The semiconductor physical quantity sensor according to claim 9, wherein said ground-connecting external wire and said power-supply-connecting external wire are each connected to corresponding lead frames outside said resin case

11. The semiconductor physical quantity sensor according to claims 9 to 10, wherein said ground-connecting external wire and said ground lead frame are integrated, and said power-supply-connecting external wire and said power supply lead frame are integrated

12. A semiconductor physical quantity sensor comprising:

a conductor pattern for ground connections, a conductor pattern for power supply connections, and an output conductor pattern are formed on a substrate;

wherein lead frames corresponding to a ground pad of a semiconductor chip placed on a resin case and first pads thereof which are to be pulled down are connected to said conductor pattern for ground connections; and

wherein lead frames corresponding to a power supply pad of said semiconductor chip and second pads thereof which are to be pulled up are electrically connected to said conductor pattern for power supply connections, and

wherein output lead frame corresponding to an output pad of said semiconductor chip is electrically connected to the output conductor pattern.