UV curable adhesives containing ceramic microspheres

• US 20020144771A1
• Filed: 03/04/2002
• Published: 10/10/2002
• Est. Priority Date: 02/11/1999
• Status: Abandoned Application

• Current Assignee: Joseph Paul Kuczynski
• Original Assignee: Joseph Paul Kuczynski
• Inventors: Kuczynski, Joseph Paul
• Application Number:
  US10/090,214
• Publication Number:
  US 20020144771A1
• Time in Patent Office: Days
• US Class Current: 156/272.2
• CPC Class Codes: B29C 65/4875 being spherical, e.g. particles or powders
• CPC Class Codes: B29C 65/7826 said distance pieces being non-integral with the parts to be joined, e.g. particles
• CPC Class Codes: C09J 11/04 inorganic
• CPC Class Codes: C09J 2301/412 presence of microspheres
• CPC Class Codes: C09J 5/00 Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
• CPC Class Codes: H05K 3/305 Affixing by adhesive

Abstract

A photocurable adhesive composition is disclosed which includes a photocurable adhesive and an effective amount of a ceramic-containing modifier which does not substantially reduce a photocure rate of the photocurable adhesive. The modifier alters the flow properties of the composition to facilitate controlled dispensing of the uncured adhesive composition. The modifier alters the thermal expansion properties of the cured composition to reduce bondline stress. The preferred modifier includes inert, alkali alumino-silicate microspheres. A method of adhesive bonding is also disclosed in which an adherend is adhered to a substrate using a photocurable adhesive composition containing a photocurable adhesive and microspheres.

Claims

1. A method of adhesive bonding comprising:

providing an adherend;

providing a substrate;

providing a photocurable adhesive;

contacting said adherend and said substrate with said photocurable adhesive composition containing an adhesive and an effective amount of microspheres; and

photocuring said adhesive composition to form an at least partially cured adhesive composition whereby said adherend and substrate are bonded together.

2. The method of claim 1 wherein said photocuring includes exposing said adhesive composition to an effective dose of ultraviolet radiation for a predetermined time.

3. The method of claim 2 wherein said dose is 40-120 J/cm².

4. The method of claim 3 wherein said dose is 90-110 J/cm².

5. The method of claim 1 wherein said at least partially cured adhesive composition is at least 90% fully cured.

6. The method of claim 5 wherein said at least partially cured adhesive composition is at least 95% fully cured.

7. The method of claim 1 wherein said microspheres are made of a ceramic material.

8. The method of claim 7 wherein said microspheres are solid substantially throughout their volume.

9. The method of claim 8 wherein the diameters of said microspheres are about 40 microns or less.

10. The method of claim 1 wherein said effective amount is about 35-75 wt. % of said adhesive composition.

11. The method of claim 10 wherein said effective amount is about 60-65 wt. % of said adhesive composition.

12. The method of claim 1 wherein said microspheres are made from silicate.

13. The method of claim 12 wherein said silicate is an alumino-silicate.

14. The method of claim 13 wherein said alumino-silicate is an alkali alumino-silicate.

15. The method of claim 1 wherein the adhesive composition is a pseudoplastic material.

16. The method of claim 1 wherein the thermal coefficient of expansion of the adhesive composition in the photocured state is less than that of said adhesive in the photocured state.