Autonomous sensor system for remote sensing and signal transmission

• US 20020145538A1
• Filed: 01/30/2001
• Published: 10/10/2002
• Est. Priority Date: 01/30/2001
• Status: Active Grant

• Current Assignee: Oceana Sensor Technologies, Inc. (Amphenol Corporation)
• Original Assignee: Oceana Sensor Technologies, Inc. (Amphenol Corporation)
• Inventors: Richard W., Lally, Bocko, Mark F.
• Granted Patent: US 6,747,572 B2
• Time in Patent Office: Days
• US Class Current: 340/870.28
• CPC Class Codes: G01K 1/024 for remote indication
• CPC Class Codes: G01K 7/00 Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat giving results other than momentary value of temperature G01K3/00 ; Power supply therefor, e.g. using thermoelectric elements
• CPC Class Codes: H04Q 2209/886 using energy harvesting, e.g. solar, wind or mechanical

Abstract

An autonomous sensor system is provided for powering sensors using thermoelectric modules driven by thermal energy. The system includes solid-state thermoelectric (TE) modules for the conversion of thermal energy to electrical energy. The TE modules are composed of p-type and n-type semiconductors that are interdigitated so that the p-type and n-type elements form thermocouples. The TE modules derive electrical power from thermal energy available in the immediate environment. The system also includes sensors that are powered by the TE module, wherein a corresponding free space signal is generated.

Claims

1. An autonomous sensor system for an operating environment, comprising:

(a) a thermoelectric module selected to generate electricity from thermal energy in the operating environment;

(b) a sensor for generating a sensor signal; and

(c) a transmitter connected to the thermoelectric module and the sensor for receiving the sensor signal and transmitting a wireless corresponding signal.

2. The sensor system of claim 1, wherein the thermoelectric module includes an array of p-type semiconductor elements and an array of n-type semiconductor elements.

3. The sensor system of claim 2, wherein the p-type semiconductor elements have a height that is less than or equal to the greater of a remaining lateral dimension of the semiconductor element.

4. The sensor system of claim 2, where the array of p-type elements and the array of n-type elements have density of more than 1000 per square centimeter.

5. The sensor system of claim 1, where the thermoelectric module includes approximately 300 p-type, n-type semiconductor couples.

6. The sensor system of claim 2, wherein each of the p-type semiconductor elements and n-type semiconductor elements have a length less than approximately 0.01 centimeters, a width and a height less than approximately 0.01 centimeters.

7. The sensor system of claim 1, further comprising a radiator thermally coupled to the thermoelectric module.

8. The sensor system of claim 7, wherein the radiator is one of a phase change and a passive heat sink.

9. The sensor system of claim 1, wherein the sensor includes one of a mechanical, chemical, thermal, optical, acoustic, electrical, nuclear, magnetic and electromagnetic sensor.

10. The sensor system of claim 1, further comprising one of a voltage converter and a regulator operably connected to the thermoelectric module.

11. The sensor system of claim 1, farther comprising a signal processor intermediate the sensor and the transmitter.

12. The sensor system of claim 1, further comprising a fan powered by the thermoelectric module.

13. The sensor system of claim 1, wherein the thermoelectric module is thermally coupled to scavenge thermal energy from the operating environment.

14. The sensor system of claim 1, wherein the thermoelectric module is thermally coupled to dedicated thermal energy from the operating environment.

16. The sensor system of claim 15, further comprising a signal conditioning circuit intermediate the sensor and the wireless data link.

17. The sensor system of claim 16, wherein the signal conditioning circuit includes one of an amplifier, a filter, and an analog to digital converter and a digital signal processor.

18. The sensor system of claim 15, wherein the radiator is one of a phase change and passive heat sink.

19. The sensor system of claim 15, wherein the sensor comprises one of a mechanical, chemical, thermal, optical, acoustic, electrical, nuclear, magnetic and electromagnetic sensor.

20. The sensor system of claim 15, further comprising one of a voltage converter and regulator operably connected to the thermoelectric module.

21. The sensor system of claim 15, wherein the radiator is an active cooler including a fan.

23. The method of claim 20, further comprising interdigitating the first array of p-type semiconductor elements with the second array of n-type semiconductor elements.

24. The method of claim 20, further comprising forming the first array of p-type semiconductor elements with each p-type semiconductor element having a height that is less than or equal to a greater of the remaining lateral dimension of the semiconductor element.

25. The method of claim 20, further comprising forming the second array of n-type semiconductor elements with each n-type semiconductor element having a height that is less than or equal to the greater of the remaining lateral dimension of the semiconductor element.

15. A sensor system for an operating environment, comprising:

(a) a thermoelectric module having a first side and a second side;

(b) a radiator thermally coupled to the second side to provide a sufficient temperature differential between the first side and the second side to create a voltage difference across the thermoelectric module;

(c) a sensor electrically powered by the thermoelectric module to generate a signal; and

(d) a wireless data link connected to the sensor and powered by the thermoelectric module to generate a free space transmission corresponding to the signal.

22. A method of forming a thermoelectric module having a plurality of p-n semiconductor couples, comprising:

(a) forming a first array of p-type semiconductor elements on a first substrate;

(b) forming a second array of n-type semiconductor elements on a second substrate; and

(c) connecting the first substrate and the second substrate to dispose the first array of p-type semiconductor elements and the second array of n-type semiconductor elements intermediate the first substrate and the second substrate.

26. A thermoelectric module for generating a voltage difference from exposure to a temperature differential, comprising:

(a) a first array of p-type semiconductor elements thermally coupled to a second array of n-type semiconductor elements, where each p-type and each n-type semiconductor element has a height that is less than or equal to the greater of a remaining lateral dimension of the semiconductor element.

27. A thermoelectric module for generating a voltage difference from a temperature differential, comprising a multitude of p-n semiconductor couples having a length, a width and a height dimension, each of the length, width and height dimensions being less than approximately 0.01 centimeters.

28. A thermoelectric module for generating a voltage difference from a temperature differential, comprising a p-n semiconductor couple density greater than 1,000 p-n semiconductor couples per square centimeter.