Image pickup apparatus

• US 20020145676A1
• Filed: 06/18/2001
• Published: 10/10/2002
• Est. Priority Date: 02/26/2001
• Status: Active Grant

• Current Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Inventors: Miyake, Hiroyuki, Sugiura, Hiroaki, Kuno, Tetsuya
• Granted Patent: US 7,009,654 B2
• Time in Patent Office: Days
• US Class Current: 348/340
• CPC Class Codes: G02B 7/02 for lenses supports for magnifying lenses G02B25/002
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/02325 the optical elements not being integrated nor being directly associated with the device
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof

Abstract

An image pickup apparatus captures an image from a subject without a focus-adjusting mechanism. An image pickup element has opposed first and second surfaces and an image region formed in the first surface. An optical system causes the image light from the subject to form an image on the image region. A supporting member has a first abutment portion that engages the optical system with nothing sandwiched therebetween, and a second abutment portion that engages the image pickup element with nothing sandwiched therebetween, thereby accurately positioning the optical system relative to the image pickup element. The second abutment portion abuts an area on the first surface except for the image region. A circuit board is fixed to the supporting member and electrically connected to the image pickup element. The circuit board has an opening formed therein such that the image region is exposed through the opening.

Claims

1. An image pickup apparatus comprising:

an image pickup element having a first surface and a second surface opposite to the first surface, said image pickup element having an image region formed in the first surface;

an optical system that causes image light from a subject to form an image on the image region;

a supporting member that engages said image pickup element and said optical system, said supporting member having a first abutment portion that directly abuts said optical system and a second abutment portion that directly abuts said image pickup element.

2. The image pickup apparatus according to claim 1, wherein the second abutment portion abuts an area on the first surface except for the image region.

3. The image pickup apparatus according to claim 1, further comprising a first holding member that engages said optical system and said supporting member such that said optical system is sandwiched between the first holding member and said supporting member.

4. The image pickup apparatus according to claim 3, further comprising a circuit board;

wherein said circuit board is fixed to said supporting member and electrically connected to said image pickup element, said circuit board having an opening formed therein such that said image region is exposed through the opening.

5. The image pickup apparatus according to claim 4, wherein the second abutment portion is a projection that extends through the opening.

6. The image pickup apparatus according to claim 4, further comprising a second holding member that engages the second surface and said supporting member such that said image pickup element is sandwiched between the second holding member and said supporting member.

7. The image pickup apparatus according to claim 4, wherein said supporting member, circuit board, and image pickup element are bonded together by an adhesive that is applied to said supporting member, circuit board, and image pickup element except for the second abutment portion and the area on the first surface that abuts the second abutment portion.

8. The image pickup apparatus according to claim 7, wherein the adhesive is a UV-curing type adhesive.