Multi-layer substrates and fabrication processes
First Claim
Patent Images
1. A microelectronic component comprising:
- (a) first and second substrates, each such substrate including at least one dielectric layer and electrically conductive features including at least one of;
(i) one or more traces extending in one or more horizontal directions along the at least one dielectric layer; and
(ii) one or more electrically conductive potential planes extending in horizontal directions along the at least one dielectric layer;
(b) a first intermediate dielectric layer disposed between said first and second substrates;
(c) a first set of elongated, electrically conductive leads extending through said first intermediate layer and electrically connected between said conductive features of said first and second substrates.
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Abstract
Multi-layer components such as circuit panels are fabricated by connecting conductive features such as traces one two or more superposed substrates using leads extending through an intermediate dielectric layer. The leads can be closely spaced to provide a high density vertical interconnection, and can be selectively connected to provide customization of the structure.
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Citations
28 Claims
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1. A microelectronic component comprising:
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(a) first and second substrates, each such substrate including at least one dielectric layer and electrically conductive features including at least one of;
(i) one or more traces extending in one or more horizontal directions along the at least one dielectric layer; and
(ii) one or more electrically conductive potential planes extending in horizontal directions along the at least one dielectric layer;
(b) a first intermediate dielectric layer disposed between said first and second substrates;
(c) a first set of elongated, electrically conductive leads extending through said first intermediate layer and electrically connected between said conductive features of said first and second substrates. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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26. A substrate for use in making a multi-layer circuit panel, said substrate including:
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(a) a body having a lead-bearing surface;
(b) a plurality of leads extending along said lead-bearing surface, said leads having fixed ends attached to said body and free ends movable with respect to said body, said leads extending generally in a first horizontal direction; and
(c) a plurality of electrically-conductive traces including a nearest layer of traces disposed on or adjacent to said lead-bearing surface, at least some of the traces in said nearest layer in the vicinity of said leads extending generally in said first horizontal direction.
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27. A substrate for use in making a multi-layer circuit panel, said substrate including:
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(a) a body having a lead-bearing surface;
(b) a plurality of leads extending along said lead-bearing surface, said leads having fixed ends attached to said body and free ends movable with respect to said body; and
(c) a plurality of electrically-conductive traces including a nearest layer of traces disposed adjacent to said lead-bearing surface, said body including a dielectric cover layer overlying said nearest layer of traces, said free ends of said leads overlying said cover layer and one or more of said traces.
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28. A method of making a multi-layer circuit panel comprising:
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(a) providing a first substrate and a second substrate, each such substrate including at least one dielectric layer and electrically conductive features including at least one of;
(i) one or more traces extending in one or more horizontal directions along the at least one dielectric layer; and
(ii) one or more electrically conductive planes extending in horizontal directions along the at least one dielectric layer;
(b) providing a first set of elongated, vertically-extensive leads extending at least partially between said first and second substrates and electrically connected between the electrically conductive features on said first and second substrates; and
(c) injecting a flowable material around said leads and curing said flowable material to form a first intermediate layer between said substrates surrounding said first set of leads.
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Specification