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Multi-layer substrates and fabrication processes

  • US 20020148639A1
  • Filed: 06/11/2002
  • Published: 10/17/2002
  • Est. Priority Date: 07/07/1994
  • Status: Active Grant
First Claim
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1. A microelectronic component comprising:

  • (a) first and second substrates, each such substrate including at least one dielectric layer and electrically conductive features including at least one of;

    (i) one or more traces extending in one or more horizontal directions along the at least one dielectric layer; and

    (ii) one or more electrically conductive potential planes extending in horizontal directions along the at least one dielectric layer;

    (b) a first intermediate dielectric layer disposed between said first and second substrates;

    (c) a first set of elongated, electrically conductive leads extending through said first intermediate layer and electrically connected between said conductive features of said first and second substrates.

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