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Method and apparatus for fabricating printed circuit board using atmospheric pressure capillary discharge plasma shower

  • US 20020148816A1
  • Filed: 08/23/2001
  • Published: 10/17/2002
  • Est. Priority Date: 04/17/2001
  • Status: Abandoned Application
First Claim
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1. A method of fabricating a printed circuit board for desmearing holes in a copper laminated board and forming a conductive material in the holes using an atmospheric pressure capillary discharge plasma apparatus having at least one first electrode receiving a power source, a dielectric body having first and second sides, the first side coupled to the first electrode and the second side having at least one capillary extending to a direction of the first side of the dielectric body, and each capillary substantially aligned with each electrode, and a second electrode electrically coupled to the first electrode, the method comprising the steps of:

  • drilling the copper laminated board to remove at least a portion of the copper laminated board;

    placing the copper laminated board having the holes in the apparatus;

    applying a potential to the plasma generator;

    providing a working gas in close proximity to the copper laminated board;

    generating capillary discharge plasma out of the capillary, thereby treating the copper laminated board with the atmospheric pressure capillary discharge plasma to remove resin residues in the holes; and

    forming the conductive material on the copper laminated board including in the holes.

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