Method and apparatus for fabricating printed circuit board using atmospheric pressure capillary discharge plasma shower
First Claim
1. A method of fabricating a printed circuit board for desmearing holes in a copper laminated board and forming a conductive material in the holes using an atmospheric pressure capillary discharge plasma apparatus having at least one first electrode receiving a power source, a dielectric body having first and second sides, the first side coupled to the first electrode and the second side having at least one capillary extending to a direction of the first side of the dielectric body, and each capillary substantially aligned with each electrode, and a second electrode electrically coupled to the first electrode, the method comprising the steps of:
- drilling the copper laminated board to remove at least a portion of the copper laminated board;
placing the copper laminated board having the holes in the apparatus;
applying a potential to the plasma generator;
providing a working gas in close proximity to the copper laminated board;
generating capillary discharge plasma out of the capillary, thereby treating the copper laminated board with the atmospheric pressure capillary discharge plasma to remove resin residues in the holes; and
forming the conductive material on the copper laminated board including in the holes.
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Accused Products
Abstract
A method and apparatus for treating a workpiece using capillary discharge plasma are disclosed in the present invention. More specifically, a method of desmearing holes in a copper laminated board and forming a conductive material in the holes using an atmospheric pressure capillary discharge plasma apparatus having at least one first electrode receiving a power source, a dielectric body having first and second sides, the first side coupled to the first electrode and the second side having at least one capillary extending to a direction of the first side of the dielectric body, and each capillary substantially aligned with each electrode, and a second electrode electrically coupled to the first electrode, the method comprising the steps of drilling the copper laminated board to remove at least a portion of the copper laminated board, placing the copper laminated board having the holes in the apparatus, applying a potential to the plasma generator, providing a working gas in close proximity to the copper laminated board, generating capillary discharge plasma out of the capillary, thereby treating the copper laminated board with the atmospheric pressure capillary discharge plasma to remove resin residues in the holes, and forming the conductive material on the copper laminated board including in the holes.
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Citations
34 Claims
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1. A method of fabricating a printed circuit board for desmearing holes in a copper laminated board and forming a conductive material in the holes using an atmospheric pressure capillary discharge plasma apparatus having at least one first electrode receiving a power source, a dielectric body having first and second sides, the first side coupled to the first electrode and the second side having at least one capillary extending to a direction of the first side of the dielectric body, and each capillary substantially aligned with each electrode, and a second electrode electrically coupled to the first electrode, the method comprising the steps of:
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drilling the copper laminated board to remove at least a portion of the copper laminated board;
placing the copper laminated board having the holes in the apparatus;
applying a potential to the plasma generator;
providing a working gas in close proximity to the copper laminated board;
generating capillary discharge plasma out of the capillary, thereby treating the copper laminated board with the atmospheric pressure capillary discharge plasma to remove resin residues in the holes; and
forming the conductive material on the copper laminated board including in the holes. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 13)
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10. A method of fabricating a printed circuit board for forming a solder mask on a copper laminated board using an atmospheric pressure capillary discharge plasma apparatus having at least one first electrode receiving a power source, a dielectric body having first and second sides, the first side coupled to the first electrode and the second side having at least one capillary extending to a direction of the first side of the dielectric body, and each capillary substantially aligned with each electrode, and a second electrode electrically coupled to the first electrode, the method comprising the steps of:
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forming a circuit pattern on the copper laminated board;
placing the copper laminated board in the apparatus;
applying a potential to the plasma generator;
providing a working gas in close proximity to the copper laminated board;
generating capillary discharge plasma out of the capillary, thereby treating the copper laminated board with the atmospheric pressure capillary discharge plasma;
forming a solder mask material on the treated copper laminated board including the circuit pattern; and
curing the solder mask material to form a solder mask on the copper laminated board. - View Dependent Claims (11, 12, 14, 15, 16, 18, 19, 20, 21, 22, 23, 25, 26, 27, 28, 29, 30, 31)
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17. A method of fabricating a printed circuit board for forming a circuit pattern on a copper laminated board using an atmospheric pressure capillary discharge plasma apparatus having at least one first electrode receiving a power source, a dielectric body having first and second sides, the first side coupled to the first electrode and the second side having at least one capillary extending to a direction of the first side of the dielectric body, and each capillary substantially aligned with each electrode, and a second electrode electrically coupled to the first electrode, the method comprising the steps of:
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pre-treating the copper laminated board;
laminating a dry film resist on the pretreated copper laminated board;
patterning the dry film resist on the copper laminated board;
selectively removing a copper on the copper laminated board using the patterned dry film resist as a mask;
stripping the patterned dry film resist from the copper laminated board;
placing the copper laminated board in the apparatus;
applying a potential to the plasma-generator;
providing a working gas in close proximity to the copper laminated board; and
generating capillary discharge plasma out of the capillary, thereby treating the copper laminated board with the atmospheric pressure capillary discharge plasma to remove residues of the dry film resist on the copper laminated board.
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24. A method of fabricating a printed circuit board for wire bonding to the printed circuit board using an atmospheric pressure capillary discharge plasma apparatus having at least one first electrode receiving a power source, a dielectric body having first and second sides, the first side coupled to the first electrode and the second side having at least one capillary extending to a direction of the first side of the dielectric body, and each capillary substantially aligned with each electrode, and a second electrode electrically coupled to the first electrode, the method comprising the steps of:
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plating a conductive layer on the printed circuit board;
processing a surface of the conductive layer as desired;
cleaning the processed conductive layer;
placing the copper laminated board in the apparatus;
applying a potential to the plasma generator;
providing a working gas in close proximity to the copper laminated board;
generating capillary discharge plasma out of the capillary, thereby treating the conductive layer with the atmospheric pressure capillary discharge plasma to remove contaminants on the surface the conductive layer; and
bonding a wire or a solder ball to the treated conductive layer.
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32. An apparatus for fabricating a printed circuit board using atmospheric pressure capillary discharge plasma shower, comprising:
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a loading unit for loading and transferring the printed circuit board;
a process unit for treating the printed circuit board including at least one atmospheric plasma generator having at least one first electrode receiving a power source, a dielectric body having first and second sides, the first side coupled to the first electrode and the second side having at least one capillary extending to a direction of the first side of the dielectric body, and each capillary substantially aligned with each electrode, and a second electrode electrically coupled to the first electrode;
a display unit for displaying working conditions of the apparatus; and
an unloading unit for transferring the treated printed circuit board. - View Dependent Claims (33, 34)
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Specification