Method for manufacturing a circuit board capable of protecting an MR magnetic head therein against electrostatic breakdown and a method for manufacturing a magnetic head using the same

• US 20020149888A1
• Filed: 04/10/2002
• Published: 10/17/2002
• Est. Priority Date: 08/02/1999
• Status: Active Grant

• Current Assignee: TDK Corporation
• Original Assignee: Michiaki Moroe, Michiharu Motonishi
• Inventors: Motonishi, Michiharu, Moroe, Michiaki
• Granted Patent: US 6,902,099 B2
• Time in Patent Office: Days
• US Class Current: 360/323
• CPC Class Codes: G11B 5/3103 Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing
• CPC Class Codes: G11B 5/3903 using magnetic thin film layers or their effects, the films being part of integrated structures
• CPC Class Codes: G11B 5/40 Protective measures on heads, e.g. against excessive temperature G11B5/31 takes precedence; protection against wear G11B5/255 ; protective structure of the head: see under structures, e.g. G11B5/3106
• CPC Class Codes: G11B 5/4833 Structure of the arm assembly, e.g. load beams, flexures, parts of the arm adapted for controlling vertical force on the head G11B5/484 takes precedence
• CPC Class Codes: G11B 5/486 with provision for mounting or arranging electrical conducting means or circuits on or along the arm assembly
• CPC Class Codes: H05K 1/0259 Electrostatic discharge [ESD] protection
• CPC Class Codes: H05K 1/0293 Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
• CPC Class Codes: H05K 2201/0305 Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
• CPC Class Codes: H05K 2203/0195 Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
• CPC Class Codes: H05K 2203/0278 Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
• CPC Class Codes: H05K 2203/173 Adding connections between adjacent pads or conductors, e.g. for modifying or repairing
• CPC Class Codes: H05K 3/3457 Solder materials or compositions; Methods of application thereof

Abstract

The invention provides a magnetic head capable of positively preventing electrostatic breakdown of an MR magnetic head device, and a method of manufacturing the magnetic head. A circuit board comprises at least a pair of leads for constructing a circuit, lands connected respectively to the leads, and solder bumps formed respectively on the lands. The solder bumps are arranged in an adjacent relationship and, when the solder bumps are crushed, peripheral portions of the solder bumps are pressed or spread so as to overlap with each other. The magnetic head includes the circuit board.

Claims

1. A circuit board comprising at least a pair of leads for constructing a circuit, lands connected respectively to said pair of leads, and solder bumps formed respectively on said lands,

wherein said solder bumps are arranged in an adjacent relationship and, when said solder bumps are crushed, peripheral portions of said solder bumps are spread to overlap with each other.

2. A circuit board comprising at least a pair of leads for constructing a circuit, lands formed for connection respectively to said pair of leads, and a solder bridge for electrically interconnecting said lands,

wherein said solder bridge is formed by peripheral portions of solder bumps formed respectively on said leads and overlapped with each other.

3. A circuit board according to claim 2, wherein said solder bridge is formed by crushing said solder bumps formed respectively on said lands to an extent that crushed peripheral portions of said solder bumps are overlapped with each other.

4. A circuit shorting method for a circuit board comprising at least a pair of leads for constructing a circuit, lands connected respectively to said pair of leads, and solder bumps formed respectively on said lands and positioned adjacent to each other, said method comprising the steps of:

crushing a first solder bump such that a peripheral portion of the first solder bump is spread outward in a radial direction to approach a second solder bump; and

crushing the second solder bump such that a peripheral portion of the second solder bump is spread outward in a radial direction to contact with the peripheral portion of the first solder bump, whereby said pair of leads are shorted.

5. A circuit shorting method according to claim 4, wherein said step of crushing the second solder bump is performed until a part of the peripheral portion of the second solder bump overlaps the peripheral portion of the first solder bump.

6. A circuit shorting method according to claim 4, wherein said first and said second solder bumps are each crushed under heating.

7. A circuit shorting method according to claim 4, wherein said first and said second solder bumps are each crushed under heating and rubbing.

8. A circuit shorting method according to claim 5, wherein said first and said second solder bumps are each crushed under heating.

9. A circuit shorting method according to claim 5, wherein said first and said second solder bumps are each crushed under heating and rubbing.

10. A magnetic head in which a slider including an MR magnetic head device is attached to a fore end of a load beam, a circuit board is attached to an opposite end of said load beam, and a pair of lead lines extended from said MR magnetic head device are connected to said circuit board,

said circuit board comprising at least a pair of leads connected respectively to said lead lines and constructing a circuit including said MR magnetic head device in cooperation with said lead lines, lands connected respectively to said leads, and solder bumps formed respectively on said lands,

wherein said solder bumps are arranged in an adjacent relationship and, when said solder bumps are crushed, peripheral portions of said solder bumps are spread so as to overlap with each other.

11. A magnetic head in which a slider including an MR magnetic head device is attached to a fore end of a load beam, a circuit board is attached to an opposite end of said load beam, and a pair of lead lines extended from said MR magnetic head device are connected to said circuit board,

said circuit board comprising at least a pair of leads connected respectively to said lead lines and constructing a circuit including said MR magnetic head device in cooperation with said lead lines, lands connected respectively to said leads, and a solder bridge for electrically interconnecting said lands,

wherein said solder bridge is formed by peripheral portions of solder bumps formed respectively on said leads and overlapped with each other.

12. A magnetic head according to claim 11, wherein said solder bridge is formed by crushing said solder bumps formed respectively on said lands to an extent that crushed peripheral portions of said solder bumps are overlapped with each other.

14. A method of manufacturing a magnetic head according to claim 13, wherein said step of crushing the second solder bump is performed until a part of the peripheral portion of the second solder bump overlaps the peripheral portion of the first solder bump.

15. A method of manufacturing a magnetic head according to claim 13, wherein said first and said second solder bumps are each crushed under heating.

16. A method of manufacturing a magnetic head according to claim 13, wherein said first and said second solder bumps are each crushed under heating and rubbing.

17. A method of manufacturing a magnetic head according to claim 14, wherein said first and said second solder bumps are each crushed under heating.

18. A method of manufacturing a magnetic head according to claim 14, wherein said first and said second solder bumps are each crushed under heating and rubbing.

13. A method of manufacturing a magnetic head in which a slider including an MR magnetic head device is attached to a fore end of a load beam and a circuit board is attached to an opposite end of said load beam,

said circuit board comprising at least a pair of leads connected to said MR magnetic head device, lands connected respectively to said pair of leads, and solder bumps formed respectively on said lands and positioned adjacent to each other, said method comprising the steps of:

crushing a first solder bump such that a peripheral portion of the first solder bump is spread outward in a radial direction to approach a second solder bump; and

crushing the second solder bump such that a peripheral portion of the second solder bump is pressed to spread outward in a radial direction to contact with the peripheral portion of the first solder bump, whereby said pair of leads are shorted.