Integrated circuit with power supply test interface
First Claim
1. An integrated circuit assembly, comprising a semi-conductor integrated circuit chip with a power supply connection;
- a carrier to which the integrated circuit chip is attached;
an external power supply terminal;
a current path on the carrier, connecting the external power supply terminal and the power supply connection;
a magnetic field sensor on the carrier in a vicinity of the current path, but outside the integrated circuit chip, for sensing a magnetic field generated by a current through the current path;
a test-accessible electronic interface to the magnetic field sensor, for testing presence of the current.
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Accused Products
Abstract
An integrated circuit assembly contains a carrier and a semi-conductor integrated circuit chip 10. A current path on the carrier supplies power to power supply connection of the chip. A magnetic field sensor is provided on the carrier in a vicinity of the current path, for sensing a magnetic field generated by a current through the current path. The assembly contains test-accessible electronic interface to the magnetic field sensor, for testing presence of the current. Preferably the sensors are integrated on the carrier by depositing magneto resistive material and patterning the material so as to provide sensors in the vicinity of current paths. Also preferably, the carrier is an interposer 12 with connecting wiring, which is packaged with one or more integrated circuit chips before mounting the interposer on a printed circuit board 19.
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Citations
14 Claims
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1. An integrated circuit assembly, comprising
a semi-conductor integrated circuit chip with a power supply connection; -
a carrier to which the integrated circuit chip is attached;
an external power supply terminal;
a current path on the carrier, connecting the external power supply terminal and the power supply connection;
a magnetic field sensor on the carrier in a vicinity of the current path, but outside the integrated circuit chip, for sensing a magnetic field generated by a current through the current path;
a test-accessible electronic interface to the magnetic field sensor, for testing presence of the current. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method of testing an integrated circuit assembly with an integrated circuit chip attached to a carrier with current paths for giving access to circuits in the integrated circuit chip, comprising measuring an electric voltage representative of a magnetic field generated by a power supply current on the interposer, wherein a sensor for the magnetic field is used that is integrated on the carrier, outside the integrated circuit.
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14. Carrier for mounting one or more integrated circuit chips, the carrier comprising
a current path; -
a connection point for electrically connecting a power supply connection of one of the one or more integrated circuits to the current path;
a magnetic field sensor on the carrier in a vicinity of the current path, for sensing a magnetic field generated by a current through the current path;
a readout connection coupled to the magnetic field sensor.
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Specification