Probe structure for testing semiconductor devices and method for fabricating the same
First Claim
1. A probe structure for testing semiconductor devices, said probe structure comprising:
- a base substrate;
a protrusion formed integrally with the base substrate, protruded from the upper surface of the base substrate at a designated angle, and extending along the upper surface of the base substrate;
probe beams branching off from the protrusion, positioned above the upper surface of the base substrate, and extending along the upper surface of the base substrate in a different direction from the direction of the extension of the protrusion; and
probe tips rested on the ends of the probe beams and protruded from the probe beam in a direction perpendicular to the the upper surface of the base substrate.
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Accused Products
Abstract
Disclosed are a probe structure for testing semiconductor devices and a method for fabricating the probe structure. The fabricated probe structure of the present invention satisfies the high density, the uniformity of size, height and spacing, and the integration of elements. The probe structure of the present invention solves the conventional problems such as long fabrication time of the probe structure, difficulty in finely controlling the structure of the probe structure, complexity of the whole process, mechanical instability of the products, and difficulty in uniformly assembling a plurality of the probe structures. Additionally, the probe structure of the present invention solves several problems caused in an actual testing step of the semiconductor devices, for instance, long testing time of the semiconductor device, difficulty in providing the sufficient contact force between the probe structure and the semiconductor device, and having to specially design the test pads of the semiconductor device.
21 Citations
9 Claims
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1. A probe structure for testing semiconductor devices, said probe structure comprising:
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a base substrate;
a protrusion formed integrally with the base substrate, protruded from the upper surface of the base substrate at a designated angle, and extending along the upper surface of the base substrate;
probe beams branching off from the protrusion, positioned above the upper surface of the base substrate, and extending along the upper surface of the base substrate in a different direction from the direction of the extension of the protrusion; and
probe tips rested on the ends of the probe beams and protruded from the probe beam in a direction perpendicular to the the upper surface of the base substrate. - View Dependent Claims (2, 3, 4)
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5. A method for fabricating a probe structure for testing semiconductor devices, said method comprising the steps of:
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forming a plurality of probe tips with pointed tip by patterning one surface of a bulk substrate at a designated depth; and
integrally forming a base substrate, a plurality of probe beams positioned above the base substrate, and a protrusion formed integrally with the probe beams by patterning both sides of the surface of the bulk substrate including probe tips. - View Dependent Claims (6, 7, 8, 9)
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Specification