Passive integrated transponder tag with unitary antenna core

• US 20020154065A1
• Filed: 02/04/2002
• Published: 10/24/2002
• Est. Priority Date: 01/11/2000
• Status: Active Grant

• Current Assignee: Destron Fearing Corporation (Merck & Co., Inc.)
• Original Assignee: Digital Angel Corporation
• Inventors: Mejia, Ezequiel, Casey, Sean
• Granted Patent: US 6,947,004 B2
• Time in Patent Office: Days
• US Class Current: 343/788
• CPC Class Codes: A01K 11/006 Automatic identification systems for animals, e.g. electronic devices, transponders for animals identification systems for access to feeding pens A01K1/0209; ear tags with electronic identification means A01K11/004
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/27 Adaptation for use in or on movable bodies H01Q1/08, H01Q1/12, H01Q1/18 take precedence
• CPC Class Codes: H01Q 1/40 Radiating elements coated with or embedded in protective material

Abstract

A passive integrated transponder (PIT) tag comprising an integrated circuit and a unitary core is described. The unitary core comprises a coil-forming portion proximate one end thereof and an integrated circuit support portion proximate an opposite end thereof. The integrated circuit support portion extends beneath and supports the integrated circuit.

Claims

1. A core for use in a passive integrated transponder tag, said core extending substantially the entire length of said transponder tag and comprising a coil receiving portion and a electronics support portion.

2. The unitary core of claim 1, wherein said electronics support portion is adapted to support an integrated circuit.

3. The core of claim 1, wherein said electronics support portion further comprises a metalization layer formed therein or thereon.

4. The core of claim 1, wherein said electronics support portion further comprises on or more metal pads formed therein or thereon.

5. The core of claim 1, further comprising an antenna coil wound about said coil receiving portion and electronically connected to a metalization layer or a metal pad formed on or in said electronics support portion.

6. The core of claim 5, further comprising an integrated circuit electrically connected to said antenna coil.

7. The core of claim 6, wherein said integrated circuit and antenna coil are each electrically connected to said metalization layer or metal pad.

8. The core of claim 5, wherein said integrated circuit is of the flip-chip technology.

9. The core of claim 8, wherein said electronics support portion further comprises a surface mounted capacitor thereon.

10. The core of claim 1, wherein said core is made of ferrite.

11. The core of claim 1, further comprising an encapsulation means enclosing said core.