×

Inverse resist coating process

  • US 20020155389A1
  • Filed: 10/09/2001
  • Published: 10/24/2002
  • Est. Priority Date: 10/24/2000
  • Status: Abandoned Application
First Claim
Patent Images

1. A method of processing a substrate, comprising the steps of:

  • forming a first coating comprising a resist material on a substrate surface;

    irradiating and developing the first coating to form a patterned first coating on the substrate surface;

    forming a second coating over the substrate surface;

    removing the patterned first coating while leaving the second coating to form a pattern on the substrate that is approximately the negative of the pattern formed by the first coating prior to its removal; and

    using the patterned second coating as a protective layer while subjecting the substrate to further processing.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×