Microneedle array module and method of fabricating the same
First Claim
1. A microneedle array module comprising:
- a substrate having front and back surfaces;
a multiplicity of microneedles affixed to and protruding outwardly from said front surface to form said array, each microneedle of said array having a hollow section which extends through its center to an opening in the tip thereof;
said substrate including an array of holes which align with the hollow sections of the microneedles and extend through the substrate to the back surface thereof, whereby a liquid applied to the back surface of said substrate may be forced through said holes in said substrate and out through the tips of the microneedle array thereof.
0 Assignments
0 Petitions
Accused Products
Abstract
A microneedle array module is disclosed comprising a multiplicity of microneedles affixed to and protruding outwardly from a front surface of a substrate to form the array, each microneedle of the array having a hollow section which extends through its center to an opening in the tip thereof. The substrate includes an array of holes which align with the hollow sections of the microneedles and extend through the substrate to a back surface thereof, whereby a liquid applied to the back surface of the substrate may be forced through the holes in the substrate and out through the tips of the microneedle array thereof. In one embodiment, the substrate includes a reservoir well in the back surface thereof. The well extends over the array of holes in the back surface and may be covered by a layer of material which is affixed to the back surface peripheral the well, the layer including an interconnecting passageway to the well.
A method of fabricating the microneedle array module is also disclosed comprising the steps of: providing etch resistant mask layers to one and another opposite surfaces of a substrate to predetermined thicknesses; patterning the etch resistant mask layer of the one surface for outer dimensions of the microneedles of the array; patterning the etch resistant mask layer of the other surface for inner dimensions of the microneedles of the array; etching unmasked portions of the substrate from one and the other surfaces to first and second predetermined depths, respectively; and removing the mask layers from the one and the other surfaces. One embodiment of the method includes the steps of: providing an etch resistant mask layer to the other surface of the substrate to a predetermined thickness; patterning the etch resistant mask layer of the other surface to define a reservoir region in the substrate; and etching away the unmasked reservoir region of the substrate to form a reservoir well in the other surface of the substrate. A layer of material may be provided to the other surface to enclose the reservoir well and a passageway is provided through the layer to the well region.
-
Citations
33 Claims
-
1. A microneedle array module comprising:
-
a substrate having front and back surfaces;
a multiplicity of microneedles affixed to and protruding outwardly from said front surface to form said array, each microneedle of said array having a hollow section which extends through its center to an opening in the tip thereof;
said substrate including an array of holes which align with the hollow sections of the microneedles and extend through the substrate to the back surface thereof, whereby a liquid applied to the back surface of said substrate may be forced through said holes in said substrate and out through the tips of the microneedle array thereof. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33)
-
-
14. A method of fabricating a microneedle array module comprising the steps of:
-
providing etch resistant mask layers to one and another opposite surfaces of a substrate to predetermined thicknesses;
patterning the etch resistant mask layer of the one surface for outer dimensions of the microneedles of said array;
patterning the etch resistant mask layer of the other surface for inner dimensions of the microneedles of said array;
etching unmasked portions of said substrate from one and the other surfaces to first and second predetermined depths, respectively; and
removing the mask layers from the one and the other surfaces.
-
Specification