Inter-dice wafer level signal transfer methods for integrated circuits

• US 20020157082A1
• Filed: 04/02/2002
• Published: 10/24/2002
• Est. Priority Date: 09/30/1997
• Status: Abandoned Application

• Current Assignee: Jeng-Jye Shau
• Original Assignee: Jeng-Jye Shau
• Inventors: Shau, Jeng-Jye
• Application Number:
  US10/115,836
• Publication Number:
  US 20020157082A1
• Time in Patent Office: Days
• US Class Current: 716/19
• CPC Class Codes: G01R 31/2856 Internal circuit aspects, e.g. built-in test features; Test chips; Measuring material aspects, e.g. electro migration [EM]
• CPC Class Codes: G01R 31/2884 using dedicated test connectors, test elements or test circuits on the IC under test G01R31/2855 takes precedence
• CPC Class Codes: G01R 31/318505 Test of Modular systems, e.g. Wafers, MCM's
• CPC Class Codes: G01R 31/318511 Wafer Test
• CPC Class Codes: H01L 22/32 Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors arrangements for conducting electric current to or from the solid state body in operation H01L23/48
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance

Abstract

The present invention discloses novel methods to transfer data between a plurality of integrated circuit dice on a semiconductor wafer. Each individual die contains internal circuits to control data transfer to nearby dice. Wafer level data transfer is achieved by a series of inter-dice data transfers. It is therefore possible to use a small number of small area metal lines to support wafer level parallel processing activities. External connections are provided by a small number of bonding pads on each wafer. The load on each external bounding pad is by far lower than that of prior art wafer level connections. These inter-dice data transfer mechanism also can be programmed to avoid defective circuitry. This invention has been used to support wafer level functional tests and wafer level burn-in tests. A Testing system of the present invention can test thousands of dice in parallel using simple testing equipment. Testing costs for integrated circuits are therefore reduced dramatically. The present application also makes it possible to build large area IC containing multiple dice. Extremely powerful products are realized using parallel processing capability of such multiple die integrated circuits.

Claims

1. A method of transferring input or output (I/O) signals to a plurality of integrated circuit dice on one or more semiconductor substrates, the method comprising the steps of:

forming inter-dice power supply conductive paths for connecting the power supply lines of nearby integrated circuit dice;

forming inter-dice ground conductive paths for connecting the ground lines of nearby integrated circuit dice;

forming one or more inter-dice signal conductive paths for connecting the I/O signals between nearby integrated circuit dice;

providing data transfer circuits for controlling the I/O procedures between nearby integrated circuit dice;

forming exposed conductive areas on said semiconductor substrates for connecting external I/O signals to the integrated circuits on said semiconductor substrates;

forming exposed conductive areas on said semiconductor substrates for connecting external power suppliers to the integrated circuits on said semiconductor substrates;

forming exposed conductive areas on said semiconductor substrates for connecting external ground lines to the integrated circuits on said semiconductor substrates;

wherein the I/O activities between external signals and said integrated circuit dice or the I/O activities between different integrated circuit dice are provided by a series of inter-dice data transfers between nearby dice.

2. A method as in claim 1, wherein said steps of forming inter-dice conductive paths comprise the steps of:

disconnecting separated sections of seal rings apart from other seal rings by separating the conductive walls between different sections of the seal rings;

disconnecting said separated sections of seal rings from semiconductor substrate by connecting the bottom layer conductors of said separated sections of seal rings to diffusion layers insulated from the semiconductor substrate; and

connecting said inter-dice conductive paths by connecting the I/O signals in individual dice through said separated sections of seal rings to the I/O signals of nearby dice.

3. A method as in claim 1, wherein said step of providing data transfer circuits for controlling the inter-dice I/O procedures comprises the steps of:

fabricating scan chain circuits in each die, said scan chain circuits contain a plurality of memory elements and control methods to shift the content of one memory element to the next memory element serially;

connecting the outputs of said scan chain circuits to the inputs of the scan chain circuits in one or more nearby dice; and

connecting the inputs of the scan chain circuits to the outputs of the scan chain circuits in one or more nearby dice.

4. A method as in claim 3, wherein said step of fabricating scan chain circuits in each die comprises the steps of:

providing control circuits allowing change in the number of memory elements connected to said scan chain circuits; and

providing a plurality of control signals to define the number of memory elements connected to said scan chain circuits.

5. A method as in claim 1, wherein said step of forming inter-dice signal conductive paths comprise the steps of:

forming a plurality of inter-dice signal conductive paths from each die to a plurality of nearby dice at different directions; and

defining the propagating directions of inter-dice data transfer by cutting a fraction of said conductive paths after fabrication procedures have been completed.

6. A method as in claim 5, wherein:

said steps of defining the directions of inter-dice data transfer paths are used to avoid defective integrated circuits.

7. A method as in claim 1, wherein said step of forming inter-dice signal conductive paths comprise the steps of:

forming a plurality of inter-dice signal conductive paths from each die to a plurality of nearby dice at different directions;

providing I/O control circuits for processing the I/O signals on said inter-dice signal conductive paths from each die to a plurality of nearby dice at different directions; and

programming said I/O control circuits to define the propagating directions of inter-dice data transfer paths.

8. A method as in claim 7, wherein:

said steps of programming the directions of inter-dice data transfer paths are used to avoid defective integrated circuits.

9. The inter-dice I/O signals of claim 1 comprise a plurality of signal pulses wherein:

the value of the datum represented by each signal pulse of said inter-dice I/O signals is determined by the amplitude of the pulse while the timing control information for each signal pulse is determined by the rising or falling edges of said signal pulse.

10. The inter-dice I/O signals of claim 1 comprise a plurality of signal pulses wherein:

the value of the datum represented by each signal pulse of said inter-dice I/O signals is determined by the width of the pulse while the timing control information for each signal pulse is determined by the rising or falling edges of said signal pulse.

11. The inter-dice I/O signals of claim 1 comprise a plurality of signal pulses wherein:

the value of the datum represented by each signal pulse of said inter-dice I/O signals is determined by the duty cycle of the pulse while the timing control information for each signal pulse is determined by the rising or falling edges of said signal pulse.

12. The inter-dice I/O signals of claim 1 comprise a plurality of signal pulses wherein:

the value of the datum represented by each signal pulse of said inter-dice I/O signals is determined by the rising time or falling time of the pulse while the timing control information for each signal pulse is determined by the rising or falling edges of said signal pulse.

14. The semiconductor wafer of claim 13 wherein:

each die further includes a high-voltage bonding pad and a low-voltage bonding pad interconnected by said inter-dice connection lines provided for electrically connecting to a high voltage input and a low input voltage input respectively.

15. The semiconductor wafer of claim 14 wherein:

each die further includes a data input bonding pad, a data output bonding pad, a clock input bonding pad and a clock output bonding pad interconnected by said inter-dice connection lines provided for electrically transmitting data and clock signals between said IC dice.

16. The semiconductor wafer of claim 15 wherein:

each of said segments of said seal ring comprising a metal wall and said metal wall is insulated from a substrate of said wafer.

17. The semiconductor wafer of claim 15 wherein:

each of said segments of said seal ring comprising a metal wall and said metal wall is insulated from a substrate of said wafer.

20. The semiconductor wafer of claim 19 further comprising:

a data transfer control circuit for controlling a signal input and a signal output between said nearby dice interconnected with said inter-dice signal conductive line.

21. The semiconductor wafer of claim 20 further comprising:

a first exposed conductive area for connecting to external input and output signal lines for transmitting I/O signals to said IC dice interconnected with said inter-dice signal conductive line.

22. The semiconductor wafer of claim 20 further comprising:

a second exposed conductive area for connecting to an external power line for providing a high voltage to said IC dice interconnected with said inter-dice signal conductive line.

23. The semiconductor wafer of claim 20 further comprising:

a third exposed conductive area for connecting to an external ground line for providing a low voltage to said IC dice interconnected with said inter-dice signal conductive line.

24. The semiconductor wafer of claim 19 wherein:

each of said dice further includes a segmented seal ring surrounding each of said dice comprising seal-ring segments insulated from a substrate of said semiconductor wafer wherein each of said inter-dice power supply line, inter-dice ground line and inter-dice signal conductive line connected to a seal-ring segment connected between nearby dice.

25. The semiconductor wafer of claim 20 wherein:

said data transfer control circuit further comprising a scan chain circuit having a plurality of shift registers for sequentially shifting a data from one shift register to a next shift register; and

each of said scan chain circuit further connected to said inter-dice signal conductive line for sequentially shifting said data of said shift registers between said dice.

26. The semiconductor wafer of claim 25 wherein:

said data transfer control circuit in each of said dice further comprising a control circuit for controlling said shift registers.

27. The semiconductor wafer of claim 20 wherein:

said data transfer control circuit in each of said dice further comprising an inter-dice signal propagation control circuit for controlling a signal transmission between said nearby dice via said inter-dice signal conductive line.

28. The semiconductor wafer of claim 27 wherein:

said inter-dice signal propagation control circuit in each of said dice further comprising an alternate signal propagation control means for controlling a signal transmission between alternate nearby dice via said inter-dice signal conductive line.

29. The semiconductor wafer of claim 27 wherein:

said alternate signal propagation control means in each of said dice further comprising a signal propagation selecting means for selecting a signal transmission between alternate nearby dice via said inter-dice signal conductive line.

30. The semiconductor wafer of claim 20 further comprising:

a first exposed conductive area for connecting to external input and output signal lines for transmitting I/O signals to said IC dice interconnected with said inter-dice signal conductive line; and

said data transfer control circuit further comprising an I/O signal sensing means for detecting an amplitude and a pulsing of said I/O signal.

31. The semiconductor wafer of claim 30 wherein:

said I/O signal sensing means further comprising a pulse-width sensing means for detecting width of a pulsing of said I/O signal.

32. The semiconductor wafer of claim 30 wherein:

said data transfer control circuit in each of said dice further comprising a signal datum means for generating a datum value corresponding to said width of a pulsing of said I/O signal.

33. The semiconductor wafer of claim 30 wherein:

said data transfer control circuit in each of said dice further comprising a signal transfer timing means for controlling a signal transfer timing corresponding to said pulsing of said I/O signal.

34. The semiconductor wafer of claim 30 wherein:

said data transfer control circuit in each of said dice further comprising a signal cycle-duty means for detecting a cycle duty of said I/O signal for generating a datum value corresponding to said cycle duty of said I/O signal.

35. The semiconductor wafer of claim 30 wherein:

said data transfer control circuit in each of said dice further comprising a pulse generating means for generating pulses and an inter-dice I/O signal control means generating a datum value corresponding to a pulsing of said pulses.

37. The semiconductor wafer of claim 36 further comprising:

a data transfer control circuit for controlling a signal input and a signal output between said nearby dice interconnected with said inter-dice signal conductive line.

39. The method of claim 38 further comprising:

b) forming a data transfer control circuit for controlling a signal input and a signal output between said nearby dice interconnected with said inter-dice signal conductive line.

13. A semiconductor wafer comprising:

a plurality of integrated circuit (IC) dice wherein each die includes a built-in self test circuit (BIST) for conducting a self test;

each die further includes a segmented seal ring surrounding said die having at least two segments separated by a narrow gap wherein each of said segments are in electric connection with an inter-dice bonding pad; and

an inter-dice connecting line interconnecting said segmented seal ring of a first IC die to a second IC die thus interconnecting said inter-dice bonding pad of said first IC die to said inter-dice bonding pad of said second IC die.

18. A semiconductor wafer comprising:

a plurality of integrated circuit (IC) dice;

an inter-dice power supply line connected between nearby dice;

an inter-dice ground line connected between nearby dice;

an inter-dice signal conductive line connected between nearby dice for transmitting signals between said nearby dice;

a data transfer control circuit for controlling a signal input and a signal output between said nearby dice interconnected with said inter-dice signal conductive line;

a first exposed conductive area for connecting to external input and output signal lines for transmitting I/O signals to said IC dice interconnected with said inter-dice signal conductive line;

a second exposed conductive area for connecting to an external power line for providing a high voltage to said IC dice interconnected with said inter-dice signal conductive line; and

a third exposed conductive area for connecting to an external ground line for providing a low voltage to said IC dice interconnected with said inter-dice signal conductive line.

19. A semiconductor wafer comprising:

a plurality of integrated circuit (IC) dice;

an inter-dice power supply line connected between nearby dice;

an inter-dice ground line connected between nearby dice; and

an inter-dice signal conductive line connected between nearby dice for transmitting signals between said nearby dice.

36. A semiconductor wafer comprising a plurality of integrated circuit (IC) dice further comprising:

an inter-dice conductive line connected directly between nearby dice for transmitting signals between said nearby dice.

38. A method of fabrication a semiconductor wafer having a plurality of integrated circuit (IC) dice comprising:

a) forming an inter-dice conductive line connected directly between nearby dice for transmitting signals between said nearby dice.

40. A method of manufacturing a semiconductor wafer comprising:

a) forming a plurality of integrated circuit (IC) dice on said wafer;

b) forming an inter-dice power supply line connected between nearby dice;

c) forming an inter-dice ground line connected between nearby dice; and

d) forming an inter-dice signal conductive line connected between nearby dice for transmitting signals between said nearby dice.

41. The method of claim 40 further comprising:

e) forming a data transfer control circuit for controlling a signal input and a signal output between said nearby dice interconnected with said inter-dice signal conductive line.

42. The method of claim 41 further comprising:

f) forming a first exposed conductive area for connecting to external input and output signal lines for transmitting I/O signals to said IC dice interconnected with said inter-dice signal conductive line.

43. The method of claim 41 further comprising:

g) forming a second exposed conductive area for connecting to an external power line for providing a high voltage to said IC dice interconnected with said inter-dice signal conductive line.

44. The method of claim 41 further comprising:

h) forming a third exposed conductive area for connecting to an external ground line for providing a low voltage to said IC dice interconnected with said inter-dice signal conductive line.

45. The method of claim 40 further comprising:

i) forming in each of said dice a segmented seal ring surrounding each of said dice with seal-ring segments insulated from a substrate of said semiconductor wafer wherein each of said inter-dice power supply line, inter-dice ground line and inter-dice signal conductive line are connected to a seal-ring segment connected between nearby dice.

46. The method of claim 41 wherein:

said step of forming a data transfer control circuit further comprising a step of forming a scan chain circuit having a plurality of shift registers for sequentially shifting a data from one shift register to a next shift register; and

connecting each of said scan chain circuit to said inter-dice signal conductive line for sequentially shifting said data of said shift registers between said dice.

47. The method of claim 46 wherein:

said step of forming said data transfer control circuit in each of said dice further comprising a step of forming a control circuit for controlling said shift registers.

48. The method of claim 41 wherein:

said step of forming a data transfer control circuit in each of said dice further comprising a step of forming an inter-dice signal propagation control circuit for controlling a signal transmission between said nearby dice via said inter-dice signal conductive line.

49. The method of claim 48 wherein:

said step of forming an inter-dice signal propagation control circuit in each of said dice further comprising a step of forming an alternate signal propagation control means for controlling a signal transmission between alternate nearby dice via said inter-dice signal conductive line.

50. The method of claim 48 wherein:

said step of forming an alternate signal propagation control means in each of said dice further comprising a step of forming a signal propagation selecting means for selecting a signal transmission between alternate nearby dice via said inter-dice signal conductive line.

51. The method of claim 41 further comprising:

j) forming a first exposed conductive area for connecting to external input and output signal lines for transmitting I/O signals to said IC dice interconnected with said inter-dice signal conductive line; and

k) forming an I/O signal sensing means in said data transfer control circuit further for detecting an amplitude and a pulsing of said I/O signal.

52. A method of testing a semiconductor wafer having a plurality of integrated circuit (IC) dice comprising:

a) forming an inter-dice conductive line connected directly between nearby dice for transmitting testing signals between said nearby dice.

53. The method of claim 52 further comprising:

b) forming a data transfer control circuit for controlling a testing signal input and a testing signal output between said nearby dice interconnected with said inter-dice signal conductive line.