Semiconductor light-emitting device and method for producing same
First Claim
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1. A semiconductor light-emitting device, comprising:
- a substrate;
a light-emitting layer provided above the substrate; and
a saturable absorbing layer provided above the substrate, the saturable absorbing layer having characteristics in which saturation of light absorption occurs, wherein;
the semiconductor light-emitting device has self-pulsation characteristics due to the saturable absorbing layer; and
the semiconductor light-emitting device is characterized in that the saturable absorbing layer is doped with carbon.
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Abstract
A semiconductor light-emitting device of the present invention includes: a substrate; a light-emitting layer provided above the substrate; and a saturable absorbing layer provided above the substrate, the saturable absorbing layer having characteristics in which saturation of light absorption occurs. The semiconductor light-emitting device has self-pulsation characteristics due to the saturable absorbing layer, and the semiconductor light-emitting device is characterized in that the saturable absorbing layer is doped with carbon.
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6 Claims
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1. A semiconductor light-emitting device, comprising:
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a substrate;
a light-emitting layer provided above the substrate; and
a saturable absorbing layer provided above the substrate, the saturable absorbing layer having characteristics in which saturation of light absorption occurs, wherein;
the semiconductor light-emitting device has self-pulsation characteristics due to the saturable absorbing layer; and
the semiconductor light-emitting device is characterized in that the saturable absorbing layer is doped with carbon. - View Dependent Claims (2, 3, 4)
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5. A method for producing a semiconductor light-emitting device, characterized by comprising the steps of:
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forming a first nitride semiconductor layer on a first conductive nitride semiconductor substrate at a first growth temperature;
sequentially forming above the first conductive nitride semiconductor layer a first conductive nitride semiconductor crack prevention layer at a second growth temperature differing from the first growth temperature, a first conductive nitride semiconductor cladding layer at the first growth temperature, and a first conductive nitride semiconductor guide layer at the first growth temperature;
forming a first conductive nitride semiconductor active layer on the first conductive nitride semiconductor guide layer at a third growth temperature differing from the second growth temperature;
sequentially forming above the first conductive nitride semiconductor active layer a second conductive nitride semiconductor barrier layer and a second conductive nitride semiconductor guide layer at the first growth temperature;
forming a saturable absorbing layer made of a nitride semiconductor on the second conductive nitride semiconductor guide layer at a fourth growth temperature differing from the third growth temperature;
sequentially forming above the saturable absorbing layer made of a nitride semiconductor a second conductive nitride semiconductor cladding layer and a second conductive nitride semiconductor contact layer at the first growth temperature; and
forming a ridge structure using a dry-etching treatment. - View Dependent Claims (6)
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Specification