Semiconductor device with a spiral inductor

• US 20020158306A1
• Filed: 12/26/2001
• Published: 10/31/2002
• Est. Priority Date: 12/26/2000
• Status: Abandoned Application

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Niitsu, Yoichiro
• Application Number:
  US10/036,314
• Publication Number:
  US 20020158306A1
• Time in Patent Office: Days
• US Class Current: 257/531
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H01F 27/34 Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
• CPC Class Codes: H01L 27/08 including only semiconductor components of a single kind
• CPC Class Codes: H01L 28/10 Inductors

Abstract

A first semiconductor device includes a first conductive layer, a second conductive layer located above or below the first conductive layer, and an insulating layer interposed between the first conductive layer and the second conductive layer, a spiral inductor having a spiral pattern that is formed in the first conductive layer, and an electromagnetic wave shield formed in a plane shape in the second conductive layer. The electromagnetic wave shield is grounded or connected to a constant voltage source and is located above or below the spiral inductor. Furthermore the first semiconductor device includes an opening formed in the electromagnetic wave shield. The opening is located in a region corresponding to a region above or below a central region of the spiral pattern of the spiral inductor. A second semiconductor device includes a first conductive layer, a second conductive layer located above or below the first conductive layer, an insulating layer interposed between the first conductive layer and the second conductive layer, a spiral inductor having a spiral pattern that is formed in the first conductive layer, and an electromagnetic wave shield formed in a plane shape in the second conductive layer. The electromagnetic wave shield is grounded or connected to a constant voltage source and is located above or below the spiral inductor. Furthermore the second semiconductor includes a slit formed in the electromagnetic wave shield. The slit extends from a position of the electromagnetic wave shield, the position corresponding to a region above or below a center of the spiral inductor, to a peripheral direction of the electromagnetic wave shield.

Claims

1. A semiconductor device, comprising:

a first conductive layer;

a second conductive layer located above or below the first conductive layer;

an insulating layer interposed between the first conductive layer and the second conductive layer;

a spiral inductor having a spiral pattern, the spiral pattern being formed in the first conductive layer;

a first electromagnetic wave shield formed in a plane shape in the second conductive layer, the first electromagnetic wave shield being grounded or connected to a constant voltage source and being located above or below the spiral inductor; and

an opening formed in the first electromagnetic wave shield, the opening being located in a region corresponding to a region above or below a central region of the spiral pattern of the spiral inductor.

2. The semiconductor device according to claim 1,

wherein the opening is located in a region having a magnetic flux generated by the spiral inductor passing therethrough.

3. The semiconductor device according to claim 1,

wherein the spiral pattern has a plurality of turns, and

the opening is formed in an inside of a region of the first electromagnetic wave shield, the region corresponding to the region above or below a region surrounded by a first turn in an innermost side among the plurality of turns.

4. The semiconductor device according to claim 3,

wherein the opening has an opening area of 50% to 90% of an area of the region surrounded by the first turn.

5. The semiconductor device according to claim 1,

wherein the second conductive layer is a conductive layer obtained by diffusing an impurity into an upper layer of a semiconductor substrate.

6. The semiconductor device according to claim 1, further comprising:

a slit formed in the first electromagnetic wave shield, the slit extending from the opening toward a peripheral portion of the electromagnetic wave shield.

7. The semiconductor device according to claim 1, further comprising:

a third conductive layer located to sandwich the first conductive layer with the second conductive layer;

another insulating layer interposed between the first conductive layer and the third conductive layer;

a second electromagnetic wave shield formed in the third conductive layer, the second electromagnetic wave shield being grounded or connected to the constant voltage source and being located above or below the spiral inductor; and

an opening formed in the second electromagnetic wave shield, the opening being located in the region corresponding to the region above or below the central region of the spiral pattern of the spiral inductor.

8. The semiconductor device according to claim 7,

wherein any one of the second conductive layer and the third conductive layer is a conductive layer obtained by diffusing an impurity into an upper layer of a semiconductor substrate.

9. The semiconductor device according to claim 7,

wherein at least one of the first electromagnetic wave shield and the second electromagnetic wave shield has a slit extending from any of the openings thereof to any of peripheral portions of the electromagnetic wave shields thereof.

10. The semiconductor device according to claim 1,

wherein the semiconductor device has at least one of an analog circuit and an RF circuit, and

the spiral inductor is formed in at least one of the analog circuit and the RF circuit.

11. The semiconductor device according to claim 10,

wherein the semiconductor device further comprises a digital circuit.

13. The semiconductor device according to claim 12,

wherein the slit is formed to cut off a current path winding around a magnetic flux generated in a center of the spiral pattern of the spiral inductor in which an electric currents flows.

14. The semiconductor device according to claim 12,

wherein the slit passes through the position of the first electromagnetic wave shield, the position corresponding to the region above or below the center of the spiral inductor, and divides the first electromagnetic wave shield.

15. The semiconductor device according to claim 12,

wherein the second conductive layer is a conductive layer obtained by diffusing an impurity into an upper layer of a semiconductor substrate.

16. The semiconductor device according to claim 12, further comprising:

a third conductive layer located to sandwich the first conductive layer with the second conductive layer;

another insulating layer interposed between the first conductive layer and the third conductive layer;

a second electromagnetic wave shield formed in the third conductive layer, the second electromagnetic wave shield being grounded or connected to the constant voltage source and being located above or below the spiral inductor; and

a slit formed in the second electromagnetic wave shield, the slit extending from a position of the second electromagnetic wave shield, the position corresponding to a region above or below a center of the spiral inductor, to a peripheral direction of the second electromagnetic wave shield.

17. The semiconductor device according to claim 16,

wherein any one of the first conductive layer and the third conductive layer is a conductive layer obtained by diffusing an impurity into an upper layer of a semiconductor substrate.

18. The semiconductor device according to claim 12,

wherein the semiconductor device has any one of an analog circuit and an RF circuit, and

the spiral inductor is formed in any one of the analog circuit and the RF circuit.

19. The semiconductor device according to claim 18,

wherein the semiconductor device further comprises a digital circuit.

12. A semiconductor device, comprising:

a first conductive layer;

a second conductive layer located above or below the first conductive layer;

an insulating layer interposed between the first conductive layer and the second conductive layer;

a spiral inductor having a spiral pattern, the spiral pattern being formed in the first conductive layer;

a first electromagnetic wave shield formed in a plane shape in the second conductive layer, the first electromagnetic wave shield being grounded or connected to a constant voltage source and being located above or below the spiral inductor; and

a slit formed in the first electromagnetic wave shield, the slit extending from a position of the first electromagnetic wave shield, the position corresponding to a region above or below a center of the spiral inductor, to a peripheral direction of the first electromagnetic wave shield.