Circuit board having a heating means and a hermetically sealed multi-chip package
First Claim
1. A multi-chip package comprising:
- a substrate having a first surface and a second surface;
a plurality of semiconductor chips electrically coupled to the substrate;
heat dissipation means that is thermally coupled to the first surface and the second surface of the substrate, the heat dissipation means forming a hermetic seal around the semiconductor chips and at least a portion of the substrate; and
a plurality of thermal interfaces disposed between the semiconductor chips and the heat dissipation means.
1 Assignment
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Accused Products
Abstract
A circuit board having heating elements and a hermetically sealed multi-chip package. The multi-chip package includes a plurality of semiconductor chips, a substrate electrically coupled to the plurality of semiconductor chips, heat dissipation means, and a plurality of thermal interfaces disposed between the semiconductor chips and the heat dissipation means. The heat dissipation means forms a hermetically sealed cavity that encloses the semiconductor chips and at least a portion of the substrate. The circuit board includes a chip mounting surface, a chip mounting area on the chip mounting surface, the chip mounting area including a plurality of lands, and heating elements connected to the lands, the heating elements capable heating a joint formed between the lands and electrode pads of a semiconductor chip.
95 Citations
18 Claims
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1. A multi-chip package comprising:
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a substrate having a first surface and a second surface;
a plurality of semiconductor chips electrically coupled to the substrate;
heat dissipation means that is thermally coupled to the first surface and the second surface of the substrate, the heat dissipation means forming a hermetic seal around the semiconductor chips and at least a portion of the substrate; and
a plurality of thermal interfaces disposed between the semiconductor chips and the heat dissipation means. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 14, 15, 16, 17, 18)
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13. A circuit board comprising:
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a chip mounting surface;
a chip mounting area on the chip mounting surface, the chip mounting area including a plurality of lands; and
heating elements, the heating elements capable heating joints formed between the lands and electrode pads of a semiconductor chip.
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Specification