Wiring board

• US 20020159243A1
• Filed: 06/28/2002
• Published: 10/31/2002
• Est. Priority Date: 12/12/2000
• Status: Active Grant

• Current Assignee: NGK Spark PLUG Company Limited
• Original Assignee: NGK Spark PLUG Company Limited
• Inventors: Sugimoto, Yasuhiro, Ogawa, Kouki
• Granted Patent: US 6,577,490 B2
• Time in Patent Office: Days
• US Class Current: 361/760
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/15192 Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/19106 in a mirrored arrangement on two different side of a common die mounting substrate
• CPC Class Codes: H05K 1/0231 Capacitors or dielectric substances
• CPC Class Codes: H05K 1/113 Via provided in pad; Pad over filled via
• CPC Class Codes: H05K 2201/10545 Related components mounted on both sides of the PCB
• CPC Class Codes: H05K 2201/10636 Leadless chip, e.g. chip capacitor or resistor
• CPC Class Codes: H05K 2201/10734 Ball grid array [BGA]; Bump grid array
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A wiring board simplifying connection of electronic parts mounted on a principal face side of the wiring board and chip capacitors mounted on a reverse face side thereof in such a manner that the wiring board 100 mounting the chip capacitors 160 on a reverse face 101c-side comprises bumps 129 capable of being connected to IC chip 10, first and second capacitor connecting pads 149p, 149g connecting the upper face parts 163 of the chip capacitors 160, a plurality of insulating layers 121, 111, 141 intervening the first and the second capacitor connecting pads, and first and second converting-conductor layers 146p, 146g in stripe pattern formed at interlayer 152, connected to the bumps 129 at the principal face 101b-side, connected to the first capacitor connecting pads 149p at the reverse face 101c-side or the second capacitor connecting pads 149g for changing the connecting positions or the connecting number between the principal face side and the reverse face side.

Claims

1. A wiring board having a principal face and a reverse face, which comprises:

i) a plurality of principal-face-side connecting terminals formed on the principal face side, wherein the principal-face-side connecting terminals are capable of being connected to terminals, respectively, of an electronic part to be mounted on the principal face side;

ii) at least one chip capacitor having a first electrode and a second electrode, wherein the chip capacitor is mounted on the reverse face side, and comprises;

a first face facing to the reverse face;

at least one first terminal that is formed on the first face and connected to the first electrode; and

at least one second terminal that is formed on the first face and connected to the second electrode;

iii) at least one first capacitor-connecting terminal formed on the reverse face side, wherein the first capacitor-connecting terminal is connected to the first terminal;

iv) at least one second capacitor-connecting terminal formed on the reverse face side, wherein the second capacitor-connecting terminal is connected to the second terminal;

v) a plurality of insulating layers interposed between the principal-face-side connecting terminals, and the at least one first capacitor-connecting terminal and the at least one second capacitor-connecting terminal disposed on the reverse side;

vi) at least one first converting-conductor layer formed at an interlayer between adjacent two insulating layers, wherein the first converting-conductor layer is electrically connected to a plurality of the principal-face-side connecting terminals at the principal face side, is electrically connected to at least one of the first capacitor-connecting terminals at the reverse face side, and converts a connecting position and a connecting number between the principal face side and the reverse face side; and

vii) at least one second converting-conductor layer formed at the interlayer, wherein the second converting-conductor layer is insulated from the first converting-conductor layer, is electrically connected to a plurality of the principal-face-side connecting terminals at the principal face side, is electrically connected to at least one of the second capacitor-connecting terminals at the reverse face side, and converts a connecting position and a connecting number between the principal face side and the reverse face side.

2. The wiring board according to claim 1, wherein the interlayer is an interlayer nearest to the at least one first capacitor-connecting terminal and the at least one second capacitor-connecting terminal, and the number of the principal-face-side connecting terminals electrically connected to one of the first converting-conductor layer and the second converting-conductor layer is more than the sum of:

the number of the first capacitor-connecting terminal electrically connected to the first converting-conductor layer; and

the number of the second capacitor-connecting terminal electrically connected to the second converting-conductor layer.

3. The wiring board according to claim 1, wherein the first capacitor-connecting terminal electrically connected to the first converting-conductor layer at the reverse face side is positioned at least partly within a region formed by projecting the first converting-conductor layer in the direction of the first face,

the first capacitor-connecting terminal and the first converting-conductor layer are connected through a via-conductor penetrating through the insulating layers,

the second capacitor-connecting terminal electrically connected to the second converting-conductor layer from the reverse face side is positioned at least partly within a region formed by projecting the second converting-conductor layer in the direction of the first face, and

the second capacitor-connecting terminal and the second converting-conductor layer are connected through a via-conductor penetrating through the insulating layers.

4. The wiring board according to claim 2, wherein the first capacitor-connecting terminal electrically connected to the first converting-conductor layer from the reverse face side is positioned at least partly within a region formed by projecting the first converting-conductor layer in the direction of the first face,

the first capacitor-connecting terminal and the first converting-conductor layer are connected through a via-conductor penetrating through the insulating layers,

the second capacitor-connecting terminal electrically connected to the second converting-conductor layer from the reverse face side is positioned at least partly within a region formed by projecting the second converting-conductor layer in the direction of the first face, and

the second capacitor-connecting terminal and the second converting-conductor layer are connected through a via-conductor penetraing through the insulating layers.

7. The wiring board according to claim 1, wherein the first converting-conductor layer and the second converting-conductor layer are alternately arranged so as to form a stripe pattern.

9. The wiring board according to claim 7, wherein, in the stripe pattern, the current flowing of the first converting-conductor layer is opposite to the current flowing of the second converting-conductor layer in the direction at the time that the chip capacitor charges or discharges.

11. The wiring board according to claim 1, wherein layer of the first electrode and layers of the second electrode are alternately laminated parallel to the first face, via a high dielectric ceramic layer.

13. The wiring board according to claim 1, further comprising a cavity surrounding portion which is located nearer the reverse face than the insulating layer and which constitutes a wall face of a cavity opened onto the reverse face side, wherein:

the first and second capacitor-connecting terminals are formed on a bottom face of the cavity; and

the chip capacitor is mounted in the cavity so that the bottom face of the cavity is facing to the first face of the chip capacitor.

15. The wiring board according to claim 13, further comprising a core substrate comprising a first core part located on the principal face side, and a second core part located nearer the reverse face than the first core part, wherein:

the first core part is contained in the insulating layer, and the second core part is contained in the cavity surrounding portion;

the insulating layer includes the first core part located on the most-reverse face side and at least one insulating resin layer laminated nearer the principal face than the first core part; and

the cavity surrounding portion includes the second core part, and either no reverse face side insulating layer or reverse face side insulating layers provided on the reverse face side of the second core part so that a number of the reverse face side insulating layers is smaller than a number of the insulating resin layers.

16. The wiring board according to claim 14, further comprising a core substrate comprising a first core part located on the principal face side, and a second core part located nearer the reverse face than the first core part, wherein:

the first core part is contained in the insulating layer, and the second core part is contained in the cavity surrounding portion;

the insulating layer includes the first core part located on the most-reverse face side and at least one insulating resin layer laminated nearer the principal face than the first core part; and

the cavity surrounding portion includes the second core part, and either no reverse face side insulating layer or reverse face side insulating layers provided on the reverse face side of the second core part so that a number of the reverse face side insulating layers is smaller than a number of the insulating resin layers.

5. A wiring board having a principal face and a reverse face, which comprises:

i) a plurality of principal-face-side connecting terminals formed on the principal face side, wherein the principal-face-side connecting terminals are capable of being connected to terminals, respectively, of an electronic part to be mounted on the principal face side;

ii) at least one chip capacitor having a first electrode and a second electrode, wherein the chip capacitor is mounted on the reverse face side, and comprises;

a first face facing to the reverse face;

at least one first terminal that is formed on the first face and connected to the first electrode; and

at least one second terminal that is formed on the first face and connected to the second electrode;

iii) a plurality of insulating layers interposed between the principal-face-side connecting terminals, and the at least one first terminal and the at least one second terminal, the insulating layers comprising a most-reverse face side insulating layer that is a layer nearest to the reverse face;

iv) at least one first converting-conductor layer formed on a surface of the most-reverse face side insulating layer, the surface facing to the reverse face, wherein the first converting-conductor layer is electrically connected to a plurality of the principal-face-side connecting terminals at the principal face side, is connected or is electrically connected through a conductive connecting material to at least one of the first terminals at the reverse face side, and converts a connecting position and a connecting number between the principal face side and the reverse face side; and

v) at least one second converting-conductor layer formed on the surface, wherein the second converting-conductor layer is insulated from the first converting-conductor layer, is electrically connected to a plurality of the principal-face-side connecting terminals at the principal face side, is connected or is electrically connected through a conductive connecting material to at least one of the second terminals at the reverse face side, and converts a connecting position and a connecting number between the principal face side and the reverse face side.

6. The wiring board according to claim 5, wherein the number of the principal-face-side connecting terminals electrically connected to one of the first converting-conductor layer and the second converting-conductor layer is more than the sum of:

the number of the first terminal electrically connected to the first converting-conductor layer; and

the number of the second terminal electrically connected to the second converting-conductor layer.

8. The wiring board according to claim 5, wherein the first converting-conductor layer and the second converting-conductor layer are alternately arranged so as to form a stripe pattern.

10. The wiring board according to claim 8, wherein, in the stripe pattern, the current flowing of the first converting-conductor layer is opposite to the current flowing of the second converting-conductor layer in the direction at the time that the chip capacitor charges or discharges.

12. The wiring board according to claim 5, wherein layer of the first electrode and layers of the second electrode are alternately laminated parallel to the first face, via a high dielectric ceramic layer.

14. The wiring board according to claim 5, further comprising a cavity surrounding portion which is located nearer the reverse face than the insulating layer and which constitutes a wall face of a cavity opened onto the reverse face side, wherein:

the first and second capacitor-connecting terminals are formed on a bottom face of the cavity; and

the chip capacitor is mounted in the cavity so that the bottom face of the cavity is facing to the first face of the chip capacitor.