High performance thermoelectric systems

• US 20020162339A1
• Filed: 05/06/2002
• Published: 11/07/2002
• Est. Priority Date: 05/04/2001
• Status: Abandoned Application

• Current Assignee: Howard R. Harrison, Jeffrey Russell Brown
• Original Assignee: Howard R. Harrison, Jeffrey Russell Brown
• Inventors: Harrison, Howard R., Brown, Jeffrey Russell
• Application Number:
  US10/138,310
• Publication Number:
  US 20020162339A1
• Time in Patent Office: Days
• US Class Current: 62/3.7
• CPC Class Codes: B67D 1/0869 using solid state elements, e.g. Peltier cells
• CPC Class Codes: F25B 21/02 using Peltier effect; using Nernst-Ettinghausen effect
• CPC Class Codes: F25B 2400/24 Storage receiver heat
• CPC Class Codes: F25D 16/00 Devices using a combination of a cooling mode associated with refrigerating machinery with a cooling mode not associated with refrigerating machinery
• CPC Class Codes: F25D 2331/803 Bottles
• CPC Class Codes: F25D 2400/28 Quick cooling
• CPC Class Codes: F25D 31/002 Liquid coolers, e.g. beverage cooler receptacle coolers F25D31/006
• CPC Class Codes: F25D 31/007 Bottles or cans
• CPC Class Codes: H10N 10/13 characterised by the heat-exchanging means at the junction

Abstract

A high performance thermoelectric system is taught which is capable of rapidly cooling a thermal load with a thermoelectric module. A thermal ballast is in simultaneous thermal communication with both the thermoelectric module and the thermal load, and compensates for the difference between the characteristics of the thermoelectric module and the demands of the thermal load, allowing a thermoelectric module to handle significantly larger thermal loads than would normally be possible, albeit for a reduced period of time. Also taught is a means to implement a demand cooler for drinking water. Also taught is a means to implement a high performance cooler for removable fluid containers, adaptable to the rapid cooling of wine bottles and the like.

Claims

1. A high performance thermoelectric system comprising:

a. A thermoelectric module,

b. A heat sink,

c. A thermal ballast,

d. A thermal load, and

e. A thermal conduit.

Said thermoelectric module, said thermal ballast, and said thermal load being in simultaneous thermal communication through said thermal conduit, said thermal ballast configured to rapidly absorb heat from said load through said thermal conduit, said thermoelectric module configured to simultaneously pump additional heat from said thermal load through said thermal conduit, said thermoelectric module further configured to pump said heat from said thermal ballast through said thermal conduit at a slower rate over time, said thermoelectric module in thermal communication with said heat sink to disperse said heat and said additional heat into the ambient air.

2. The high performance thermoelectric system as claimed in claim 1 wherein said thermal conduit may be extended around a cavity to form a fluid reservoir.

3. The high performance thermoelectric system as claimed in claim 1 further comprising a thermally conductive spacer block between said thermal conduit and said thermoelectric module, said spacer block extending through said thermal ballast to be in direct thermal communication with said thermal conduit.

4. The high performance thermoelectric system as claimed in claim 1 wherein said thermal ballast may be a Phase Change Material with a characteristic freezing point slightly below the desired temperature of said thermal load.

5. The high performance thermoelectric system as claimed in claim 1 wherein said thermal ballast may be a Phase Change Material in liquid or powder format, said Phase Change Material in liquid or powder format being further contained in a confined space in thermal communication with said thermal conduit through a thermal interface, said confined space being configured to position any air gaps that might form due to the settling of, downward flow of, or volumetric changes in said Phase Change Material in liquid or powder format away from said thermal interface.

6. The high performance thermoelectric system as claimed in claim 1 wherein said thermal conduit has thermally conductive protrusions extending into said thermal ballast.

7. The high performance thermoelectric system as claimed in claim 1 further comprising a second thermal ballast in thermal communication with said heat sink through a second thermal conduit.

8. The high performance thermoelectric system as claimed in claim 1 further comprising an auxiliary spacer block, an auxiliary heat sink, an auxiliary fan, and an auxiliary thermal load, wherein said auxiliary spacer is in thermal communication with said thermal conduit, said auxiliary heat sink is in thermal communication with said auxiliary spacer block, and wherein said auxiliary fan is adapted to control the flow of heat from said auxiliary load to said auxiliary heat sink.

9. A flow through demand cooler for fluids comprising:

a. A thermoelectric module,

b. A heat sink,

c. A thermal ballast,

d. A fluid heat exchanger, and

e. A thermal conduit.

Said thermoelectric module, said thermal ballast, and said fluid heat exchanger being in simultaneous thermal communication through said thermal conduit, said thermal ballast configured to rapidly absorb heat from said fluid heat exchanger through said thermal conduit, said thermoelectric module configured to simultaneously pump additional heat from said fluid heat exchanger through said thermal conduit, said thermoelectric module further configured to pump said heat from said thermal ballast through said thermal conduit at a slower rate over time, said thermoelectric module in thermal communication with said heat sink to disperse said heat and said additional heat into the ambient air.

10. The flow through demand cooler for fluids as claimed in claim 9 wherein said fluid heat exchanger may also be said thermal conduit.

11. The flow through demand cooler for fluids as claimed in claim 9 further comprising a thermally conductive spacer block between said thermal conduit and said thermoelectric module, said spacer block extending through said thermal ballast to be in direct thermal communication with said thermal conduit.

12. The flow through demand cooler for fluids as claimed in claim 9 wherein said thermal ballast may be a Phase Change Material with a characteristic freezing point slightly below the desired temperature of the fluid within said fluid heat exchanger.

13. The flow through demand cooler for fluids as claimed in claim 9 wherein said thermal ballast may be a Phase Change Material in liquid or powder format, said Phase Change Material in liquid or powder format being further contained in a confined space in thermal communication with said thermal conduit through a thermal interface, said confined space being configured to position any air gaps that might form due to the settling of, downward flow of, or volumetric changes in said Phase Change Material in liquid or powder format away from said thermal interface.

14. The flow through demand cooler for fluids as claimed in claim 9 wherein said thermal conduit has thermally conductive protrusions extending into said thermal ballast.

15. The flow through demand cooler for fluids as claimed in claim 9 further comprising a second thermal ballast in thermal communication with said heat sink through a second thermal conduit.

16. The flow through demand cooler for fluids as claimed in claim 9 wherein said fluid heat exchanger is comprised of a cavity with vertical or longitudinal partitions, and wherein the fluid within said fluid heat exchanger must travel around said vertical or longitudinal partitions in a zigzag pattern.

17. The flow through demand cooler for fluids as claimed in claim 9 wherein said fluid heat exchanger is comprised of an extruded cavity with sliding longitudinal partitions, said sliding longitudinal partitions inserted into pre-formed slots within said extruded cavity, said sliding longitudinal partitions held in place with a bonding agent, said longitudinal partitions also held in place by the crimped sides of said pre-formed slots, and wherein the fluid within said fluid heat exchanger must travel around said sliding longitudinal partitions in a zigzag pattern.

18. The flow through demand cooler for fluids as claimed in claim 9 further comprising an auxiliary spacer block, an auxiliary heat sink, an auxiliary fan, and an auxiliary thermal load, wherein said auxiliary spacer block is in thermal communication with said fluid heat exchanger, said auxiliary heat sink is in thermal communication with said auxiliary spacer block, and wherein said auxiliary fan is adapted to control the flow of heat from said auxiliary load to said auxiliary heat sink.

20. The high performance cooler for removable fluid containers as claimed in claim 19 wherein said thermal conduit may be in intimate thermal contact with said removable fluid container, and wherein said thermal conduit may form a support for said removable fluid container.

21. The high performance cooler for removable fluid containers as claimed in claim 19 further comprising a thermally conductive spacer block between said thermal conduit and said thermoelectric module, said spacer block extending through said thermal ballast to be in direct thermal communication with said thermal conduit.

22. The high performance cooler for removable fluid containers as claimed in claim 19 wherein said thermal ballast may be a Phase Change Material with a characteristic freezing point slightly below the desired temperature of fluid within said removable fluid container.

23. The high performance cooler for removable fluid containers as claimed in claim 19 wherein said thermal ballast may be a Phase Change Material in liquid or powder format, said Phase Change Material in liquid or powder format being further contained in a confined space in thermal communication with said thermal conduit through a thermal interface, said confined space being configured to position any air gaps that might form due to the settling of, downward flow of, or volumetric changes in said Phase Change Material in liquid or powder format away from said thermal interface.

24. The high performance cooler for removable fluid containers as claimed in claim 19 wherein said thermal conduit has thermally conductive protrusions extending into said thermal ballast.

25. The high performance cooler for removable fluid containers as claimed in claim 19 further comprising a second thermal ballast in thermal communication with said heat sink through a second thermal conduit.

26. The high performance cooler for removable fluid containers as claimed in claim 19 wherein said removable fluid container further contains a fluid and a wine bottle, said wine bottle being immersed in said fluid, said wine bottle in thermal communication with said fluid, and said fluid in thermal communication with said thermal conduit through said removable fluid container.

19. A high performance cooler for removable fluid containers comprising;

a. A thermoelectric module,

b. A heat sink,

c. A thermal ballast,

d. A removable fluid container, and

e. A thermal conduit.

Said thermoelectric module, said thermal ballast, and said removable fluid container being in simultaneous thermal communication through said thermal conduit, said thermal ballast configured to rapidly absorb heat from said removable fluid container through said thermal conduit, said thermoelectric module configured to simultaneously pump additional heat from said removable fluid container through said thermal conduit, said thermoelectric module further configured to pump said heat from said thermal ballast through said thermal conduit at a slower rate over time, said thermoelectric module in thermal communication with said heat sink to disperse said heat and said additional heat into the ambient air.