Contact / noncontact type data carrier module

• US 20020162894A1
• Filed: 10/23/2001
• Published: 11/07/2002
• Est. Priority Date: 10/24/2000
• Status: Active Grant

• Current Assignee: Dai Nippon Printing Company Limited
• Original Assignee: Dai Nippon Printing Company Limited
• Inventors: Kuramochi, Satoru
• Granted Patent: US 6,634,564 B2
• Time in Patent Office: Days
• US Class Current: 235/492
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07756 the connection being non-galvanic, e.g. capacitive
• CPC Class Codes: G06K 19/07769 the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
• CPC Class Codes: G06K 7/10178 including auxiliary means for focusing, repeating or boosting the electromagnetic interrogation field comparable booster antennas integrated on the record carrier itself G06K19/07794
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/4813 Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48228 the bond pad being disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/49109 outside the semiconductor or solid-state body
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/14 Integrated circuits

Abstract

The present invention provides a contact/noncontact type data carrier module applicable to a wide variety of purposes, and capable of satisfactorily meeting conditions on security. The contact/noncontact type data carrier module includes a base member; a semiconductor chip mounted on the base member; a coil connected to the semiconductor chip adapted to be electromagnetically coupled with an external booster antenna for noncontact communication; and contact terminals connected to the semiconductor chip and adapted to be brought into contact with external contacts.

Claims

1. A contact/noncontact type data carrier module comprising:

a base member;

a semiconductor chip mounted on the base member;

a coil connected to the semiconductor chip adapted to be electromagnetically coupled with an external booster antenna for noncontact communication; and

a contact terminal connected to the semiconductor chip and adapted to be brought into contact with an external contact.

2. The contact/noncontact type data carrier module according to claim 1, wherein the semiconductor chip is disposed on a first major surface of the base member such that its terminal surface provided with terminals faces out;

the contact terminal is formed on a second major surface on the opposite side of the first major surface of the base member; and

the semiconductor chip and the contact terminals are connected through a contact terminal connecting hole formed in the base member by a contact terminal connecting part.

3. The contact/noncontact type data carrier module according to claim 2, wherein the contact terminal connecting part includes a bonding wire connecting a terminal of the semiconductor chip and the contact terminal.

4. The contact/noncontact type data carrier module according to claim 2, wherein the contact terminal connecting part includes a connecting wiring part formed on the first major surface of the base member, a bonding wire connecting a terminal of the semiconductor chip and the connecting wiring part, and a via part formed in the contact terminal connecting hole of the base member and connecting the connecting wiring part and the contact terminal.

5. The contact/noncontact type data carrier module according to claim 2, wherein the coil is formed on the terminal surface of the semiconductor chip;

and the coil and the semiconductor chip are connected by a coil connecting part.

6. The contact/noncontact type data carrier module according to claim 5, wherein the coil connecting part includes a bonding wire connecting a terminal of the semiconductor chip and a terminal of the coil.

7. The contact/noncontact type data carrier module according to claim 2, wherein the coil is formed on the first major surface of the base member;

and the semiconductor chip and the coil are connected by a coil connecting part.

8. The contact/noncontact type data carrier module according to claim 7, wherein the coil connecting part includes a bonding wire connecting a terminal of the semiconductor chip and a terminal of the coil.

9. The contact/noncontact type data carrier module according to claim 7, wherein the coil is disposed near the semiconductor chip on the first major surface of the base member.

10. The contact/noncontact type data carrier module according to claim 1, wherein the semiconductor chip is disposed on a first major surface of the base member such that its terminal surface provided with terminals faces the base member;

the contact terminal is formed on a second major surface on the opposite side of the first major surface of the base member; and

the semiconductor chip and the contact terminals are connected through a contact terminal connecting hole formed in the base member by a contact terminal connecting part.

11. The contact/noncontact type data carrier module according to claim 10, wherein the contact terminal connecting part includes a connecting wiring part formed on the first major surface of the base member, and a via part formed in the contact terminal connecting hole and connecting the connecting wiring part and the contact terminal;

and a terminal of the semiconductor chip is connected to the connecting wiring part by flip-chip solder bonding.

12. The contact/noncontact type data carrier module according to claim 10, wherein the coil is formed on the terminal surface of the semiconductor chip;

and the coil and the semiconductor chip are connected by a coil connecting part.

13. The contact/noncontact type data carrier module according to claim 12, wherein the coil is formed on an insulting layer covering a wiring layer formed on the terminal surface of the semiconductor chip;

the wiring layer is connected to a terminal of the semiconductor chip; and

the coil connecting part includes the wiring layer, and a via part formed in the insulating layer and connecting the wiring layer and the terminal of the coil.

14. The contact/noncontact type data carrier module according to claim 10, wherein the coil is formed on the first major surface of the base member;

and the semiconductor chip and the coil are connected by a coil connecting part through a pair of coil connecting holes formed in the base member.

15. The contact/noncontact type data carrier module according to claim 14, wherein the coil connecting part includes a connecting wiring part formed on the second major surface of the base member, a connecting terminal formed on the first major surface of the base member, and a pair of via parts respectively formed in the pair of coil connecting holes of the base member and respectively connecting one terminal of the coil and the connecting wiring part, and the connecting wiring part and the connecting terminal;

and terminals of the semiconductor chip are connected to the connecting terminal, connected to one terminal of the coil, and the other terminal of the coil by flip-chip solder bonding.

16. The contact/noncontact type data carrier module according to claim 1, further comprising a sealing resin layer sealing the semiconductor chip, the coil and the wiring part therein.

17. The contact/noncontact type data carrier module according to claim 1, wherein the data carrier module is used as a SIM for use in combination with a booster card.

18. The contact/noncontact type data carrier module according to claim 1, wherein the data carrier module is used as a SIM for use in combination with a portable telephone.

19. The contact/noncontact type data carrier module according to claim 1, wherein the semiconductor chip is provided with a user authentication circuit for authenticating a user, and a noncontact type communication circuit for downloading various pieces of information through the Internet by using a communication device adapted to be connected to the Internet.