Light emitting device

• US 20020163302A1
• Filed: 04/08/2002
• Published: 11/07/2002
• Est. Priority Date: 04/09/2001
• Status: Active Grant

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation), Toyoda Gosei Company Limited (Toyota Motor Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation), Toyoda Gosei Company Limited (Toyota Motor Corporation)
• Inventors: Uemura, Toshiya, Ota, Koichi, Takahashi, Nozomu, Kitajima, Tomokazu, Oshio, Hiroaki, Shimomura, Kenji, Nitta, Koichi, Takahashi, Yuji
• Granted Patent: US 7,176,623 B2
• Time in Patent Office: Days
• US Class Current: 313/512
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/32257 the layer connector connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12032 Schottky diode
• CPC Class Codes: H01L 33/501 characterised by the materials, e.g. binder
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin

Abstract

A light emitting device, free from change of color even when the wavelength of a light emitting element shifts, includes a light emitting element (106) for emitting primary light having an intensity peak at a wavelength shorter than 400 nm; a silicone resin (111) provided to embed the light emitting element; and a fluorescent element (110) contained in the silicone resin to absorb the primary light and release visible light.

Claims

1. A light emitting device comprising:

a light emitting element which emits primary light;

a silicone resin provided to embed said light emitting element and having a hardness in the range of 50 to 90 in JISA value; and

a fluorescent element contained in said silicone resin to absorb said primary light and release visible light.

2. A light emitting device according to claim 1, wherein said primary light emitted from said light emitting element has an intensity peak at a wavelength shorter than 400 nm.

3. A light emitting device according to claim 1, wherein said fluorescent element includes a first fluorescent material which absorbs said primary light and releases first visible light, and a second fluorescent material which absorbs said primary light and releases second visible light different in wavelength from said first visible light.

4. A light emitting device according to claim 3, wherein said first visible light and said second visible light are chromatically complementary.

5. A light emitting device according to claim 1, wherein said fluorescent element includes a first fluorescent material which absorbs said primary light and releases red light, a second fluorescent material which absorbs said primary light and releases green light, and a third fluorescent material which absorbs said primary light and releases blue light, said fluorescent element providing white light by mixture of said red light, green light and blue light.

6. A light emitting device according to claim 1 further comprising a wire connected to said light emitting element,

said silicone resin being provided to embed said wire.

7. A light emitting device according to claim 1 further comprising a resin portion having an opening,

said light emitting element being disposed at a bottom of said opening, and

said silicone resin being provided to fill said opening.