Method of manufacturing printed circuit board

• US 20020164836A1
• Filed: 05/07/2001
• Published: 11/07/2002
• Est. Priority Date: 05/07/2001
• Status: Abandoned Application

• Current Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.), ASE Material Inc. (ASE Technology Holding Co., Ltd.)
• Original Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Inventors: Ho, Sheng-Chun
• Application Number:
  US09/849,247
• Publication Number:
  US 20020164836A1
• Time in Patent Office: Days
• US Class Current: 438/106
• CPC Class Codes: H05K 2203/025 Abrading, e.g. grinding or sand blasting
• CPC Class Codes: H05K 2203/0796 Oxidant in aqueous solution, e.g. permanganate
• CPC Class Codes: H05K 2203/095 Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
• CPC Class Codes: H05K 3/0023 by exposure and development of a photosensitive insulating layer
• CPC Class Codes: H05K 3/0055 After-treatment, e.g. cleaning or desmearing of holes
• CPC Class Codes: H05K 3/28 Applying non-metallic protective coatings H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/381 by special treatment of the substrate

Abstract

A method of manufacturing a printed circuit board comprising the steps of: providing a substrate in which conductor circuits have been formed; forming a solder resist layer on the surface of the substrate; pre-curing the solder resist; imaging and developing the solder resist layer so as to form a desired solder resist pattern wherein a solder resist scum is remained on the substrate; post-curing the solder resist; and removing the solder resist scum. The solder resist scum removing step may be conducted by a permanganate desmearing process, a dichromate desmearing process, a plasma desmearing process, or a sand blasting process. The present invention further provides a method of improving the adhesion between a molding compound and a circuitized substrate with a solder resist layer formed thereon. The adhesion improving method mainly comprises roughening the solder resist layer on the circuitized substrate by a permanganate desmearing process, a dichromate desmearing process, a plasma desmearing process, a sand blasting process, or by a scrubbing process.

Claims

1. A method of improving the adhesion between a molding compound and a circuitized substrate with a solder resist layer formed thereon, the circuitized substrate being adapted for packaging a semiconductor device, the semiconductor device being encapsulated against the substrate in the molding compound, the method comprises roughening the solder resist layer formed on the circuitized substrate.

2. The method as claimed in claim 1, wherein the step of roughening the solder resist layer is conducted by a permanganate desmearing process.

3. The method as claimed in claim 2, wherein the permanganate desmearing process involves three different solution treatments including a solvent swell solution, a alkaline permanganate solution, and a neutralization solution, used sequentially.

4. The method as claimed in claim 3, wherein the solvent swell solution comprises a diethylene glycol monobutyl ether.

5. The method as claimed in claim 3, wherein the neutralization solution comprises inorganic acidic solutions.

6. The method as claimed in claim 1, wherein the step of roughening the solder resist layer is conducted by a dichromate desmearing process.

7. The method as claimed in claim 6, wherein the dichromate desmearing process involve three different solution treatments including a solvent swell solution, an alkaline dichromate solution, and a neutralization solution, used sequentially.

8. The method as claimed in claim 7, wherein the solvent swell solution comprises a diethylene glycol monobutyl ether.

9. The method as claimed in claim 7, wherein the neutralization solution comprises inorganic acidic solutions.

10. The method as claimed in claim 1, wherein the step of roughening the solder resist layer is conducted by a plasma desmearing process.

11. The method as claimed in claim 1, wherein the step of roughening the solder resist layer is conducted by a sand blasting process.

12. The method as claimed in claim 1, wherein the step of roughening the solder resist layer is conducted by a scrubbing process.

14. The method as claimed in claim 13, wherein the step of removing the solder resist scum is conducted by a permanganate desmearing process.

15. The method as claimed in claim 14, wherein the permanganate desmearing process involves three different solution treatments including a solvent swell solution, a alkaline permanganate solution, and a neutralization solution, used sequentially.

16. The method as claimed in claim 15, wherein the solvent swell solution comprises a diethylene glycol monobutyl ether.

17. The method as claimed in claim 15, wherein the neutralization solution comprises inorganic acidic solutions.

18. The method as claimed in claim 13, wherein the step of removing the solder resist scum is conducted by a dichromate desmearing process.

19. The method as claimed in claim 18, wherein the dichromate desmearing process involve three different solution treatments including a solvent swell solution, an alkaline dichromate solution, and a neutralization solution, used sequentially.

20. The method as claimed in claim 19, wherein the solvent swell solution comprises a diethylene glycol monobutyl ether.

21. The method as claimed in claim 19, wherein the neutralization solution comprises inorganic acidic solutions.

22. The method as claimed in claim 13, wherein the step of removing the solder resist scum is conducted by a plasma desmearing process.

23. The method as claimed in claim 13, wherein the step of removing the solder resist scum is conducted by a sand blasting process.

13. A method of manufacturing a printed circuit board comprising the steps of:

providing a substrate in which conductor circuits have been formed;

forming a solder resist layer on the surface of the substrate;

pre-curing the solder resist;

imaging and developing the solder resist layer so as to form a desired solder resist pattern wherein a solder resist scum is remained on the substrate;

post-curing the solder resist; and

removing the solder resist scum.