Method of manufacturing printed circuit board
First Claim
1. A method of improving the adhesion between a molding compound and a circuitized substrate with a solder resist layer formed thereon, the circuitized substrate being adapted for packaging a semiconductor device, the semiconductor device being encapsulated against the substrate in the molding compound, the method comprises roughening the solder resist layer formed on the circuitized substrate.
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Accused Products
Abstract
A method of manufacturing a printed circuit board comprising the steps of: providing a substrate in which conductor circuits have been formed; forming a solder resist layer on the surface of the substrate; pre-curing the solder resist; imaging and developing the solder resist layer so as to form a desired solder resist pattern wherein a solder resist scum is remained on the substrate; post-curing the solder resist; and removing the solder resist scum. The solder resist scum removing step may be conducted by a permanganate desmearing process, a dichromate desmearing process, a plasma desmearing process, or a sand blasting process. The present invention further provides a method of improving the adhesion between a molding compound and a circuitized substrate with a solder resist layer formed thereon. The adhesion improving method mainly comprises roughening the solder resist layer on the circuitized substrate by a permanganate desmearing process, a dichromate desmearing process, a plasma desmearing process, a sand blasting process, or by a scrubbing process.
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Citations
23 Claims
- 1. A method of improving the adhesion between a molding compound and a circuitized substrate with a solder resist layer formed thereon, the circuitized substrate being adapted for packaging a semiconductor device, the semiconductor device being encapsulated against the substrate in the molding compound, the method comprises roughening the solder resist layer formed on the circuitized substrate.
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13. A method of manufacturing a printed circuit board comprising the steps of:
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providing a substrate in which conductor circuits have been formed;
forming a solder resist layer on the surface of the substrate;
pre-curing the solder resist;
imaging and developing the solder resist layer so as to form a desired solder resist pattern wherein a solder resist scum is remained on the substrate;
post-curing the solder resist; and
removing the solder resist scum.
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Specification