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Method of manufacturing printed circuit board

  • US 20020164836A1
  • Filed: 05/07/2001
  • Published: 11/07/2002
  • Est. Priority Date: 05/07/2001
  • Status: Abandoned Application
First Claim
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1. A method of improving the adhesion between a molding compound and a circuitized substrate with a solder resist layer formed thereon, the circuitized substrate being adapted for packaging a semiconductor device, the semiconductor device being encapsulated against the substrate in the molding compound, the method comprises roughening the solder resist layer formed on the circuitized substrate.

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