Polishing apparatus
First Claim
1. A polishing apparatus with a polishing table having a polishing surface and a top ring for pressing a workpiece to be polished at a predetermined pressure with interposing said workpiece between said polishing table and said top ring to polish said workpiece, said polishing apparatus comprising:
- at least two dressing units for dressing said polishing surface by being brought into contact with a surface of a polishing cloth.
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Accused Products
Abstract
The present invention relates to a polishing apparatus for polishing a workpiece to be polished, such as a semiconductor wafer, to a flat mirror finish. The polishing apparatus comprises a polishing table having a polishing surface, and a top ring, and the workpiece to be polished is interposed between the polishing table and the top ring and pressed at a predetermined pressure to polish the workpiece. The polishing apparatus comprises at least two dressing units for dressing the polishing surface by being brought into contact with a surface of a polishing cloth.
44 Citations
16 Claims
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1. A polishing apparatus with a polishing table having a polishing surface and a top ring for pressing a workpiece to be polished at a predetermined pressure with interposing said workpiece between said polishing table and said top ring to polish said workpiece, said polishing apparatus comprising:
at least two dressing units for dressing said polishing surface by being brought into contact with a surface of a polishing cloth. - View Dependent Claims (2, 3)
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4. A dressing method for dressing a polishing cloth provided in a polishing apparatus, wherein:
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initially conditioning said polishing cloth before use in the polishing, by a dressing unit comprising a diamond dresser or an SiC dresser; and
conditioning said polishing cloth between processes of polishing said workpiece to be polished, by a dressing unit comprising a brush dresser.
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5. A dressing method for dressing a polishing cloth provided in a polishing apparatus, wherein:
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initially conditioning said polishing cloth before use in the polishing, by a dressing unit comprising a diamond dresser or an SiC dresser; and
between processes of polishing said workpiece to be polished, firstly conditioning said polishing cloth by a dressing unit comprising a diamond dresser or an SiC dresser, and then conditioning said polishing cloth by a dressing unit comprising a brush dresser.
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6. A dressing method for dressing during polishing of a workpiece to be polished in a polishing apparatus, wherein:
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dressing is performed while swinging a dressing unit comprising a dresser having a diameter smaller than said workpiece to be polished; and
after a top ring is withdrawn, dressing is performed by a dressing unit comprising a dresser having a diameter larger than said workpiece to be polished.
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7. A polishing apparatus with a polishing table having a polishing surface and a top ring for pressing a workpiece against said polishing surface of said polishing table to polish said workpiece, said polishing apparatus comprising:
a dresser for dressing said polishing surface of said polishing table is further provided, said dresser dressing an area of said polishing surface used for polishing a predetermined position of a surface, to be polished, of said workpiece in accordance with a film thickness to be polished in said predetermined position of said surface to be polished. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14, 15)
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16. A polishing apparatus with a polishing table having a polishing surface and a top ring for pressing a workpiece against said polishing surface of said polishing table to polish said workpiece, said polishing apparatus comprising:
a dressing unit integrally having a first dresser for dressing said polishing surface of said polishing table during polishing of said workpiece to be polished, and a second dresser for dressing said polishing surface of said polishing table when said workpiece to be polished is not polished.
Specification