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Solid state imaging device, method of manufacturing the same, and solid state imaging system

  • US 20020167030A1
  • Filed: 06/21/2002
  • Published: 11/14/2002
  • Est. Priority Date: 12/01/1999
  • Status: Active Grant
First Claim
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1. A solid state imaging device comprising:

  • a photo diode formed in a second semiconductor layer of opposite conductivity type in a first semiconductor layer of one conductivity type; and

    a light signal detecting insulated gate field effect transistor formed in a fourth semiconductor layer of opposite conductivity type in a third semiconductor layer of one conductivity type adjacently to the photo diode;

    wherein a portion of the photo diode comprises an impurity region of one conductivity type on a surface layer of the second semiconductor layer, and a portion of the insulated gate field effect transistor comprises a source region and a drain region of one conductivity type on a surface layer of the fourth semiconductor layer, a channel region between the source region and the drain region, a high concentration buried layer of opposite conductivity type in a neighborhood of the source region in the fourth semiconductor layer under the channel region, and a gate electrode formed over the channel region via a gate insulating film, the impurity region is connected to the drain region, the first semiconductor layer is connected to the third semiconductor layer, and the second semiconductor layer is connected to the fourth semiconductor layer, and a portion of the first semiconductor layer under the second semiconductor layer is thicker than a portion of the third semiconductor layer under the fourth semiconductor layer in a depth direction.

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